- Home
- Enterprise
- High Density Servers
- H263-S62-LAW1
H263-S62- LAW1
High Density Server - 5th/4th Gen Intel® Xeon® Scalable - 2U 4-Node DP 24-Bay Gen4 NVMe/SATA/SAS 3000W DLC
- Direct liquid cooling solution
- 2U 4-node rear access server system
- Dual 5th/4th Gen Intel® Xeon® Scalable Processors per node
- Dual Intel® Xeon® CPU Max Series per node
- 8-Channel DDR5 RDIMM, 16 x DIMMs per node
- Dual ROM Architecture
- 1 x CMC port
- 24 x 2.5" Gen4 NVMe/SATA/SAS hot-swap bays
- 4 x M.2 slots with PCIe Gen4 x4 interface (optional)
- 4 x LP PCIe Gen5 x16 slots
- 4 x OCP NIC 3.0 PCIe Gen5 x16 slots
- Dual 3000W 80 PLUS Titanium redundant power supply
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 840
440 x 87.5 x 840
Motherboard
MS63-HD1
CPU
5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor per node, TDP up to 385W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor per node, TDP up to 385W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
8 x LGA 4677
Socket E
Socket E
Chipset
Intel® C741
Memory
64 x DIMM slots
DDR5 memory supported
8-Channel memory architecture
5th Gen Intel® Xeon®:
RDIMM: Up to 5600 MT/s
4th Gen Intel® Xeon®:
RDIMM: Up to 4800 MT/s
Intel® Xeon® Max Series:
RDIMM: Up to 4800 MT/s
DDR5 memory supported
8-Channel memory architecture
5th Gen Intel® Xeon®:
RDIMM: Up to 5600 MT/s
4th Gen Intel® Xeon®:
RDIMM: Up to 4800 MT/s
Intel® Xeon® Max Series:
RDIMM: Up to 4800 MT/s
LAN
4 x 10/100/1000 Mbps Management LAN
1 x CMC Management LAN [1]
[1] Please refer to optional parts for ring topology support.
[Note] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
1 x CMC Management LAN [1]
[1] Please refer to optional parts for ring topology support.
[Note] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
Video
Integrated in Aspeed® AST2600 x 4
- 4 x VGA ports
- 4 x VGA ports
Storage
Front hot-swap:
24 x 2.5" Gen4 NVMe/SATA/SAS [1]
- (NVMe from CPU_1)
Optional internal M.2 (CMTP061 x 4):
4 x M.2 (2280/22110), PCIe Gen4 x4, from CPU_1
[1] SAS card is required to support SAS drives.
24 x 2.5" Gen4 NVMe/SATA/SAS [1]
- (NVMe from CPU_1)
Optional internal M.2 (CMTP061 x 4):
4 x M.2 (2280/22110), PCIe Gen4 x4, from CPU_1
[1] SAS card is required to support SAS drives.
SAS
Require SAS add-in cards
RAID
Intel® SATA RAID 0/1/10/5
Onboard VROC key header
Support optional RAID add-in cards
Onboard VROC key header
Support optional RAID add-in cards
PCIe Expansion Slots
Riser Card CRSH01U x 4:
- 4 x LP x16 (Gen5 x16), from CPU_0
4 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Support NCSI function
- 4 x LP x16 (Gen5 x16), from CPU_0
4 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Support NCSI function
Front I/O
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button
Rear I/O
8 x USB 3.2 Gen1 ports (Type-A)
4 x VGA ports
4 x MLAN ports
4 x ID buttons with LED
1 x CMC port
4 x VGA ports
4 x MLAN ports
4 x ID buttons with LED
1 x CMC port
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
- Optional TPM2.0 kit: CTM010
Power Supply
Dual 3000W 80 PLUS Titanium redundant power supply [1]
Available for 2+1 redundant power supply configuration (optional)
AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A
[1] The system power supply requires C19 power cord.
Available for 2+1 redundant power supply configuration (optional)
AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A
[1] The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 Baseboard Management Controller
Aspeed® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface
Aspeed® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
Additional certifications:
Windows Server 2022 (x64)
Additional certifications:
Windows Server 2022 (x64)
System Fans
4 x 80x80x38mm (18,300rpm)
Operating Properties
Operating temperature: 10°C to 40°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.
