G593-ZD1- LAX3

Rev. 1.x Rev. 3.x

HPC/AI Server - AMD EPYC™ 9004 - 5U DP NVIDIA HGX™ H200 8-GPU DLC

# AI # AI Training # AI Inference # HPC

Liquid-cooled NVIDIA HGX™ H200 8-GPU
CPU+GPU direct liquid cooling solution
900GB/s GPU-to-GPU bandwidth with NVIDIA^® NVLink^® and NVSwitch™
Dual AMD EPYC™ 9004 Series Processors
12-Channel DDR5 RDIMM, 24 x DIMMs
Dual ROM Architecture
2 x 10Gb/s LAN ports via Intel^® X710-AT2
2 x M.2 slots with PCIe Gen3 x4 and x1 interface
8 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays
4 x FHHL PCIe Gen5 x16 slots
8 x LP PCIe Gen5 x16 slots
4+2 3000W 80 PLUS Titanium redundant power supplies

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SPECIFICATIONS

Dimensions (WxHxD, mm)

5U
447 x 219.7 x 945

Motherboard

MZB3-G43

CPU

AMD EPYC™ 9005 Series Processors
AMD EPYC™ 9004 Series Processors

Dual processor, cTDP up to 400W^[1]

^[1]The ambient temperature is limited to 25°C when NVIDIA BlueField^®-3 DPUs are installed.

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

2 x LGA 6096
Socket SP5

Chipset

System on Chip

Memory

24 x DIMM slots
DDR5 memory supported
12-Channel memory per processor
RDIMM: Up to 4800 MT/s

LAN

Front:
2 x 10Gb/s LAN (1 x Intel^® X710-AT2)
- Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN

^[Note]When both MLAN ports are connected with cables, the front MLAN port will be set as the default.

Video

Integrated in Aspeed^® AST2600
- 1 x VGA port

Storage

Front hot-swap:
8 x 2.5" Gen5 NVMe/SATA/SAS-4^[1]
- (NVMe from PEX89104)

Internal M.2:
1 x M.2 (2280/22110), PCIe Gen3 x4, from CPU_1
1 x M.2 (2280/22110), PCIe Gen3 x1, from CPU_0

^[1]Storage card is required to support SATA and SAS drives.

SAS

Require SAS add-in cards

RAID

Require RAID add-in cards

Modular GPU

Liquid-cooled NVIDIA HGX™ H200 with 8 x SXM GPUs

PCIe Expansion Slots

Extension Board CPBG044 x 2:
- 8 x LP x16 (Gen5 x16), from PEX89104

Riser Card CPBGD20 x 2:
- 4 x FHHL x16 (Gen5 x16), from PEX89048

Front I/O

2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED

Rear I/O

MLAN board - CDB66:
1 x MLAN port

Backplane Board

Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s

Security Modules

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

4+2 3000W 80 PLUS Titanium redundant power supplies^[1]

AC Input:
- 100-120V~/ 16A, 50/60Hz
- 200-240V~/ 16A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 16A

DC Output:
- Max 1320W/ 100-110V~
+54V/ 24.4A
+12Vsb/ 3A
- Max 1500W/ 111-120V~
+54V/ 27.8A
+12Vsb/ 3A
- Max 2810W/ 200-207V~
+54V/ 52A
+12Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A

^[1]The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

Additional certifications:
Red Hat Enterprise Linux 9.4 or later
Windows Server 2022

System Fans

Motherboard:
2 x 40x40x56mm (32,000rpm)
3 x 60x60x56mm (24,000rpm)

PCIe slots:
4 x 40x40x28mm (25,000rpm)
2 x 40x40x56mm (32,000rpm)

GPU tray:
4 x 80x80x80mm (17,000rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

^[Note]To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.

Packaging Dimensions

1200 x 890 x 700 mm

Packaging Content

1 x G593-ZD1-LAX3
1 x L-shape Rail kit

Part Numbers

- Barebone w/ NVIDIA module (9005/9004): 6NG593ZD1DR000LBX3*
- Barebone w/ NVIDIA module (9004): 6NG593ZD1DR000LAX3*
- Motherboard: 9MZB3G43UR-000*
- L-shape Rail kit: 25HB2-A96102-K0R
- CoolIT CPU cold plate loop: 25ST7-20000I-C4R
- CoolIT GPU cold plate loop: 25ST7-3000G5-C4R
- CoolIT Switch cold plate loop: 25ST7-3000Z6-C4R
- Front panel board - CFPG540: 9CFPG540NR-00*
- Backplane board - CBPG680: 9CBPG680NR-00*
- Fan module 40x40x28mm: 25ST2-44282D-D0R
- Fan module 40x40x56mm: 25ST2-40562M-A0R
- Fan module 40x40x56mm: 25ST2-40562N-A0R
- Fan module 60x60x56mm: 25ST2-665620-S1R
- Fan module 80x80x80mm: 25ST2-808037-S1R
- Riser card - CPBGD20: 9CPBGD20NR-00*
- PCIe extension board - CPBG044: 9CPBG044NR-00*
- PCIe switch board - CPBG903: 9CPBG903NR-00*
- Rear MLAN board - CDB66: 9CDB66NR-00*
- Power supply: 25EP0-203K00-L0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R

SUPPORT

Downloads

Driver
BIOS
Utility
Firmware

Handleiding
Support List

Online Support

Driver

BIOS

Utility

Firmware

QVL

All
All
Windows Server 2022
Windows Server 2019
Linux

Chipset

Versie

Groote

Datum

Chipset driver for AMD EPYC 9004 series processors

Version : 4.06.27.500

16.58 MB

Nov 11, 2022

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SPECIFICATIONS

SUPPORT

RESOURCES

G593-ZD1-LAX3 (Rev. 1.x)

G593-ZD1- LAX3