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H274-S60- LAW1
High Density Server - Intel® Xeon® 6 Processors - 2U 4-Node DP 24-Bay Gen5 NVMe/SATA/SAS-4 DLC
- Direct liquid cooling solution
- 2U 4-node rear access server system
- Dual Intel® Xeon® 6 Processors per node, LGA 4710
- 8-Channel DDR5 RDIMM / MCR DIMM, 16 x DIMMs per node
- Dual ROM Architecture
- 8 x 1Gb/s LAN ports via Intel® I350-AM2
- 24 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays
- 4 x M.2 slots with PCIe Gen4 x4 interface (optional)
- 4 x LP PCIe Gen5 x16 slots
- 4 x OCP NIC 3.0 PCIe Gen5 x16 slots
- Dual 3000W 80 PLUS Titanium redundant power supply
* 사이트에서 제공되는 모든 자료는 참조용일 뿐입니다. 기가바이트는 사이트의 자료를 사전 통지없이 언제든지 수정할 권리를 지닙니다.
* 모든 상표와 로고는 해당 소유자의 자산입니다.
* PC의 표준 아키텍쳐에 의해, 메모리의 특정 부분이 시스템에 사용되어 실제 메모리 크기는 표준보다 적게 표시될 수 있습니다.
* 모든 상표와 로고는 해당 소유자의 자산입니다.
* PC의 표준 아키텍쳐에 의해, 메모리의 특정 부분이 시스템에 사용되어 실제 메모리 크기는 표준보다 적게 표시될 수 있습니다.
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 877
440 x 87.5 x 877
Motherboard
MS64-HD0
CPU
Intel® Xeon® 6 Processors
- Intel® Xeon® 6700E-Series Processors
- Intel® Xeon® 6700P-Series Processors (available Q1'25)
- Intel® Xeon® 6500P-Series Processors (available Q1'25)
Dual processor per node, TDP up to 300W at 35°C ambient
- No OCP cards at 35°C ambient, TDP up to 350W
- With OCP cards at 30°C ambient, TDP up to 350W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
- Intel® Xeon® 6700E-Series Processors
- Intel® Xeon® 6700P-Series Processors (available Q1'25)
- Intel® Xeon® 6500P-Series Processors (available Q1'25)
Dual processor per node, TDP up to 300W at 35°C ambient
- No OCP cards at 35°C ambient, TDP up to 350W
- With OCP cards at 30°C ambient, TDP up to 350W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
8 x LGA 4710
Socket E2
Socket E2
Chipset
System on Chip
Memory
64 x DIMM slots
DDR5 memory supported
8-Channel memory architecture
MCR DIMM supported [1]
RDIMM: Up to 6400 MT/s
MCR DIMM: Up to 8000 MT/s
[1] MCR DIMMs are only supported with Intel® Xeon® 6 Processors with P-cores.
DDR5 memory supported
8-Channel memory architecture
MCR DIMM supported [1]
RDIMM: Up to 6400 MT/s
MCR DIMM: Up to 8000 MT/s
[1] MCR DIMMs are only supported with Intel® Xeon® 6 Processors with P-cores.
LAN
Rear (I/O board - CLBH160 x 4):
8 x 1Gb/s LAN (4 x Intel® I350-AM2)
- Support NCSI function
4 x 10/100/1000 Mbps Management LAN [1]
[1] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
8 x 1Gb/s LAN (4 x Intel® I350-AM2)
- Support NCSI function
4 x 10/100/1000 Mbps Management LAN [1]
[1] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
Video
Integrated in Aspeed® AST2600 x 4
- 4 x Mini-DP
- 4 x Mini-DP
Storage
Front hot-swap:
24 x 2.5" Gen5 NVMe/SATA/SAS-4 [1]
- (NVMe & SATA from CPU_1)
Optional internal M.2 (CMTP160 x 4):
4 x M.2 (2260/2280/22110), PCIe Gen4 x4, from CPU_1
[1] SAS card is required to support SAS drives.