Packaging Dimensions
w/ cold plate loops: 1185 x 705 x 409 mm
w/o cold plate loops: 1176 x 709 x 322 mm
w/o cold plate loops: 1176 x 709 x 322 mm
Packaging Content
1 x H263-S62-LAW1
4 x CoolIT CPU cold plate loops
24 x Carriers
1 x 3-Section Rail kit
4 x CoolIT CPU cold plate loops
24 x Carriers
1 x 3-Section Rail kit
Part Numbers
- Barebone w/ cold plates (5th/4th Gen): 6NH263S62DR000LBW1*
- Barebone w/ cold plates (4th Gen): 6NH263S62DR000LAW1*
- Barebone w/o cold plates (5th/4th Gen): 6NH263S62DZ000LBW1*
- Barebone w/o cold plates (4th Gen): 6NH263S62DZ000LAW1*
- Motherboard: 9MS63HD1UR-000*
- 3-Section Rail kit: 25HB2-A66125-K0R
- CoolIT CPU cold plate loop: 25ST7-100006-C4R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH7O1: 9CBPH7O1NR-00*
- Fan module: 25ST2-88382P-S1R
- Riser card - CRSH01U: 9CRSH01UNR-00*
- Power supply: 25EP0-23000L-L0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 riser card - CMTP061: 9CMTP061NR-00*
- Ring topology kit (10-kit package): 6NH263S62S1000AAN11
- GIGABYTE CPU cold plate loop: 25H26-3S62000-E01X (QPA:4)
- GIGABYTE 2U4N Manifold: 25H27-3Z80000-E07X (1 set per rack)
- Motivair CPU cold plate loop: 25ST7-10000B-M4R (QPA:4)
- CoolIT leak sensor board: 6NH263S62S1000LAN11 (QPA:4)
- RMA packaging: 6NH263S62SR-RMA-L100
- Barebone w/ cold plates (4th Gen): 6NH263S62DR000LAW1*
- Barebone w/o cold plates (5th/4th Gen): 6NH263S62DZ000LBW1*
- Barebone w/o cold plates (4th Gen): 6NH263S62DZ000LAW1*
- Motherboard: 9MS63HD1UR-000*
- 3-Section Rail kit: 25HB2-A66125-K0R
- CoolIT CPU cold plate loop: 25ST7-100006-C4R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH7O1: 9CBPH7O1NR-00*
- Fan module: 25ST2-88382P-S1R
- Riser card - CRSH01U: 9CRSH01UNR-00*
- Power supply: 25EP0-23000L-L0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 riser card - CMTP061: 9CMTP061NR-00*
- Ring topology kit (10-kit package): 6NH263S62S1000AAN11
- GIGABYTE CPU cold plate loop: 25H26-3S62000-E01X (QPA:4)
- GIGABYTE 2U4N Manifold: 25H27-3Z80000-E07X (1 set per rack)
- Motivair CPU cold plate loop: 25ST7-10000B-M4R (QPA:4)
- CoolIT leak sensor board: 6NH263S62S1000LAN11 (QPA:4)
- RMA packaging: 6NH263S62SR-RMA-L100
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
SUPPORT
Driver
BIOS
Utility
Firmware
OS
- All
- All
- Windows Server 2022
- Windows Server 2019
- Linux
Chipset
Chipset
Version
Size
Date
Intel® Chipset Driver
Version : 10.1.19485.8386
3.81 MB
Jan 04, 2024
OS: Windows Server 2019,Windows Server 2022
RAID
RAID
Version
Size
Date
Intel® VROC
Intel® SATA RAID and Utility
Intel® SATA RAID and Utility
Version : 8.5.0.1593
99.21 MB
Jan 04, 2024
OS: Windows Server 2019,Windows Server 2022
Utility
BIOS
Description
Version
Size
Date
Include AMI SA50248 (CWE-119), and multiple feature updates.
Version : R07
29.22 MB
May 15, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
Because BIOS flashing is potentially risky, if you do not encounter problems using the current version of BIOS, it is recommended that you not flash the BIOS. To flash the BIOS, do it with caution. Inadequate BIOS flashing may result in system malfunction.
What is a BETA?
BETA describes a new version that is reliable yet may not include all the features of the final product. During this phase we are previewing new features and gathering customer input to insure our product provides the best experience possible.
Because BIOS flashing is potentially risky, if you do not encounter problems using the current version of BIOS, it is recommended that you not flash the BIOS. To flash the BIOS, do it with caution. Inadequate BIOS flashing may result in system malfunction.
What is a BETA?
BETA describes a new version that is reliable yet may not include all the features of the final product. During this phase we are previewing new features and gathering customer input to insure our product provides the best experience possible.
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
Utility
Description
Version
Size
Date
GSM CLI
Version : 2.1.77
147.89 MB
Sep 27, 2024
OS: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
OS: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
OS: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
Description
Version
Size
Date
BMC firmware with embedded GIGABYTE Management Console (AST2600)
Version : 13.06.09
123.77 MB
Sep 05, 2024
English
GIGABYTE Management Console Web GUI Tool
GCT Diagnostic Analyzer
GCT Diagnostic Analyzer
Version : 1.0
2519.27 MB
Aug 15, 2024
English
CMC Firmware (AST2520)
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Version : 12.41.36
83.16 MB
Nov 02, 2023
English
Manual
Description
Version
Size
Date
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
11.72 MB
Aug 12, 2024
English
Description
Version
Size
Date
OS Support List
Version : R12
0.22 MB
Jul 15, 2024
4th Generation Intel® Xeon® Scalable Processors
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
RESOURCES
News
Others
Back to H263-S62-LAW1
