H233-Z80- AAW1

Rev. 3.x Rev. 1.x

High Density Server - AMD EPYC™ 9005/9004 - 2U 2-Node DP 4 x PCIe Gen5 GPUs 3000W

# AI # AI Training # AI Inference # HPC # HCI # Hybrid/Private Cloud Server

Supports up to 4 x Dual slot Gen5 GPUs
2U 2-node rear access server system
Dual AMD EPYC™ 9005/9004 Series Processors per node
12-Channel DDR5 RDIMM, 24 x DIMMs per node
Dual ROM Architecture
4 x 1Gb/s LAN ports via Intel^® I350-AM2
4 x 2.5" Gen4 NVMe hot-swap bays
4 x FHFL PCIe Gen5 x16 slots for GPUs
2 x LP PCIe Gen5 x16 slots
2 x OCP NIC 3.0 PCIe Gen5 x16 slots
Dual 3000W 80 PLUS Titanium redundant power supply

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* Materialele oferite aici sunt doar pentru referinţă. GIGABYTE îşi rezervă dreptul de a modifica sau revizui continutul oricând fără notificare prealabilă.
* Perfomanţa prezentată este bazată pe valorile teoretice maxime ale interfeţei de la vendorii respectivi de Chipset-uri sau de la organizaţiile ce au definit specificaţiile interfeţei. Perfomanţele reale pot varia în funcţie de sistem.
* Toate mărcile inregistrate şi logo-urile sunt proprietatea deţinătorilor respectivi.
* Datorită arhitecturii standard PC, o anumită cantitate de memorie este rezervată pentru sistem şi de aceea mărimea actuală a memoriei este mai mică decât cea indicată.

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 2-Node - Rear access
440 x 87.5 x 877

Motherboard

MZ83-HD0

CPU

AMD EPYC™ 9005 Series Processors
AMD EPYC™ 9004 Series Processors

Dual processor per node, cTDP up to 240W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

4 x LGA 6096
Socket SP5

Chipset

System on Chip

Memory

48 x DIMM slots
DDR5 memory supported
12-Channel memory architecture

AMD EPYC™ 9005:
RDIMM: Up to 6000 MT/s

AMD EPYC™ 9004:
RDIMM: Up to 4800 MT/s

LAN

Rear:
4 x 1Gb/s LAN (2 x Intel^® I350-AM2)
- Support NCSI function

2 x 10/100/1000 Mbps Management LAN

^[Note]Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.

Video

Integrated in Aspeed^® AST2600 x 2
- 2 x Mini-DP

Storage

Front hot-swap:
4 x 2.5" Gen4 NVMe
- (NVMe from CPU_1)

SAS

N/A

RAID

N/A

PCIe Expansion Slots

PCIe Cable x 4:
- 4 x FHFL x16 (Gen5 x16), from CPU_0, for GPUs

Riser Card CRSH01R x 2:
- 2 x LP x16 (Gen5 x16), from CPU_0

2 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Support NCSI function

Front I/O

4 x Power buttons with LED (2 x buttons disabled)
4 x ID buttons with LED (2 x buttons disabled)
4 x Reset buttons (2 x buttons disabled)
4 x System status LEDs (2 x LEDs disabled)
1 x CMC status LED
1 x CMC reset button

^[Note]Node 1 and Node 3 are disabled.

Rear I/O

4 x USB 3.2 Gen1 ports (Type-A)
2 x Mini-DP
4 x RJ45 ports
2 x MLAN ports
2 x System status LEDs

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4

Security Modules

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

Dual 3000W 80 PLUS Titanium redundant power supply^[1]

AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 16A

DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A

^[1]The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 Baseboard Management Controller
Aspeed^® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

4 x 80x80x80mm (16,500rpm)

Operating Properties

Operating temperature: 10°C to 30°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 43.31 kg
Gross Weight: 45.46 kg

Packaging Dimensions

1179 x 700 x 380 mm

Packaging Content

1 x H233-Z80-AAW1
4 x CPU heatsinks
1 x Mini-DP to D-Sub cable
4 x GPU power cables (CPU 8pin, 400mm)
1 x 3-Section Rail Kit

Part Numbers

- Barebone package: 6NH233Z80DR000ACW1*
- Motherboard: 9MZ83HD0UR-000-3*
- 3-Section Rail kit: 25HB2-A66125-K0R
- CPU heatsink: 25ST1-25320N-M1R/25ST1-25320Q-M1R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH081: 9CBPH081NR-00*
- Fan module: 25ST2-888020-S1R
- Riser card - CRSH01R: 9CRSH01RNR-00*
- I/O board (incl. LAN chip) - CLBH160: 9CLBH160NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- GPU power cable (CPU 8pin, 400mm): 25CRI-4001D0-B1R
- Power supply: 25EP0-230009-L0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- RMA packaging: 6NH233Z80SR-RMA-A100

SUPPORT

Descărcări

Driver
BIOS
Utilitar
Firmware

Manual
Listă compatibilitate

Online Support

Driver

BIOS

Utilitar

Firmware

QVL

All
All
Windows Server 2022
Windows Server 2019
Linux

Chipset

Versiune

Mărime

Dată

Chipset driver for AMD EPYC 9005/9004 series processors

Version : 6.10.07.747

2.82 MB

Oct 29, 2024

H233-Z80- AAW1 .svg-ArrowDownSolid-color { fill: #707070 }

SPECIFICATIONS

SUPPORT

RESOURCES

H233-Z80-AAW1 (Rev. 3.x)

H233-Z80- AAW1