Unique Screen Cooling thermal design effectively reduces the temperature around the CPU zone and removes the heat between NB and SB area.
Liquid Cooling system featuring special waterblock design with an enlarged dissipating surface area for enhanced heat dissipation and optimum flow-rate.
High-Precision die forming technology utilized to increase the thermal conductivity of the material that makes up the heat sink.
High performance Copper Heat Pipe with sintered
process designed for ultra efficient thermal conductivity.
External Heat Sink design utilizing a convection slot at
the back of the chassis to increase thermal dissipation.
All intellectual property rights, including without limitation to copyright and trademark of this work and its derivative works are the property of, or are licensed to,
GIGABYTE TECHNOLOGY CO., LTD. Any unauthorized use is strictly prohibited.