Carte Mère AMD® X570S GAMING X avec VRM Numérique Twin 12+2 Phases et DrMOS 50A, Conception Thermique avec Couverture Totale, Triple NVMe Ultra-Rapide PCIe 4.0/3.0 x4 M.2 avec Thermal Guard, LAN 2.5GbE, 2x USB 3.2 Type-C®, USB 3.2 Type-C® Avant & Arrière, RGB FUSION 2.0, Q-Flash Plus

  • Compatible Processeurs AMD Ryzen™ 5000 Series / Ryzen 5000 G-Series / Ryzen™ 4000 G Series/ Ryzen™ 3000 Series/ Ryzen™ 3000 G Series/ Ryzen™ 2000 Series/ Ryzen™ 2000 G Series
  • Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs
  • Solution VRM Numérique Twin 12+2 phases avec DrMOS 50A
  • Conception Thermique avec Couverture Totale et Dissipateurs MOSFET à Large Couverture
  • Triple NVMe ultra-rapide PCIe 4.0/3.0 x4 M.2 avec Thermal Guards
  • LAN 2.5GbE avec Gestion de la Bande Passante
  • USB3.2 Type-C® avant & arrière pour Connections Rapides et Polyvalentes
  • Condensateurs Audio de Haute Qualité et Dispositif Anti-bruit pour une Qualité Audio Optimale
  • Smart Fan 6 avec Multiple Capteurs de Température, Connecteurs Hybrides avec FAN STOP
  • RGB FUSION 2.0 avec LED Adressables Multi-Zone, Compatible LED Adressables LED & Bandes LED RGB
  • Q-Flash Plus : Mise à jour du BIOS sans Installer de Processeur, de Mémoire ou de Carte Graphique
OVERVIEW
PERFORMANCE
THERMAL
CONNECTIVITY
PERSONALIZATION
ULTRA DURABLE
OVERVIEW
PERFORMANCE
THERMAL
CONNECTIVITY
PERSONALIZATION
ULTRA DURABLE
1
HDMI
2
Q-FLASH Plus Button
3
Rear USB 3.2 Gen2 Type-C®
4
2.5G GbE LAN
5
Advanced Thermal Design
  1. Fully Covered Thermal Design with High Coverage MOSFET Heatsinks
  2. 5 W/mK Thermal Conductivity Pad
  3. Integrated IO Shield
6
Audio Solutions
  1. 8-ch HD Audio
  2. Audio Noise Guard
  3. High-End Audio Capacitor
7
RGB FUSION 2.0
  1. Addressable LED Header*2
  2. RGB LED Header*3
8
8 Solid pin CPU Power Connector
9
Twin 12+2 Phase Digital Power Design
  1. 50A DrMOS
  2. Premium Choke and Capacitor
  3. 6 layer PCB
  4. PCIe 4.0 Ready PCB
  5. 2X Copper PCB
10
Supports AMD Ryzen™ Series Processors
11
24 pin ATX Power Connector
12
Dual Channel DDR4, 4 DIMMs
13
Front USB3.2 Type-C® for Connecting devices
14
M.2 Connectors
  1. PCIe 4.0/3.0 x4 NVMe support
  2. 1* M.2 Thermal Guard II
  3. 1* M.2 Thermal Guard
*Click here to view AM4 Overclocking Guidance
PERFORMANCE
Twin Power Design
XMP 5100+
PCIe 4.0 Design
3X PCIe 4.0/3.0 x4 M2
To unleash the full potential of the latest AMD Ryzen™ 5000 series processors, the motherboard requires the best CPU power, memory and IO design. With the best quality components and GIGABYTE R&D design capability, X570S GAMING X is a true beast among motherboards.
Twin and Digital Power for CPU Vcore

