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G4L3-ZD1-LAX3
To be released
HPC/AI Server - AMD EPYC™ 9005/9004 - 4U DP HGX™ H200 8-GPU DLC
- Liquid-cooled NVIDIA HGX™ H200 8-GPU
- CPU+GPU direct liquid cooling solution with leak detection
- 900GB/s GPU-to-GPU bandwidth with NVLink® and NVSwitch™
- Dual AMD EPYC™ 9005/9004 Series Processors
- 12-Channel DDR5 RDIMM, 24 x DIMMs
- Dual ROM Architecture
- Compatible with NVIDIA BlueField®-3 DPUs and ConnectX®-7 NICs
- 2 x 10Gb/s LAN ports via Intel® X710-AT2
- 2 x M.2 slots with PCIe Gen3 x4 and x1 interface
- 8 x 2.5" Gen5 NVMe hot-swap bays
- 4 x FHHL dual-slot PCIe Gen5 x16 slots
- 8 x FHHL single-slot PCIe Gen5 x16 slots
- 4+4 3000W 80 PLUS Titanium redundant power supplies
SPECIFICATIONS
Dimensions (WxHxD, mm)
4U
447 x 175.3 x 900
447 x 175.3 x 900
Motherboard
MZB3-PE0
CPU
AMD EPYC™ 9005 Series Processors
AMD EPYC™ 9004 Series Processors
Dual processor, cTDP up to 500W [1]
[1] The ambient temperature is limited to 30°C when NVIDIA BlueField®-3 DPUs are installed.
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
AMD EPYC™ 9004 Series Processors
Dual processor, cTDP up to 500W [1]
[1] The ambient temperature is limited to 30°C when NVIDIA BlueField®-3 DPUs are installed.
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 6096
Socket SP5
Socket SP5
Chipset
System on Chip
Memory
24 x DIMM slots
DDR5 memory supported
12-Channel memory architecture
AMD EPYC™ 9005:
RDIMM: Up to 6000 MT/s
AMD EPYC™ 9004:
RDIMM: Up to 4800 MT/s
DDR5 memory supported
12-Channel memory architecture
AMD EPYC™ 9005:
RDIMM: Up to 6000 MT/s
AMD EPYC™ 9004:
RDIMM: Up to 4800 MT/s
LAN
Front (I/O board - CFPG540):
2 x 10Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN
[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
2 x 10Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN
[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
Video
Integrated in Aspeed® AST2600
- 1 x VGA port
- 1 x VGA port
Storage
Front hot-swap:
8 x 2.5" Gen5 NVMe
- (NVMe from PEX89104)
Internal M.2:
1 x M.2 (2280/22110), PCIe Gen3 x4, from CPU_1
1 x M.2 (2280/22110), PCIe Gen3 x1, from CPU_0
8 x 2.5" Gen5 NVMe
- (NVMe from PEX89104)
Internal M.2:
1 x M.2 (2280/22110), PCIe Gen3 x4, from CPU_1
1 x M.2 (2280/22110), PCIe Gen3 x1, from CPU_0
SAS
N/A
RAID
Require RAID add-in cards
Modular GPU
Liquid-cooled NVIDIA HGX™ H200 with 8 x SXM GPUs
PCIe Expansion Slots
PCIe Bridge Board - CBG76:
- 8 x FHHL x16 (Gen5 x16), from PEX89104
PCIe Bridge Board - CPBG045 x 2:
- 4 x FHHL x16 (Gen5 x16), from PEX89048
- 8 x FHHL x16 (Gen5 x16), from PEX89104
PCIe Bridge Board - CPBG045 x 2:
- 4 x FHHL x16 (Gen5 x16), from PEX89048
Front I/O
I/O board - CFPG540:
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
Rear I/O
MLAN board - CDB66:
1 x MLAN port
1 x MLAN port
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4
PCIe Gen5 x4
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
- Optional TPM2.0 kit: CTM010
Power Supply
4+4 3000W 80 PLUS Titanium redundant power supplies [1]
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
Motherboard:
2 x 60x60x56mm
2 x 60x60x76mm
PCIe slots:
4 x 80x80x56mm (15,500rpm)
GPU tray:
4 x 60x60x38mm (24,000rpm)
2 x 60x60x56mm
2 x 60x60x76mm
PCIe slots:
4 x 80x80x56mm (15,500rpm)
GPU tray:
4 x 60x60x38mm (24,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.
Packaging Content
1 x G4L3-ZD1-LAX3
1 x CPU cold plate loop
1 x L-shape Rail kit
1 x CPU cold plate loop
1 x L-shape Rail kit
* کلیه موارد ارایه شده در این صفحه تنها مربوط به نوع مرجع می باشد. گیگابایت حق تغییر یا تجدید نظر محتویات را در هر لحظه و بدون اطلاع قبلی دارد.
* کارایی ارایه شده بر اساس مقادیر حداکثر نظری رابط است که توسط فروشنده چیپ ست یا سازمان هایی که مشخصات رابط را تعیین کردند، ارائه شده است. کارایی واقعی ممکن است بنا بر پیکربندی سیستم متفاوت باشد.
* کلیه لوگو ها و آرم های ثبت شده تحت مالکیت مالکین مربوطه آن ها قرار دارد.
* با توجه به معماری استاندارد رایانه های شخصی، مقدار مشخصی از حافظه جهت استفاده درونی سیستم درنظر گرفته می شود و طبیعتا مقدار واقعی حافظه سیستم کم تر از مقدار اظهار شده خواهد بود.
* کارایی ارایه شده بر اساس مقادیر حداکثر نظری رابط است که توسط فروشنده چیپ ست یا سازمان هایی که مشخصات رابط را تعیین کردند، ارائه شده است. کارایی واقعی ممکن است بنا بر پیکربندی سیستم متفاوت باشد.
* کلیه لوگو ها و آرم های ثبت شده تحت مالکیت مالکین مربوطه آن ها قرار دارد.
* با توجه به معماری استاندارد رایانه های شخصی، مقدار مشخصی از حافظه جهت استفاده درونی سیستم درنظر گرفته می شود و طبیعتا مقدار واقعی حافظه سیستم کم تر از مقدار اظهار شده خواهد بود.
RESOURCES
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