24 x 2.5" Gen5 NVMe/SATA/SAS-4 [1]
- (NVMe & SATA from CPU_1)
Optional internal M.2 (CMTP160 x 4):
4 x M.2 (2260/2280/22110), PCIe Gen4 x4, from CPU_1
[1] SAS card is required to support SAS drives.
SAS
Require SAS add-in cards
RAID
Require RAID add-in cards
Onboard VROC key headers
Onboard VROC key headers
PCIe Expansion Slots
Riser Card CRSH01R x 4:
- 4 x LP x16 (Gen5 x16), from CPU_0
4 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Support NCSI function
- 4 x LP x16 (Gen5 x16), from CPU_0
4 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Support NCSI function
Front I/O
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button
Rear I/O
I/O board - CLBH160 x 4:
8 x USB 3.2 Gen1 ports (Type-A)
4 x Mini-DP
8 x RJ45 ports
4 x MLAN ports
4 x System status LEDs
8 x USB 3.2 Gen1 ports (Type-A)
4 x Mini-DP
8 x RJ45 ports
4 x MLAN ports
4 x System status LEDs
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
Security Modules
4 x TPM headers with SPI interface
- Optional TPM2.0 kit: CTM012
4 x PRoT connectors (only enabled on RoT SKU)
- Optional TPM2.0 kit: CTM012
4 x PRoT connectors (only enabled on RoT SKU)
Power Supply
Dual 3000W 80 PLUS Titanium redundant power supply [1]
AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A
[1] The system power supply requires C19 power cord.
AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A
[1] The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 Baseboard Management Controller
Aspeed® AST2620 Chassis Management Controller
GIGABYTE Management Console web interface
Aspeed® AST2620 Chassis Management Controller
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 80x80x80mm (16,500rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
[Note] The ambient temperature and relative humidity of the environment depend on the inlet supply water temperature and the coolant flow rate.
[Note] If the relative humidity surpasses 60%, maintain the inlet water temperature between 40°C and 45°C to prevent condensation and ensure optimal system performance.
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
[Note] The ambient temperature and relative humidity of the environment depend on the inlet supply water temperature and the coolant flow rate.
[Note] If the relative humidity surpasses 60%, maintain the inlet water temperature between 40°C and 45°C to prevent condensation and ensure optimal system performance.
Packaging Dimensions
w/ cold plate loops: 1185 x 705 x 409 mm
w/o cold plate loops: 1176 x 709 x 322 mm
w/o cold plate loops: 1176 x 709 x 322 mm
Packaging Content
1 x H274-S60-LAW1
8 x CoolIT CPU cold plate loops
1 x Mini-DP to D-Sub cable
16 x Carriers
1 x 3-Section Rail kit
8 x CoolIT CPU cold plate loops
1 x Mini-DP to D-Sub cable
16 x Carriers
1 x 3-Section Rail kit
Part Numbers
- Barebone w/ cold plates: 6NH274S60DR000LAW1*
- Barebone w/o cold plates: 6NH274S60DZ000LAW1*
- Motherboard: 9MS64HD0UR-000*
- 3-Section Rail kit: 25HB2-A66125-K0R
- CoolIT CPU cold plate loop: 25ST7-10000E-C4R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH0O8: 9CBPH0O8NR-00*
- Fan module: 25ST2-888020-S1R
- Riser card - CRSH01R: 9CRSH01RNR-00*
- I/O board - CLBH160: 9CLBH160NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000V-L0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 riser card - CMTP160: 9CMTP160NR-00*
- CoolIT leak sensor board: 6NH274S60S1000LAW10 (QPA:4)
- RMA packaging: 6NH274S60SR-RMA-L100
- Barebone w/o cold plates: 6NH274S60DZ000LAW1*
- Motherboard: 9MS64HD0UR-000*
- 3-Section Rail kit: 25HB2-A66125-K0R
- CoolIT CPU cold plate loop: 25ST7-10000E-C4R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH0O8: 9CBPH0O8NR-00*
- Fan module: 25ST2-888020-S1R
- Riser card - CRSH01R: 9CRSH01RNR-00*
- I/O board - CLBH160: 9CLBH160NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000V-L0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 riser card - CMTP160: 9CMTP160NR-00*
- CoolIT leak sensor board: 6NH274S60S1000LAW10 (QPA:4)
- RMA packaging: 6NH274S60SR-RMA-L100
* 사이트에서 제공되는 모든 자료는 참조용일 뿐입니다. 기가바이트는 사이트의 자료를 사전 통지없이 언제든지 수정할 권리를 지닙니다.
