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G4L3-SD1-LAX3
To be released
HPC/AI Server - 5th/4th Gen Intel® Xeon® Scalable - 4U DP HGX™ H200 8-GPU DLC
- Liquid-cooled NVIDIA HGX™ H200 8-GPU
- CPU+GPU direct liquid cooling solution with leak detection
- 900GB/s GPU-to-GPU bandwidth with NVLink® and NVSwitch™
- Dual 5th/4th Gen Intel® Xeon® Scalable Processors
- Dual Intel® Xeon® CPU Max Series
- 8-Channel DDR5 RDIMM, 32 x DIMMs
- Dual ROM Architecture
- Compatible with NVIDIA BlueField®-3 DPUs and ConnectX®-7 NICs
- 2 x 10Gb/s LAN ports via Intel® X710-AT2
- 2 x M.2 slots with PCIe Gen3 x2 and x1 interface
- 8 x 2.5" Gen5 NVMe/SATA hot-swap bays
- 4 x FHHL dual-slot PCIe Gen5 x16 slots
- 8 x FHHL single-slot PCIe Gen5 x16 slots
- 4+4 3000W 80 PLUS Titanium redundant power supplies
SPECIFICATIONS
Dimensions (WxHxD, mm)
4U
447 x 175.3 x 900
447 x 175.3 x 900
Motherboard
MSB3-PE0
CPU
5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor, TDP up to 385W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor, TDP up to 385W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 4677
Socket E
Socket E
Chipset
Intel® C741
Memory
32 x DIMM slots
DDR5 memory supported
8-Channel memory architecture
5th Gen Intel® Xeon®:
RDIMM: Up to 5600 MT/s (1DPC), 4400 MT/s (2DPC) [1]
4th Gen Intel® Xeon®:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
Intel® Xeon® Max Series:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
[1] 5600 MT/s support under 2DPC configuration requires verified memory and BIOS setup. Please refer to the QVL for more information.
DDR5 memory supported
8-Channel memory architecture
5th Gen Intel® Xeon®:
RDIMM: Up to 5600 MT/s (1DPC), 4400 MT/s (2DPC) [1]
4th Gen Intel® Xeon®:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
Intel® Xeon® Max Series:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
[1] 5600 MT/s support under 2DPC configuration requires verified memory and BIOS setup. Please refer to the QVL for more information.
LAN
Front (I/O board - CFPG540):
2 x 10Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN
[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
2 x 10Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN
[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
Video
Integrated in Aspeed® AST2600
- 1 x VGA port
- 1 x VGA port
Storage
Front hot-swap:
8 x 2.5" Gen5 NVMe/SATA
- (NVMe from PEX89104)
Internal M.2:
1 x M.2 (2280/22110), PCIe Gen3 x2, from PCH
1 x M.2 (2280/22110), PCIe Gen3 x1, from PCH
8 x 2.5" Gen5 NVMe/SATA
- (NVMe from PEX89104)
Internal M.2:
1 x M.2 (2280/22110), PCIe Gen3 x2, from PCH
1 x M.2 (2280/22110), PCIe Gen3 x1, from PCH
SAS
N/A
RAID
Intel® SATA RAID 0/1/10/5
Support optional RAID add-in cards
Support optional RAID add-in cards
Modular GPU
Liquid-cooled NVIDIA HGX™ H200 with 8 x SXM GPUs
PCIe Expansion Slots
PCIe Bridge Board - CBG76:
- 8 x FHHL x16 (Gen5 x16), from PEX89104
PCIe Bridge Board - CPBG045 x 2:
- 4 x FHHL x16 (Gen5 x16), from PEX89048
- 8 x FHHL x16 (Gen5 x16), from PEX89104
PCIe Bridge Board - CPBG045 x 2:
- 4 x FHHL x16 (Gen5 x16), from PEX89048
Front I/O
I/O board - CFPG540:
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
Rear I/O
MLAN board - CDB66:
1 x MLAN port
1 x MLAN port
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s
PCIe Gen5 x4 or SATA 6Gb/s
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
- Optional TPM2.0 kit: CTM010
Power Supply
4+4 3000W 80 PLUS Titanium redundant power supplies [1]
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
Motherboard:
2 x 60x60x56mm
2 x 60x60x76mm
PCIe slots:
4 x 80x80x56mm (15,500rpm)
GPU tray:
4 x 60x60x38mm (24,000rpm)
2 x 60x60x56mm
2 x 60x60x76mm
PCIe slots:
4 x 80x80x56mm (15,500rpm)
GPU tray:
4 x 60x60x38mm (24,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.
Packaging Content
1 x G4L3-SD1-LAX3
1 x CPU cold plate loop
6 x Carriers
1 x L-shape Rail kit
1 x CPU cold plate loop
6 x Carriers
1 x L-shape Rail kit
* Zamieszczony materiał został udostępniony jedynie w celach informacyjnych. GIGABYTE zastrzega sobie prawo do wprowadzania zmian w specyfikacji produktu i udostępnionych informacji o produkcie bez wcześniejszego powiadomienia.
* Przedstawiane dane są oparte na maksymalnych teoretycznych wydajnościach przedstawionym przez producentów chipsetów lub organizacji określających zakres tych specyfikacji. Rzeczywista wydajność może się różnić w zależności od konfiguracji systemu.
* Wszystkie znaki towarowe są własnością ich właścicieli.
* Z uwagi na budowę systemu, zakres pamięci może się różnić.
* Przedstawiane dane są oparte na maksymalnych teoretycznych wydajnościach przedstawionym przez producentów chipsetów lub organizacji określających zakres tych specyfikacji. Rzeczywista wydajność może się różnić w zależności od konfiguracji systemu.
* Wszystkie znaki towarowe są własnością ich właścicieli.
* Z uwagi na budowę systemu, zakres pamięci może się różnić.
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