GIGABYTE
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Professional's Top Choice!
GIGABYTE Ultra Durable™ 3 Motherboard
GIGABYTE's innovation again leads the motherboard industry with the introduction of the revolutionary Ultra Durable 3 technology. With 2 ounces of copper for each of the Power and Ground layers, Ultra Durable 3 is able to deliver dramatically lower system temperature, improved energy efficiency and enhanced stability for overclocking.
Intel Platform
AMD Platform

 
Intel Platform
GA-EX58-UD4P
Intel X58 Chipset
GA-EX58-UD4P
 
 
Editor's recommendation
PC Gamer / Taiwan / 2009.May.
"Ultra Durable 3 Design • It's even more stable after overclocking • Support CROSS FIRE+SLI"
 
     
 
Gold Award 2008
XtremeHardware / Italy / 2009.Apr.
"technology UD3 the same of the EXTREME. * All capacitors are solid Japanese capacitors. NB and DIMM slots have the extra power a 2-stage PWM. * Wide Variety of Voltages and Frequence in the BIOS and built-in buttons for Power / Reset / Clear CMOS. * Excellent performance for DDR3 memory and support for SLI / CFX * Power Phases 6+6 DES and phases PWM, PWM VRD11.1 latest Intel spec."
 
     
 
Recommended Award
Overclock3D / U.K. / 2009.Apr.
"Recommended Award"
 
   
 
Hardware Award
NAG / SOUTH AFRICA / 2009.Apr.
"If you are looking for an affordable way to upgrade to i7 platform without paying a fortune, the UD4P is likely the board for you.Overall, UD4P is a solid MB that can not really be faulted on anything."
 
   
 
Editor's Recommend
COMmart / Thailand / 2009.Apr.
"Product design is easy to use.Good OC ability.BIOS set up easily"
 
   
 
BEST BUY 2008
Weekly ASCII / Japan / 2009.Apr.
"2 OZ copper PCB design.Easy Tune 6 OC ability improve.Good price for X58 MB"
 
   
 
Highly recommend
PC Home Advance / Taiwan / 2009.Mar.
"Ultra Durable 3 design; built in ULTRA TPM function; has the C/P value."
 
   
 
2008 Buyer's recommed
Computer DIY / Taiwan / 2009.Feb.
"Supports TPM; BIOS is more superior; price is more friendly compared to EX58-UD5, Extreme."
 
   
 
2008 Buyer's recommed
Computer DIY / Taiwan / 2009.Jan
"Supports Ultra TPM; UD3; BIOS option is more user-friendly"
 
   
 
WEEKLY RECOMMEND 2008
CPU / HONG KONG / 2009.Jan.
"Regardless that the thermal heatsink has been simplified, or that the Gigabit LAN design has changed from the high-end model, the rest of the motherboard and main components remain the same, which highlights a potential higher price–to–performance ratio, so it's absolutely worth considering."
 
   
 
EDITOR'S CHOICE Silver Award 2008
CPU / HONG KONG / 2009.Jan.
"Regardless that the thermal heatsink has been simplified, or that the Gigabit LAN design has changed from the high-end model, the rest of the motherboard and main components remain the same, which highlights a potential higher price–to–performance ratio, so it's absolutely worth considering."
 
     
 
Recommended
HKEPC / HONG KONG / 2008. Dec
"Supports many different features; supports 3-Way SLI and 3-Way CrossFireX VGA capabilities; builds an outstanding 3D platform for power users. Using Ultra Durable 3 Technology and 6 phase power supply switch design, makes the motherboard a more durable and power efficient platform. It's absolutely worth considering for PC gamers. Supports Ultra TPM security function, to ensure the user's data is securely protected."
 
   
 

Price tipp

Chip / Germany / 2009.Apr.
"Price tipp"
 
   
 
Energy Tipp
Chip / Germany / 2009.Apr.
"Energy Tipp"
 
   
 
Excellent Award
Hardwareluxx / Germany / 2009.Apr.
"Excellent Award"
 
   
 
Chip Tip Econo
Chip / Poland / 2009.Mar.
"Chip Tip Econo"
 
     
 
Recommend_
Silver Award 2008
PC Market / HONG KONG / 2008.Dec.
"Built in Infineon TPM module, provides reliable 2,048 bit encryption key"
 
     
 
Best Buy
Weekly ASCII / Japan / 2009.Feb.
"supports SLI at affordable price;2 oz PCB;good OC tool"
 
   
 
Safe Buy
Tweak / Denmark / 2009.Mar.
"Good price • Surprisingly good for overclocking • Good layout, all the plugs out to the edge"
 
     
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