H223-Z10-AAP1

Rev. 3.x Rev. 1.x

High Density Server - AMD EPYC™ 9005/9004 - 2U 3-Node UP 6-Bay E1.S Gen4 NVMe

# Edge # Hybrid/Private Cloud Server

2U 3-node front access server system
Single AMD EPYC™ 9005/9004 Series Processors per node
12-Channel DDR5 RDIMM, 12 x DIMMs per node
Dual ROM Architecture
2 x CMC ports
6 x 9.5mm E1.S Gen4 NVMe hot-swap bays
3 x FHHL PCIe Gen5 x16 slots
3 x LP PCIe Gen5 x16 slots
3 x OCP NIC 3.0 PCIe Gen5 x16 slots
2 x 3000W 80 PLUS Titanium redundant power supply

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* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 3-Node - Front access
447.8 x 87.5 x 500

Motherboard

MZ13-HD0

CPU

AMD EPYC™ 9005 Series Processors
AMD EPYC™ 9004 Series Processors

Single processor per node, cTDP up to 240W
- At ambient 30°C, cTDP up to 300W

^[Note]cTDP supported up to 400W under limited thermal conditions. Please contact our sales representatives for more details.

Socket

3 x LGA 6096
Socket SP5

Chipset

System on Chip

Memory

36 x DIMM slots
DDR5 memory supported
12-Channel memory architecture

AMD EPYC™ 9005:
RDIMM: Up to 6000 MT/s

AMD EPYC™ 9004:
RDIMM: Up to 4800 MT/s

LAN

Front:
2 x Chassis Management LAN

Video

Integrated in Aspeed^® AST2600 x 3
- 3 x VGA ports

Storage

Front hot-swap:
6 x 9.5mm E1.S Gen4 NVMe

Optional internal M.2 (CMTP192 x 3):
3 x M.2 (2280/22110), PCIe Gen4 x4

SAS

N/A

RAID

N/A

PCIe Expansion Slots

Riser Card CRSH01Q x 3:
- 3 x LP x16 (Gen5 x16)

Riser Card CRSH01R x 3:
- 3 x FHHL x16 (Gen5 x16)

3 x OCP NIC 3.0 (Gen5 x16)
- Support NCSI function

Front I/O

6 x USB 3.2 Gen1 ports (Type-A)
3 x VGA ports
3 x Power buttons with LED
3 x System status LEDs
3 x ID LEDs
2 x CMC ports
1 x CMC status LED

Rear I/O

N/A

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4

Security Modules

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

2 x 3000W 80 PLUS Titanium redundant power supply^[1]

AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 15.5A

DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 81A
+12Vsb/ 3A
- Max 2600W/ 200-220V~
+12.2V/ 213A
+12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+12.2V/ 245A
+12Vsb/ 3A

^[1]The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 Baseboard Management Controller
Aspeed^® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS / BMC / CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

4 x 80x80x38mm (18,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Packaging Dimensions

857 x 670 x 280 mm

Packaging Content

1 x H223-Z10-AAP1
3 x CPU heatsinks
1 x L-shape Rail kit

Part Numbers

- Barebone package: 6NH223Z10DR000ACP1*
- Motherboard: 9MZ13HD0UR-000-3*
- L-shape Rail kit: 25HB2-A86106-K0R
- CPU heatsink: 25ST1-553202-A0R
- Front panel board - CFPH030: 9CFPH030NR-00*
- Backplane board - CBP2060: 9CBP2060NR-00*
- Fan module: 25ST2-88382V-S1R
- Riser card - CRSH01Q: 9CRSH01QNR-00*
- Riser card - CRSH01R: 9CRSH01RNR-00*
- EDSFF riser card - CSPP010: 9CSPP010NR-00*
- LAN bridge board - CLSH13: 9CLSH13NR-00*
- Power supply: 25EP0-23000F-G1S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 expansion card - CMTP192: 9CMTP192NR-00*
- RMA packaging: 6NH223Z10SR-RMA-A100

SUPPORT

Tải về

Driver
BIOS
Tiện ích
Firmware

Hướng dẫn
Support List

Online Support

Driver

BIOS

Tiện ích

Firmware

All
All
Windows Server 2022
Windows Server 2019
Linux

Chipset

Phiên bản

Kích cở

Ngày

Chipset driver for AMD EPYC 9005/9004 series processors

Version : 6.10.07.747

2.82 MB

Oct 29, 2024

H223-Z10-AAP1

SPECIFICATIONS

SUPPORT

RESOURCES

H223-Z10-AAP1 (Rev. 3.x)