Dimensions (WxHxD, mm)
2U 3-Node - Front access
447.8 x 87.5 x 500
CPU
AMD EPYC™ 9005 Series Processors
AMD EPYC™ 9004 Series Processors
Single processor per node, cTDP up to 240W
- At 30°C ambient, cTDP up to 300W
[Note] cTDP supported up to 400W under limited thermal conditions. Please contact our sales representatives for more details.
Socket
3 x LGA 6096
Socket SP5
Memory
36 x DIMM slots
DDR5 memory supported
12-Channel memory per processor
AMD EPYC™ 9005:
RDIMM: Up to 6400 MT/s
AMD EPYC™ 9004:
RDIMM: Up to 4800 MT/s
LAN
Front:
2 x Chassis Management LAN
Video
Integrated in ASPEED® AST2600 x 3
- 3 x VGA ports
Storage
Front hot-swap:
6 x 9.5mm E1.S Gen4 NVMe
Optional internal M.2 (CMTP192 x 3):
3 x M.2 (2280/22110), PCIe Gen4 x4
PCIe Expansion Slots
Riser Card CRSH01Q x 3:
- 3 x LP x16 (Gen5 x16)
Riser Card CRSH01R x 3:
- 3 x FHHL x16 (Gen5 x16)
3 x OCP NIC 3.0 (Gen5 x16)
- Support NCSI function
Front I/O
6 x USB 3.2 Gen1 ports (Type-A)
3 x VGA ports
3 x Power buttons with LED
3 x System status LEDs
3 x ID LEDs
2 x CMC ports
1 x CMC status LED
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4
Security Modules
1 x TPM header with SPI interface
-
Optional TPM2.0 kit:
CTM010
Power Supply[#1]
1+1 3000W 80 PLUS Titanium redundant power supplies [1]
AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 15.5A
DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 81A
+12Vsb/ 3A
- Max 2600W/ 200-220V~
+12.2V/ 213A
+12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+12.2V/ 245A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.
System Management
ASPEED
® AST2600 Baseboard Management Controller
ASPEED
® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS / BMC / CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 80x80x38mm (18,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
862 x 676 x 294 mm
Packaging Content
1 x H223-Z10-AAP1
3 x CPU heatsinks
1 x L-shape Rail kit
Part Numbers
- Barebone package: 6NH223Z10DR000ACP1*
- Motherboard: 9MZ13HD0UR-000-3*
- L-shape Rail kit: 25HB2-A86106-K0R
- CPU heatsink: 25ST1-553202-A0R
- Front panel board - CFPH030: 9CFPH030NR-00*
- Backplane board - CBP2060: 9CBP2060NR-00*
- Fan module: 25ST2-88382V-S1R
- Riser card - CRSH01Q: 9CRSH01QNR-00*
- Riser card - CRSH01R: 9CRSH01RNR-00*
- EDSFF riser card - CSPP010: 9CSPP010NR-00*
- LAN bridge board - CLSH13: 9CLSH13NR-00*
- Power supply: 25EP0-23000F-G1S
Optional parts:
- M.2 expansion card - CMTP192: 9CMTP192NR-00*
- RMA packaging: 6NH223Z10SR-RMA-A100
[#1] Power cords are not included with server packages. Customers are responsible for selecting appropriate power cords from the optional accessories or contacting sales for customization.
[#2] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.
[#3] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.
[#4] All trademarks and logos are the property of their respective owners.
