H223-Z10-AAP1

2U 3-Node - Front access
447.8 x 87.5 x 500

MZ13-HD0

AMD EPYC™ 9005 Series Processors
AMD EPYC™ 9004 Series Processors

Single processor per node, cTDP up to 240W
- At ambient 30°C, cTDP up to 300W

^[Note] cTDP supported up to 400W under limited thermal conditions. Please contact our sales representatives for more details.

3 x LGA 6096
Socket SP5

System on Chip

36 x DIMM slots
DDR5 memory supported
12-Channel memory architecture

AMD EPYC™ 9005:
RDIMM: Up to 6000 MT/s

AMD EPYC™ 9004:
RDIMM: Up to 4800 MT/s

Front:
2 x Chassis Management LAN

Integrated in Aspeed^® AST2600 x 3
- 3 x VGA ports

Front hot-swap:
6 x 9.5mm E1.S Gen4 NVMe

Optional internal M.2 (CMTP192 x 3):
3 x M.2 (2280/22110), PCIe Gen4 x4

N/A

N/A

Riser Card CRSH01Q x 3:
- 3 x LP x16 (Gen5 x16)

Riser Card CRSH01R x 3:
- 3 x FHHL x16 (Gen5 x16)

3 x OCP NIC 3.0 (Gen5 x16)
- Support NCSI function

6 x USB 3.2 Gen1 ports (Type-A)
3 x VGA ports
3 x Power buttons with LED
3 x System status LEDs
3 x ID LEDs
2 x CMC ports
1 x CMC status LED

N/A

Speed and bandwidth:
PCIe Gen4 x4

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

1+1 3000W 80 PLUS Titanium redundant power supplies ^[1]

AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 15.5A

DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 81A
+12Vsb/ 3A
- Max 2600W/ 200-220V~
+12.2V/ 213A
+12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+12.2V/ 245A
+12Vsb/ 3A

^[1] The system power supply requires C19 power cord.

Aspeed^® AST2600 Baseboard Management Controller
Aspeed^® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface

• Dashboard
• HTML5 KVM
• Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
• Sensor Reading History Data
• FRU Information
• SEL Log in Linear Storage / Circular Storage Policy
• Hardware Inventory
• Fan Profile
• System Firewall
• Power Consumption
• Power Control
• Advanced power capping
• LDAP / AD / RADIUS Support
• Backup & Restore Configuration
• Remote BIOS / BMC / CPLD Update
• Event Log Filter
• User Management
• Media Redirection Settings
• PAM Order Settings
• SSL Settings
• SMTP Settings

Please refer to OS compatibility table in support page

4 x 80x80x38mm (18,300rpm)

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

857 x 670 x 280 mm

1 x H223-Z10-AAP1
3 x CPU heatsinks
1 x L-shape Rail kit

- Barebone package: 6NH223Z10DR000ACP1*
- Motherboard: 9MZ13HD0UR-000-3*
- L-shape Rail kit: 25HB2-A86106-K0R
- CPU heatsink: 25ST1-553202-A0R
- Front panel board - CFPH030: 9CFPH030NR-00*
- Backplane board - CBP2060: 9CBP2060NR-00*
- Fan module: 25ST2-88382V-S1R
- Riser card - CRSH01Q: 9CRSH01QNR-00*
- Riser card - CRSH01R: 9CRSH01RNR-00*
- EDSFF riser card - CSPP010: 9CSPP010NR-00*
- LAN bridge board - CLSH13: 9CLSH13NR-00*
- Power supply: 25EP0-23000F-G1S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 expansion card - CMTP192: 9CMTP192NR-00*
- RMA packaging: 6NH223Z10SR-RMA-A100