Dimensions (WxHxD, mm)
1U
438 x 43.5 x 710
CPU
Intel® Xeon® 6 Processors
- Intel® Xeon® 6700-Series Processors
- Intel® Xeon® 6500-Series Processors
Single processor, TDP up to 350W
Socket
1 x LGA 4710
Socket E2
Memory
16 x DIMM slots
DDR5 memory supported
8-Channel memory per processor
MRDIMM supported [1]
RDIMM: Up to 6400 MT/s (1DPC), 5200 MT/s (2DPC)
MRDIMM: Up to 8000 MT/s
[1] MRDIMMs are only supported with Intel® Xeon® 6 Processors with P-cores and in a 1DPC configuration.
LAN
Rear:
1 x 1Gb/s LAN (1 x Intel® I210-AT)
- Supports NCSI function
1 x 10/100/1000 Mbps Management LAN
Video
Integrated in ASPEED® AST2600
- 1 x Mini-DP
Storage
Front hot-swap:
12 x 2.5" Gen5 NVMe/SATA/SAS-4 [1]
Internal M.2:
1 x M.2 (2280/22110), PCIe Gen5 x2
1 x M.2 (2280/22110), PCIe Gen5 x2, shared with SATA [2]
[1] SAS card is required to support SAS drives.
[2] To enable the M.2 slot, please adjust the switch according to the manual.
SAS
Require SAS add-in cards
RAID
Require RAID add-in cards
Onboard VROC key header
PCIe Expansion Slots
Riser Card CRS101O:
- 1 x FHHL x16 (Gen5 x16)
1 x OCP NIC 3.0 (Gen5 x16)
- Supports NCSI function
1 x OCP NIC 3.0 (Gen5 x16), disabled for NVMe
Front I/O
1 x USB 3.2 Gen1 port (Type-A)
1 x Power button with LED
1 x ID button with LED
1 x Reset button
2 x LAN activity LEDs (1 x LED disabled)
1 x Storage activity LED
1 x System status LED
Rear I/O
2 x USB 3.2 Gen1 ports (Type-A)
1 x Mini-DP
1 x RJ45 port
1 x MLAN port
1 x ID button with LED
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
Security Modules
1 x TPM header with SPI interface
-
Optional TPM2.0 kit:
CTM012
1 x PRoT connector
(only enabled on RoT SKU)
Power Supply
1+1 1300W 80 PLUS Titanium redundant power supplies
AC Input:
- 100-127V~/ 12A, 50-60Hz
- 200-240V~/ 8A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 7A
DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 82A
+12.2Vsb/ 3A
- Max 1300W/ 200-240V~ or 240Vdc Input
+12.2V/ 106A
+12.2Vsb/ 3A
[Note] GIGABYTE offers PSUs with various efficiency ratings and power outputs. Full redundancy may depend on your server configuration, and alternative PSU options may be needed. Please contact our sales representatives for the best power solution.
System Management
ASPEED
® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 40x40x28mm (25,000rpm)
4 x 40x40x56mm (32,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
977 x 588 x 236 mm
Packaging Content
1 x R164-S32-AAH1
1 x CPU heatsink
1 x Mini-DP to D-Sub cable
2 x Carriers
1 x 2-Section Rail kit
Part Numbers
- Barebone package: 6NR164S32DR000AAH1*
- Motherboard: 9MS34DC0UR-000*
- 2-Section Rail kit (CMA not supported): 25HB2-3A0203-K0R
- CPU heatsink: 25ST1-4Z3200-S7R
- M.2 heatsink: 12SP2-11000E-00R
- Front panel board - CFP1030: 9CFP1030NR-00*
- Backplane board - CBP10C2: 9CBP10C2NR-00*
- Fan module 40x40x28mm: 25ST2-442828-D0R
- Fan module 40x40x56mm: 25ST2-40562H-A0R
- Riser card - CRS101O: 9CRS101ONR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-213005-G1S
Optional parts:
- 3-Section Rail kit (Supports CMA): 25HB2-A56120-K0R
- Cable Management Arm: 25HBZ-R18100-K0R
* Zamieszczony materiał został udostępniony jedynie w celach informacyjnych. GIGABYTE zastrzega sobie prawo do wprowadzania zmian w specyfikacji produktu i udostępnionych informacji o produkcie bez wcześniejszego powiadomienia.
* Przedstawiane dane są oparte na maksymalnych teoretycznych wydajnościach przedstawionym przez producentów chipsetów lub organizacji określających zakres tych specyfikacji. Rzeczywista wydajność może się różnić w zależności od konfiguracji systemu.
* Wszystkie znaki towarowe są własnością ich właścicieli.
* Z uwagi na budowę systemu, zakres pamięci może się różnić.
