R281-NO0

Rev. 400

Rack Server - 2nd/1st Gen Intel^® Xeon^® Scalable - 2U DP 24+2-Bay Gen3 NVMe/SATA/SAS

# Networking

Dual 2nd/1st Gen Intel^® Xeon^® Scalable Processors
6-Channel DDR4 RDIMM/LRDIMM, 24 x DIMMs
Supports Intel^® Optane™ DC Persistent Memory
2 x 1Gb/s LAN ports via Intel^® I350-AM2
24 x 2.5" NVMe hot-swappable bays
2 x 2.5" SATA/SAS hot-swappable bays on the rear side
5 x FHHL PCIe Gen3 x16 and x8 slots
1 x OCP Gen3 x16 mezzanine slot
Dual 1600W 80 PLUS Platinum redundant power supply

Get a Quote

مقارنة

Get a Quote

* كل المعلومات المذكورة للاطلاع فقط. وتحتفظ جيجابايت بالحق في تعديلها أو مراجعتها في أي وقت دون اخطار مسبق.
* مستوى الأداء المعروض اعتماداً على أقصي القيم الافتراضية للواجهات والتي زودنا بها المصنعين المختلفين والذين وضعوا المعايير القياسية لهذه الواجهات. وقد يختلف مستوى الأداء الفعلي باختلاف مواصفات الحاسب.
* كل العلامات التجارية والشعارات هي ملك لحامليها.
* نظرأً لخصائص الحاسب القياسية، فإن قدراً من السعة الكلية للذاكرة يتم استخدامه من قبل الحاسب ولذلك تصبح سعة الذاكرة الحقيقية أقل من السعة المذكورة على وحدات الذاكرة.

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U
438 x 87.5 x 730

Motherboard

MR91-FS0

CPU

2nd Generation Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® Scalable Processors
Dual processor, TDP up to 205W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

2 x LGA 3647
Socket P

Chipset

Intel^® C621

Memory

24 x DIMM slots
DDR4 memory supported only
6-channel memory architecture
RDIMM up to 64GB supported
LRDIMM up to 128GB supported
Supports Intel^® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MT/s

Maximum verified DCPMM configuration:

* Ambient temperature 35°C
* 2nd Generation Intel^® Xeon^® Scalable processor 205W (Max.)
* DCPMM 256GB x12 pcs

DCPMM installation locations:
DIMM_P0_(A1, B1, C1)
DIMM_P0_(D1, E1, F1)
DIMM_P1_(G1, H1, I1)
DIMM_P1_(J1, K1, L1)

Note:
1. 2933 MT/s for 2nd Generation Intel^® Xeon^® Scalable Processors only.
2. Intel^® Optane™ DC Persistent Memory for 2nd Generation Intel^® Xeon^® Scalable Processors only.
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C.
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative.

LAN

Rear side:
2 x 1Gb/s LAN ports (1 x Intel^® I350-AM2)
Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Video

Integrated in Aspeed^® AST2500
- 1 x VGA port

Storage

Front side:
24 x 2.5" Gen3 NVMe hot-swappable bays

Rear side:
2 x 2.5" SATA/SAS hot-swappable bays

SAS card is required to enable SAS devices support

SATA

2 x 7-pin SATA III 6Gb/s with SATA DOM supported
By using pin_8 or external cable for power function

SAS

Depends on SAS add-in cards

RAID

For SATA drives:
Intel^® SATA RAID 0/1

For NVMe drives:
Optional Intel^® Virtual RAID On CPU (VROC) RAID 0/1/10/5

Note: VROC module is compatible for Intel^®SSD only.

Expansion Slots

Riser Card CRS2131:
- 1 x PCIe x16 (Gen3 x16 or x8) FHHL slot, from CPU_0
- 1 x PCIe x8 (Gen3 x0 or x8) FHHL slot, from CPU_0
- 1 x PCIe x8 (Gen3 x8) FHHL slot, from CPU_0

Riser Card CRS2132:
- 1 x PCIe x16 (Gen3 x16) FHHL slot, from CPU_1, occupied by CNV3124 - 4 x NVMe ports
- 1 x PCIe x8 (Gen3 x0) FHHL slot, from CPU_1, disabled
- 1 x PCIe x8 (Gen3 x8) FHHL slot, from CPU_0

Riser Card CRS2124:
- 1 x PCIe x8 (Gen3 x0) low-profile slot, from CPU_1, disabled
- 1 x PCIe x16 (Gen3 x16) low-profile slot, from CPU_1, occupied by CNV3124 - 4 x NVMe ports

