Z790 EAGLE (rev. 1.0)

Shielded Memory Routing
All memory routing is under the PCB inner layer shielded by a large ground layer to protect from external interference.

Impedance Optimized Topology
By optimizing memory trace width, length and style from HPC simulation to actual implementation, overall impedance is lowered between CPU memory controller and memory modules to achieve higher DDR5 speed.

Low Signal Loss PCB
Server grade mid-loss or low-loss PCB material is chosen to lower signal loss inside PCB and maintain DDR5 high speed signal transmission.

Secure Mode
Motherboard provides fixed 5V to Native DDR5 memory and built-in PMIC outputs locked 1.1v to memory IC.

• • Unlocks Native DDR5 PMIC secure mode into programmable mode and controls Native DDR5 voltage with wide range.
• • Supports all PMIC vendors for maximum compatibility
* Memory overclocking capability will vary based on users' hardware configuration

Accelerate instantly
Boost memory performance instantly.

Automate input
No need to manually configure multiple memory parameters like clock, voltage, and timings.

Streamline overclocking
Easily overclock Native and XMP 3.0 DDR5 memory to higher frequencies.

Integrate database
Built-in database of pre-tuned profiles for different memory IC vendors.

• SPD Re-defined or retrieve from database
  Users can define two empty SPD profiles and transfer them to another computer.


• Performance Simulation
  Simulate memory performance quickly by inputting clock and timing parameters.


• Save/Load Profile
  Save and load memory profiles for online sharing.


• Boost non-overclockable DDR5 memory frequency
  Increase the frequency of non-overclockable DDR5 memory.


• One-click Clear Profile
  Reset memory settings conveniently.

3X Large Surface
Increased surface area up to 3X larger compared to traditional heatsinks. It improves heat dissipation from the MOSFETs.

Real One-piece Build
TMOS is a TRUE single piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance against competitors' multi-piece design.