Dimensions (WxHxD, mm)
3U 4-Node - Rear access
447 x 130.8 x 895
CPU
Intel® Xeon® 6 Processors
- Intel® Xeon® 6900-Series Processors
Dual processor per node
- With 2 x LP cards at 35°C ambient, TDP up to 500W
- With 4 x LP cards at 30°C ambient, TDP up to 500W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
8 x LGA 7529
Socket BR
Memory
96 x DIMM slots
DDR5 memory supported
12-Channel memory per processor
MRDIMM supported [1]
RDIMM: Up to 6400 MT/s
MRDIMM: Up to 8800 MT/s
[1] MRDIMMs are only supported with Intel® Xeon® 6 Processors with P-cores.
LAN
Rear (I/O board - CLNP319 x 4):
8 x 1Gb/s LAN (4 x Intel® I350-AM2)
- Support NCSI function
4 x 10/100/1000 Mbps Management LAN [1]
[1] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
Video
Integrated in ASPEED® AST2600 x 4
- 4 x Mini-DP
Storage
Front hot-swap:
8 x 2.5" Gen5 NVMe/SATA/SAS-4 [1]
- (NVMe from CPU_1)
[1] Storage card is required to support SATA and SAS drives.
SAS
Require SAS add-in cards
RAID
Require RAID add-in cards
Onboard VROC key header
PCIe Expansion Slots
PCIe Cable x 8:
- 8 x LP x16 (Gen5 x16), from CPU_1
Riser Card CRCH010 x 8:
- 8 x LP x16 (Gen5 x16), from CPU_0
Front I/O
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button
Rear I/O
I/O board - CLNP319 x 4:
8 x USB 3.2 Gen1 ports (Type-A)
4 x Mini-DP
8 x RJ45 ports
4 x MLAN ports
4 x ID buttons with LED
4 x System status LEDs
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
Security Modules
4 x TPM headers with SPI interface
-
Optional TPM2.0 kit:
CTM012
4 x PRoT connectors
(only enabled on RoT SKU)
Power Supply[#1]
Triple 3000W 80 PLUS Titanium redundant power supply [1]
AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A
[1] The system power supply requires C19 power cord.
System Management
ASPEED
® AST2600 Baseboard Management Controller
ASPEED
® AST2620 Chassis Management Controller
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 92x92x76mm
Operating Properties
Operating temperature: 10°C to 30°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1179 x 700 x 411 mm
Packaging Content
1 x H374-A81-AAW1
8 x CPU heatsinks
1 x Mini-DP to D-Sub cable
8 x Carriers
1 x L-shape Rail kit
Part Numbers
- Barebone package: 6NH374A81DR000AAW1*
- Motherboard: 9MA84HD0UR-000*
- L-shape Rail kit: 25HB2-A86108-K0R
- CPU heatsink: 25ST1-253210-C1R / 25ST1-253211-C1R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH081: 9CBPH081NR-00*
- Fan module: 25ST2-997620-A0R
- Riser card - CRCH010: 9CRCH010NR-00*
- I/O board - CLNP319: 9CLNP319NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-230009-L0S
Optional parts:
- RMA packaging: 6NH374A81SR-RMA-A100
[#1] Power cords are not included with server packages. Customers are responsible for selecting appropriate power cords from the optional accessories or contacting sales for customization.
[#2] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.
[#3] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.
[#4] All trademarks and logos are the property of their respective owners.
