H273-Z80- LAW1

Rev. 3.x Rev. 1.x

High Density Server - AMD EPYC™ 9005/9004 - 2U 4-Node DP 24-Bay Gen4 NVMe/SATA/SAS 3000W DLC

# HPC # HCI

Direct liquid cooling solution
2U 4-node rear access server system
Dual AMD EPYC™ 9005/9004 Series Processors per node
12-Channel DDR5 RDIMM, 24 x DIMMs per node
Dual ROM Architecture
8 x 1Gb/s LAN ports via Intel^® I350-AM2
24 x 2.5" Gen4 NVMe/SATA/SAS hot-swap bays
4 x M.2 slots with PCIe Gen4 x4 interface (optional)
4 x LP PCIe Gen5 x16 slots
4 x OCP NIC 3.0 PCIe Gen5 x16 slots
Dual 3000W 80 PLUS Titanium redundant power supply

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* Todos os materiais disponíveis são para simples referência. A GIGABYTE reserva o direito de modificar ou revisar o conteúdo a qualquer momento sem aviso prévio.
* Todas as marcas e logotipos são de propriedade de suas respectivas proprietárias.
* Devido a arquitetura padrão PC, uma quantia de memória é reservada para uso do sistema, portanto o tamanho da memória é menor do que a quantia exibida.

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Rear access
440 x 87.5 x 877

Motherboard

MZ83-HD0

CPU

AMD EPYC™ 9005 Series Processors
AMD EPYC™ 9004 Series Processors

Dual processor per node, cTDP up to 400W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

8 x LGA 6096
Socket SP5

Chipset

System on Chip

Memory

96 x DIMM slots
DDR5 memory supported
12-Channel memory architecture

AMD EPYC™ 9005:
RDIMM: Up to 6000 MT/s

AMD EPYC™ 9004:
RDIMM: Up to 4800 MT/s

LAN

Rear:
8 x 1Gb/s LAN (4 x Intel^® I350-AM2)
- Support NCSI function

4 x 10/100/1000 Mbps Management LAN

^[Note]Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.

Video

Integrated in Aspeed^® AST2600 x 4
- 4 x Mini-DP

Storage

Front hot-swap:
24 x 2.5" Gen4 NVMe/SATA/SAS^[1]
- (NVMe from CPU_1)
- (SATA from CPU_0)

Optional internal M.2 (CMTP192):
4 x M.2 (2280/22110), PCIe Gen4 x4, from CPU_0

^[1]SAS card is required to support SAS drives.

SAS

Require SAS add-in cards

RAID

Require RAID add-in cards

PCIe Expansion Slots

Riser Card CRSH01R x 4:
- 4 x LP x16 (Gen5 x16), from CPU_0

4 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Support NCSI function

Front I/O

4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button

Rear I/O

8 x USB 3.2 Gen1 ports (Type-A)
4 x Mini-DP
8 x RJ45 ports
4 x MLAN ports
4 x System status LEDs

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

Security Modules

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

Dual 3000W 80 PLUS Titanium redundant power supply^[1]

AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 16A

DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A

^[1]The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 Baseboard Management Controller
Aspeed^® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

Additional certifications:
Windows Server 2022

System Fans

4 x 80x80x38mm (18,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

^[Note]If the room's relative humidity exceeds 60%, the inlet water temperature must be set between 40°C and 45°C to avoid condensation and ensure the system continues to operate optimally.

Weight

Net Weight: 48.9 kg
Gross Weight: 51.2 kg

Packaging Dimensions

w/ cold plate loops: 1185 x 705 x 409 mm
w/o cold plate loops: 1176 x 709 x 322 mm

Packaging Content

1 x H273-Z80-LAW1
4 x CoolIT CPU cold plate loops
1 x Mini-DP to D-Sub cable
1 x 3-Section Rail kit

Part Numbers

- Barebone w/ cold plates: 6NH273Z80DR000LCW1*
- Barebone w/o cold plates: 6NH273Z80DZ000LCW1*
- Motherboard: 9MZ83HD0UR-000-3*
- 3-Section Rail kit: 25HB2-A66125-K0R
- CoolIT CPU cold plate loop: 25ST7-20000C-C4R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH7O1: 9CBPH7O1NR-00*
- Fan module: 25ST2-88382P-S1R
- Riser card - CRSH01R: 9CRSH01RNR-00*
- I/O board (incl. LAN chip) - CLBH160: 9CLBH160NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-230009-L0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 expansion card - CMTP192: 9CMTP192NR-00*
- GIGABYTE CPU cold plate loop: 25H27-3Z80000-E06X (QPA:4)
- GIGABYTE 2U4N manifold: 25H27-3Z80000-E07X (1 set per rack)
- Motivair CPU cold plate loop: 25ST7-20000K-M4R (QPA:4)
- CoolIT leak sensor board: 6NH273Z80S1000LAN11 (QPA: 4)
- RMA packaging: 6NH273Z80SR-RMA-L100

SUPPORT

Downloads

Driver
BIOS
Utilidade
Firmware

Manual
Lista de Suporte

Online Support

Driver

BIOS

Utilidade

Firmware

QVL

All
All
Windows Server 2022
Windows Server 2019
Linux

Chipset

Versão

Tamanho

Data

Chipset driver for AMD EPYC 9005/9004 series processors

Version : 6.10.07.747

2.82 MB

Oct 29, 2024

H273-Z80- LAW1 .svg-ArrowDownSolid-color { fill: #707070 }

SPECIFICATIONS

SUPPORT

RESOURCES

H273-Z80-LAW1 (Rev. 3.x)

H273-Z80- LAW1