* 모든 상표와 로고는 해당 소유자의 자산입니다.
* PC의 표준 아키텍쳐에 의해, 메모리의 특정 부분이 시스템에 사용되어 실제 메모리 크기는 표준보다 적게 표시될 수 있습니다.
* 모든 상표와 로고는 해당 소유자의 자산입니다.
* PC의 표준 아키텍쳐에 의해, 메모리의 특정 부분이 시스템에 사용되어 실제 메모리 크기는 표준보다 적게 표시될 수 있습니다.
SUPPORT
드라이버
BIOS
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Chipset
Chipset
버전
사이즈
날짜
Intel® Chipset Driver
Version : 10.1.19975.8620
6.41 MB
Oct 08, 2024
OS: Windows Server 2019,Windows Server 2022
LAN
LAN
버전
사이즈
날짜
Intel® LAN Driver and Utility
Version : 29.0
32.88 MB
Oct 08, 2024
OS: Windows Server 2019,Windows Server 2022
RAID
RAID
버전
사이즈
날짜
Intel® VROC
Intel® SATA RAID and Utility
Intel® SATA RAID and Utility
Version : 9.0.0.1837
101.14 MB
Oct 09, 2024
OS: Windows Server 2019,Windows Server 2022
Utility
Utility
버전
사이즈
날짜
Intel® QuickAssist Technology
Version : 2.0.w.2.2.0-0018_1
37.67 MB
Oct 09, 2024
OS: Windows Server 2019,Windows Server 2022
BIOS
설명
버전
사이즈
날짜
1) Fixes the bug about device resource related function.
2) Updates AST2600 driver to 1.13.05.
3) Updates VR solution to A8.
2) Updates AST2600 driver to 1.13.05.
3) Updates VR solution to A8.
Version : F18
51.23 MB
Nov 22, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
경고:
BIOS 플래시는 잠재적인 위험요소가 있기 때문에 현재 버전의 BIOS를 사용하는 동안 문제가 발생하지 않았다면 BIOS를 플래시하지 않는 것을 권장합니다. BIOS를 플래시하려면 조심해야 하며 부적절한 BIOS 플래시는 시스템에 고장을 일으킬 수 있습니다.
What is a BETA?
BETA는 최종 제품의 기능 중 일부는 포함되지 않을 수도 있습니다. BETA 서비스 동안에 제품의 새로운 특징을 미리 살펴볼 수 있으며 기가바이트의 제품을 최대한 경험할 수 있습니다.
BIOS 플래시는 잠재적인 위험요소가 있기 때문에 현재 버전의 BIOS를 사용하는 동안 문제가 발생하지 않았다면 BIOS를 플래시하지 않는 것을 권장합니다. BIOS를 플래시하려면 조심해야 하며 부적절한 BIOS 플래시는 시스템에 고장을 일으킬 수 있습니다.
What is a BETA?
BETA는 최종 제품의 기능 중 일부는 포함되지 않을 수도 있습니다. BETA 서비스 동안에 제품의 새로운 특징을 미리 살펴볼 수 있으며 기가바이트의 제품을 최대한 경험할 수 있습니다.
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유틸리티
설명
버전
사이즈
날짜
GSM CLI
Version : 2.1.78
147.79 MB
Dec 12, 2024
OS: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
OS: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
OS: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
설명
버전
사이즈
날짜
BMC firmware with embedded GIGABYTE Management Console (AST2600)
Version : 13.06.10
123.4 MB
Dec 18, 2024
English
GIGABYTE Management Console Web GUI Tool
GCT Diagnostic Analyzer
GCT Diagnostic Analyzer
Version : 1.0
2519.27 MB
Aug 15, 2024
English
매뉴얼
설명
버전
사이즈
날짜
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
11.72 MB
Aug 12, 2024
English
설명
버전
사이즈
날짜
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