G4L3-SD1-LAX3

To be released

HPC/AI Server - 5th/4th Gen Intel^® Xeon^® Scalable - 4U DP HGX™ H200 8-GPU DLC

# AI # AI Training # AI Inference # HPC

Liquid-cooled NVIDIA HGX™ H200 8-GPU
CPU+GPU direct liquid cooling solution with leak detection
900GB/s GPU-to-GPU bandwidth with NVLink^® and NVSwitch™
Dual 5th/4th Gen Intel^® Xeon^® Scalable Processors
Dual Intel^® Xeon^® CPU Max Series
8-Channel DDR5 RDIMM, 32 x DIMMs
Dual ROM Architecture
Compatible with NVIDIA BlueField^®-3 DPUs and ConnectX^®-7 NICs
2 x 10Gb/s LAN ports via Intel^® X710-AT2
2 x M.2 slots with PCIe Gen3 x2 and x1 interface
8 x 2.5" Gen5 NVMe/SATA hot-swap bays
4 x FHHL dual-slot PCIe Gen5 x16 slots
8 x FHHL single-slot PCIe Gen5 x16 slots
4+4 3000W 80 PLUS Titanium redundant power supplies

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* Materialele oferite aici sunt doar pentru referinţă. GIGABYTE îşi rezervă dreptul de a modifica sau revizui continutul oricând fără notificare prealabilă.
* Perfomanţa prezentată este bazată pe valorile teoretice maxime ale interfeţei de la vendorii respectivi de Chipset-uri sau de la organizaţiile ce au definit specificaţiile interfeţei. Perfomanţele reale pot varia în funcţie de sistem.
* Toate mărcile inregistrate şi logo-urile sunt proprietatea deţinătorilor respectivi.
* Datorită arhitecturii standard PC, o anumită cantitate de memorie este rezervată pentru sistem şi de aceea mărimea actuală a memoriei este mai mică decât cea indicată.

SPECIFICATIONS

Dimensions (WxHxD, mm)

4U
447 x 175.3 x 900

Motherboard

MSB3-PE0

CPU

5th Generation Intel^® Xeon^® Scalable Processors
4th Generation Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® CPU Max Series

Dual processor, TDP up to 385W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

2 x LGA 4677
Socket E

Chipset

Intel^® C741

Memory

32 x DIMM slots
DDR5 memory supported
8-Channel memory architecture

5th Gen Intel^® Xeon^®:
RDIMM: Up to 5600 MT/s (1DPC), 4400 MT/s (2DPC)^[1]

4th Gen Intel^® Xeon^®:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)

Intel^® Xeon^® Max Series:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)

^[1]5600 MT/s support under 2DPC configuration requires verified memory and BIOS setup. Please refer to the QVL for more information.

LAN

Front (I/O board - CFPG540):
2 x 10Gb/s LAN (1 x Intel^® X710-AT2)
- Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN

^[Note]When both MLAN ports are connected with cables, the front MLAN port will be set as the default.

Video

Integrated in Aspeed^® AST2600
- 1 x VGA port

Storage

Front hot-swap:
8 x 2.5" Gen5 NVMe/SATA
- (NVMe from PEX89104)

Internal M.2:
1 x M.2 (2280/22110), PCIe Gen3 x2, from PCH
1 x M.2 (2280/22110), PCIe Gen3 x1, from PCH

SAS

N/A

RAID

Intel^® SATA RAID 0/1/10/5

Support optional RAID add-in cards

Modular GPU

Liquid-cooled NVIDIA HGX™ H200 with 8 x SXM GPUs

PCIe Expansion Slots

PCIe Bridge Board - CBG76:
- 8 x FHHL x16 (Gen5 x16), from PEX89104

PCIe Bridge Board - CPBG045 x 2:
- 4 x FHHL x16 (Gen5 x16), from PEX89048

Front I/O

I/O board - CFPG540:
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED

Rear I/O

MLAN board - CDB66:
1 x MLAN port

Backplane Board

Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s

Security Modules

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

4+4 3000W 80 PLUS Titanium redundant power supplies^[1]

AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 14A

DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A

^[1]The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

Motherboard:
2 x 60x60x56mm
2 x 60x60x76mm

PCIe slots:
4 x 80x80x56mm (15,500rpm)

GPU tray:
4 x 60x60x38mm (24,000rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

^[Note]To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.

Packaging Content

1 x G4L3-SD1-LAX3
1 x CPU cold plate loop
6 x Carriers
1 x L-shape Rail kit

SUPPORT

Descărcări

BIOS

Online Support

BIOS

Descriere

Versiune

Mărime

Dată

Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website

0.31 MB

Jan 29, 2021

Download

Atenţie:
Deoarece rescrierea de BIOS este potential riscantă, dacă nu aveţi probleme folosind versiunea curentă de BIOS, este recomandat să nu rescrieţi BIOS-ul. Rescrieţi BIOS-ul cu atenţie. O rescriere incorecta de BIOS poate rezulta în erori de funcţionare a sistemului.

Ce înseamnă BETA?
BETA descrie o nouă versiune care este stabilă dar care este posibil sa nu includă toate caracteristicile produsului final. În timpul acestei faze testăm noi caracteristici şi adunăm date de la clienţi pentru a ne asigura ca produsele noastre ofera cea mai bună experienţă posibilă.