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Stand-alone chassis for customers to customize and expand as needs change.

Direct Liquid Cooling

Ensure peak performance in all configurations. Adopt direct-to-chip liquid cooling for the rising AI/HPC era.

Immersion Cooling

Address rising server heat with submerged cooling. Embrace next-gen liquid cooling for improved TCO and PUE.

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Based on OCP Open Rack Standards, barebone racks and nodes for datacenters.

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Arm architecture servers will compete in Cloud to Edge as they tackle compute-bound workloads.

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Systems that do visual applications from computer graphics to computer animation rely on visual computing servers.

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Processing power, large amounts of data, fast networking, and accelerators all bundle into a scale out ready HPC and/or AI server solution.

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Software defined cluster of nodes can be dedicated for compute, storage, networking, or virtualization.

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Capacity, reliability, and storage flexibility are built into these storage servers for enterprise and datacenters.

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Real time data processing at the source is required for edge computing with reduced latency for Internet of Things (IoT) and 5G networks as they use cloud.

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GA-P35-DS3

GA-P35-DS3 (rev. 2.1)

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Intel^® P35 + ICH9 Chipset

News

Jun 20, 2012

Introducing the GIGABYTE Hidden Gems Competition
Jan 16, 2008

GIGABYTE Launches Full Range of Dynamic Energy Saver Motherboards

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"Recommended"

PC Authority Jun 26, 2008
"Best Buy"

PC User Jun 25, 2008

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GA-P35-DS3 (rev. 2.1)

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