H282-ZC0

2U 4-Node - Front access
447 x 86.8 x 902

MZC2-LM0 Rev. 1.0

AMD EPYC™ 7003 Series processors
Dual processor per node, 7nm technology
Up to 64-core, 128 threads per processor
CPU 200W, fully support at ambient 35°C

CPU 240W conditionally supported at ambient 35°C with only 1 x PCIe card per node

CPU 280W conditionally supported at ambient 25°C with only 1 x PCIe card per node

NOTE: If only one CPU is installed, some PCIe or memory functions might be unavailable

Compatible with AMD EPYC™ 7002 Series processors

Per Node:
2 x LGA 4094

Total:
8 x LGA 4094

Socket SP3

System on Chip

Per node:
32 x DIMM slots

Total:
128 x DIMM slots

DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200*/2933 MHz

Note: Follow BIOS setting and memory QVL list if running 3200 Mhz with 2DPC

Per node:
2 x 1GbE LAN ports (1 x Intel^® I350-AM2)
Support NCSI function

1 x Dedicated management port

Total:
8 x 1GbE LAN ports (4 x Intel^® I350-AM2)
Support NCSI function

4 x Dedicated management ports

Integrated in Aspeed^® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed^® AST2520A2-GP

Per node:
2 x 2.5" 7mm slim type Gen4 NVMe/SATA hot-swappable bays, from CPU_0

Total:
8 x 2.5" 7mm slim type Gen4 NVMe/SATA hot-swappable bays, from CPU_0

N/A

N/A

Per node:
1 x PCIe x16 (Gen4 x16) low-profile slot on front side, from CPU_0
2 x PCIe x16 (Gen4 x16) FHHL slots on rear side, from CPU_1

1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth, from CPU_0

1 x M.2 slot:
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2260/2280 cards
- CPU TDP is limited to 240W if using M.2 device

1 x M.2 slot:
- M-key
- PCIe Gen4 x4, from CPU_1
- Supports 2260/2280 cards
- CPU TDP is limited to 240W if using M.2 device

Total:
4 x PCIe x16 (Gen4 x16) low-profile slot on front side, from CPU_0
8 x PCIe x16 (Gen4 x16) FHHL slots on rear side, CPU_1

4 x OCP 3.0 slots with PCIe Gen4 x16 bandwidth, from CPU_0

4 x M.2 slots:
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2260/2280 cards
- CPU TDP is limited to 240W if using M.2 device

4 x M.2 slots:
- M-key
- PCIe Gen4 x4, from CPU_1
- Supports 2260/2280 cards
- CPU TDP is limited to 240W if using M.2 device

Per node:
2 x M.2 slots
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button
2 x USB 3.0
1 x Mini-DP
2 x RJ45
1 x MLAN

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons
8 x USB 3.0
4 x Mini-DP
8 x RJ45
4 x MLAN

2 x CMC ports

1 x Global OCP 3.0 slot
- Dedicated support for optional NVIDIA MCX565M-CDAB multi-host adapter from system BOM version A02

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s

1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010

Dual 3200W 80 PLUS Platinum redundant power supply

AC Input:
- 100-127V~/ 14A, 50-60Hz
- 200-208V~/ 16A, 50-60Hz
- 214-234V~/ 16A, 50-60Hz
- 240V~/ 16A, 50-60Hz

DC Input:
- 240Vdc/ 16A

DC Output:
- Max 1100W/ 100-127V~
- Max 2434W/ 200-208V~
- Max 2828W/ 214-234V~
- Max 3234W/ 240V~

NOTE: The system power supply requires C19 power cord

Aspeed^® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

• Dashboard
• JAVA Based Serial Over LAN
• HTML5 KVM
• Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
• Sensor Reading History Data
• FRU Information
• SEL Log in Linear Storage/Circular Storage Policy
• Hardware Inventory
• Fan Profile
• System Firewall
• Power Consumption
• Power Control
• LDAP / AD / RADIUS Support
• Backup & Restore Configuration
• Remote BIOS/BMC/CPLD Update
• Event Log Filter
• User Management
• Media Redirection Settings
• PAM Order Settings
• SSL Settings
• SMTP Settings

Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022

Red Hat Enterprise Linux 8.3 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later

Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later

Citrix Hypervisor 8.2.0 or later

8 x 80x80x38mm (16,300rpm)

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Net Weight: 37 kg

1180 x 779 x 300 mm

1 x H282-ZC0
8 x CPU heatsinks
1 x L-shape Rail kit

- Barebone package: 6NH282ZC0MR-00-A*
- Motherboard: 9MZC2LM0NR-00
- L-shape Rail kit: 25HB2-A86104-K0R
- CPU heatsink: 25ST1-423203-A0R/25ST1-44320J-A0R
- Backplane board - CBPH022: 9CBPH022NR-00
- Fan module: 25ST2-88382H-D0R
- NVMe PCIe Card - CNV3152: 9CNV3152NR-00
- Power Supply: 25EP0-232001-D0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- RMA packaging: 6NH282ZC0SR-RMA-A100