1 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4, K2, K3), from CPU_0

1 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4, K2, K3), from CPU_1, occupied by CNVO124 - 4 x NVMe mezzanine card

Internal I/O

2 x Power supply connectors
4 x SlimSAS connectors
2 x SATA 7-pin connectors
2 x CPU fan headers
1 x USB 3.0 header
1 x TPM header
1 x VROC connector
1 x Front panel header
1 x Backplane board header
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper

Front I/O

2 x USB 3.0
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
2 x LAN activity LEDs
1 x Storage activity LED
1 x System status LED

Rear I/O

2 x USB 3.0
1 x VGA
1 x COM (RJ45)
2 x RJ45
1 x MLAN
1 x ID button with LED

Backplane Board

Speed and bandwidth:
Front side - CBP20O2: PCIe Gen3 x4
Rear side - CBP2020: SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with LPC interface
- Optional TPM2.0 kit: CTM000

Power Supply

Dual 1600W 80 PLUS Platinum redundant power supply

AC Input:
- 100-120V~/ 12A, 50/60Hz
- 200-240V~/ 10A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 10A

DC Output:
- Max 1000W/ 100-120V~
+12V/ 81.5A
+12Vsb/ 2.5A
- Max 1600W/ 200-240V~ or 240Vdc Input
+12V/ 133A
+12Vsb/ 2.5A

System Management

Aspeed^® AST2500 Baseboard Management Controller
Avocent^® MergePoint IPMI 2.0 web interface:

Network settings
Network security settings
Hardware information
Users control
Services settings
IPMI settings
Sessions control
LDAP settings
Power control
Fan profiles
Voltages, fans and temperatures monitoring
System event log
Events management (platform events, trap settings, email settings)
Serial Over LAN
vKVM & vMedia (HTML5)

OS Compatibility

For Skylake processors:

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later

Red Hat Enterprise Linux 6.9 or later
Red Hat Enterprise Linux 7.3 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 11 SP4 or later
SUSE Linux Enterprise Server 12 SP2 or later
SUSE Linux Enterprise Server 15 or later

Ubuntu 16.04.1 LTS or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

For Cascade Lake processors:

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later

Red Hat Enterprise Linux 7.6 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 12 SP3 or later
SUSE Linux Enterprise Server 15 or later

Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

System Fans

4 x 80x80x38mm (16,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

20 kg

Packaging Dimensions

982 x 588 x 250 mm

Packaging Content

1 x R281-NO0
2 x CPU heatsinks
1 x 2-Section Rail kit
2 x Non-fabric CPU carriers

Part Numbers

- Barebone package: 6NR281NO0MR-00-4*
- Motherboard: 9MR91FS0NR-00
- 2-Section Rail kit: 25HB2-3A0202-K0R
- CPU heatsink: 25ST1-353105-T1R
- Non-fabric CPU carrier: 12KRC-0F3647-50R
- Front panel board - CFP2001: 9CFP2001NR-00
- Backplane board - CBP20O2: 9CBP20O2NR-00
- Backplane board - CBP2020: 9CBP2020NR-00
- Fan module: 25ST2-883829-D0R
- Riser card - CRS2124: 9CRS2124NR-00
- Riser card - CRS2131: 9CRS2131NR-00
- Riser card - CRS2132: 9CRS2132NR-00
- Mezzanine card - CEPM480: 9CEPM480NR-00
- PCIe NVMe card - CNV3124: 9CNV3124NR-00
- NVMe card - CNVO124: 9CNVO124NR-00
- Power supply: 25EP0-216007-L0S

Optional parts:

- VROC module: 25FD0-R181N0-10R
- RJ45 type COM cable: 25CR0-200400-Y4R

SUPPORT

ملفات للتحميل

برامج تشغيل
BIOS
الأداة
Firmware

دليل المستخدم
قائمة الدعم

Online Support

برامج تشغيل

BIOS

الأداة

Firmware

QVL

All
All
Windows Server 2019
Windows Server 2016 64bit
Windows Server 2012 R2 64bit
Linux

Chipset

النسخة

الحجم

التاريخ

Intel^® Chipset Driver

Version : 10.1.17861.8101

3.34 MB

Apr 18, 2019

R281-NO0

SPECIFICATIONS

SUPPORT

RESOURCES

R281-NO0 ‏(Rev. 400)‏