|
|
  
 
 Z68 vs. P67 
|
4X+ Intel® Smart
Response Technology 
|
 Touch BIOS™ 
|
 Max CPU Power 
|
 Ultra Durable™ 
|
 Built-in Visuals 
|
 Unique Features 
  
  Driver MOSFET : Integration of VRM Components
                  Driver MOSFET : Integration of VRM Components
 
A traditional Voltage Regulator Module (VRM) consists of a Choke, Capacitors, MOSFETs and a Driver IC. By incorporating the MOSFETs and driver IC in accordance with the Intel® Driver MOSFET specification, we can achieve higher power transfer and increased efficiency at higher switching frequencies to satisfy the growing power requirements of today’s processors. Driver MOSFETs also help to reduce VRM real estate requirements in the CPU zone.
  Discrete PowerMOS x 2
Driver IC x 1
  Mounting area
reduced by
50% !
  Traditional MOSFET + Driver IC
  Driver MOSFET
 
  Power Efficiency
  Benefits of GIGABYTE's Ultra Durable 3 with Driver MOSFETs
     
GIGABYTE's Ultra Durable 3 with
Driver MOSFETs
Traditional
Design
   
Energy Efficiency
Good
Poor
   
Component
Switching
Power Loss
Low
High
   
Heat Generation
Low
High
   
Durability
High
Low
  What is the GIGABYTE Ultra Durable™3 design?
The signature specifications for GIGABYTE Ultra Durable™ 3 motherboards are Japanese Solid Capacitors featuring 50,000 hr. operation time, 2x Copper PCBs, Ferrite core chokes with higher energy efficiency compared to more common iron core chokes and Lower RDS(on) MOSFETs that feature lower resistance, i.e. reduced power consumption and heat.
Ferrite Core Choke
  
 
50,000 hr.
Japanese Solid Capacitor  
Lower RDS(on)
MOSFET
  
 
2X Copper
Inner Layer
Signal Layer
  
Prepreg
    
Power Layer
    
Core
    
     
Ground Layer
Prepreg
Signal Layer
   
Benefits of 2x Copper PCB
● Cooler than traditional motherboards
● Enhanced durability
● Improved energy efficiency
● Greater margins for overclocking		 PCB (Printed Circuit Board)
2x copper PCB = 2 oz copper PCB = weight of copper layer
30.48 cm x 30.48 cm (1 square foot) PCB is 56.7 g (2 oz)
 
Copper Layer Thickness
2x copper 0.070mm (70 µm)
1x copper 0.035mm (35 µm)
Lower
Temperature		 Better
Overclocking		 Better Power
Effciency		 2x Lower
Impedance		 Lower EMI Better ESD
Protection

 
   
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