Digital Power for CPU SOC

GIGABYTE X570S Motherboards are equipped with best in class power solution to release the full potential of the latest AMD Ryzen™ 5000 Series CPUs. The VRM power design includes MOSFETs which Vcore accompanied by digital PWM, premium chokes and high quality capacitors to offer extraordinary stability and precision to the high performance CPU. In addition, Six-layered PCB and comprehensive thermal solution allows enthusiasts to enjoy the extreme overclocking performance without compromise. 
1. 3 x PCIe 4.0 M.2 Slot
M.2 PCIe 4.0 x4 slot with lower impedance.
2. 1 x PCIe 4.0 Slot
Reinforced PCIe 4.0 x 16.
3. PCIe 4.0 Ready PCB
Low signal Loss PCB.
Triple PCIe 4.0/3.0 x4 M.2 Connectors with Thermal Guard
GIGABYTE Gaming Motherboards are focused on delivering M.2 technology to enthusiasts who want to maximize their Systems' potential.
THERMAL
Thermal Design
Fully Covered
MOSFET Heatsink
M.2 Thermal Guard
Smart Fan 6
1. Fully Covered Thermal Design
High coverage MOSFET and integrated molding Heatsinks to improve thermal efficiency with better airflow and heat exchange.
2. 5 W/mK Thermal Pad
By using 1.5mm thicker 5 W/mK thermal conductivity pads, it can transfer 2.7x more heat compared to traditional thermal pads in the same time.
3. 1X M.2 Thermal Guard II
Enlarged double-sided M.2 heatsink prevents high-speed, large capacity PCIe 4.0/3.0 SSDs with double side flash from throttling due to overheating.
4. 1X M.2 Thermal Guard
Built-in M.2 heatsinks prevent high-speed, large capacity PCIe 4.0/3.0 SSDs from throttling due to overheating.
1. 2X Large Surface
Increased surface area up to 2X larger compared to traditional heatsinks. It improves heat dissipation from the MOSFETs.
2. Real One-piece Build
TMOS is a TRUE single piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance against competitors’ multi-piece design.
3. Multi-Cut Design
TMOS features several channels and inlets on the heatsink. This design allows for the air flow to go through which leads to a great improvement of the heat transfer performance.
AORUS M.2 Thermal Guard II
With durability in mind, GIGABYTE provides a new thermal solution for large capacity M.2 SSD devices with double side flash. The M.2 Thermal Guard II uses a double-sided heatsink design and prevents throttling and bottlenecks on high speed M.2 SSDs by dissipating heat before it becomes an issue.
Thermal Throttling As Temperature Rises
CONNECTIVITY
2.5GbE LAN
Rear and Front USB3.2
Type-C® Support
HDMI
Hi-Fi Audio
A high-end product needs to be future-proof so your system stays up-to-date with the latest technology.  X570S GAMING X provides all next generation network, storage, and connectivity to keep you up to speed.
First adopter on 2.5gbe LAN onboard

2X Faster than ever
  1. Adoption of 2.5G LAN provide up to 2.5 GbE network connectivity, with at least 2 times faster transfer speeds compared to general 1GbE networking, perfectly designed for gamers with ultimate online gaming experience.

  2. Support Multi-Gig(10/100/1000/2500Mbps) RJ-45 Ethernet


Including both front and rear USB Type-C® connectors with fast USB 3.2 Gen 2 for transmission speeds of up to 10 Gbps.
With twice the bandwidth compared to its previous generation as well as backwards compatibility with USB 2.0 and USB 3.2 Gen1 , the much improved USB 3.2 Gen2 protocol is available over the new reversible USB Type-C® and the traditional USB Type-A connector for better compatibility over a wider range of devices.
HDMI 2.1 for 4K / 60P / 21:9 / HDCP 2.3 Support
HDMI 2.1, which is backwards compatible with HDMI 2.0/ 1.4 and offering 48 Gb/s of bandwidth – twice times more than previous generation. This unlocks the potential for users to transfer multiple video streams, as well as a native cinematic 21:9 ratio (which most movies are shot in), Full HDR and HDCP 2.3 support, to offer the best visual experience for viewers.
Note: Only AMD Ryzen™ 4000 G series/ 3000 G series/ 2000 G series APUs are capable for display function support.
High-End Audio Capacitors
GIGABYTE motherboards use high-end audio capacitors. These high quality capacitors help deliver high resolution and high fidelity audio to provide the most realistic sound effects for gamers.
Audio Noise Guard
GIGABYTE motherboards feature an audio noise guard that essentially separates the board’s sensitive analog audio components from potential noise pollution at the PCB level.
PERSONALIZATION
RGB FUSION
BIOS
EASY TUNE
System Information Viewer
BIOS
New User Interface
All new EASY MODE shows important hardware information in one page including CPU clock, Memory, Storage, Fan.
My Favorites
Add constantly used items into the favorite menu for quick access.
Storage Information
Show all kinds of storage information including SATA, PCIE and M.2 interface.
Changelog
List all changes before saving and exiting bios. Quickly review overall settings modification.
Intuitive Load Line Curve
Clearly show each loadline calibration setting in an intuitive curve graph.
EasyTune™
GIGABYTE's EasyTune™ is a simple and easy-to-use interface that allows users to fine-tune their system settings or adjust system and memory clocks and voltages in a Windows environment. With Smart Quick Boost, one click is all it takes to automatically overclock your system, giving an added performance boost when you need it the most.

System Information Viewer
GIGABYTE System Information Viewer is a central location that gives you access to your current system status. Monitor components such as the clocks and processor, set your preferred fan speed profile, create alerts when temperatures get too high or record your system's behavior; these are the possibilities of the System Information Viewer.

ULTRA DURABLE
Q-Flash Plus
PCIe Armor
Double Locking Bracket
Solid Pin
GIGABYTE is reputable for its product durability and high quality manufacturing process. Needless to say, we use the best components we can find for the X570S GAMING motherboard and reinforce every slot to make each of them solid and durable.
Ultra Durable™ PCIe Armor
Industry Leading Ultra Durable™ PCIe Armor
The innovative one piece stainless steel shielding design from GIGABYTE reinforces the PCIe connectors to provide the extra strength required to support heavy graphics cards.
GIGABYTE Patented Double Locking Bracket
Solid Pin Power Connectors
X570S motherboards feature solid plated ATX 12V 8pin power connectors for offering stable power supply while CPU overloading.
Solid Pin Power connector advantages
  1. Larger contact area for electricity
  2. More metal quantity to sustain higher power and generated heat
  3. Ultra durable and longer lifespan

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