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H263-S63- AAN1
High Density Server - 5th/4th Gen Intel® Xeon® Scalable - 2U 4-Node DP 8-Bay Gen4 NVMe/SATA/SAS 2600W
- 2U 4-node rear access server system
- Dual 5th/4th Gen Intel® Xeon® Scalable Processors per node
- 8-Channel DDR5 RDIMM, 16 x DIMMs per node
- Dual ROM Architecture
- 1 x CMC port
- 8 x 2.5" Gen4 NVMe/SATA/SAS hot-swap bays
- 4 x M.2 slots with PCIe Gen4 x4 interface (optional)
- 8 x LP PCIe Gen5 x16 slots
- 4 x LP PCIe Gen5 x16 slots (optional)
- 4 x OCP NIC 3.0 PCIe Gen5 x16 slots
- Dual 2600W 80 PLUS Titanium redundant power supply
* 사이트에서 제공되는 모든 자료는 참조용일 뿐입니다. 기가바이트는 사이트의 자료를 사전 통지없이 언제든지 수정할 권리를 지닙니다.
* 모든 상표와 로고는 해당 소유자의 자산입니다.
* PC의 표준 아키텍쳐에 의해, 메모리의 특정 부분이 시스템에 사용되어 실제 메모리 크기는 표준보다 적게 표시될 수 있습니다.
* 모든 상표와 로고는 해당 소유자의 자산입니다.
* PC의 표준 아키텍쳐에 의해, 메모리의 특정 부분이 시스템에 사용되어 실제 메모리 크기는 표준보다 적게 표시될 수 있습니다.
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 840
440 x 87.5 x 840
Motherboard
MS63-HD1
CPU
5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Dual processor per node, TDP up to 225W
- With 1 x LP and no OCP card at 30°C ambient, TDP up to 270W
- With 2 x LP and no OCP card at 25°C ambient, TDP up to 270W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
4th Generation Intel® Xeon® Scalable Processors
Dual processor per node, TDP up to 225W
- With 1 x LP and no OCP card at 30°C ambient, TDP up to 270W
- With 2 x LP and no OCP card at 25°C ambient, TDP up to 270W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
8 x LGA 4677
Socket E
Socket E
Chipset
Intel® C741
Memory
64 x DIMM slots
DDR5 memory supported
8-Channel memory architecture
5th Gen Intel® Xeon®:
RDIMM: Up to 5600 MT/s
4th Gen Intel® Xeon®:
RDIMM: Up to 4800 MT/s
DDR5 memory supported
8-Channel memory architecture
5th Gen Intel® Xeon®:
RDIMM: Up to 5600 MT/s
4th Gen Intel® Xeon®:
RDIMM: Up to 4800 MT/s
LAN
Rear:
4 x 10/100/1000 Mbps Management LAN
1 x CMC Management LAN [1]
[1] Please refer to optional parts for ring topology support.
[Note] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
4 x 10/100/1000 Mbps Management LAN
1 x CMC Management LAN [1]
[1] Please refer to optional parts for ring topology support.
[Note] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
Video
Integrated in Aspeed® AST2600 x 4
- 4 x VGA ports
- 4 x VGA ports
Storage
Front hot-swap:
8 x 2.5" Gen4 NVMe/SATA/SAS [1]
- (NVMe from CPU_1)
Optional internal M.2 (CMTP061 x 4):
4 x M.2 (2280/22110), PCIe Gen4 x4, from CPU_1
[1] SAS card is required to support SAS drives.
8 x 2.5" Gen4 NVMe/SATA/SAS [1]
- (NVMe from CPU_1)
Optional internal M.2 (CMTP061 x 4):
4 x M.2 (2280/22110), PCIe Gen4 x4, from CPU_1
[1] SAS card is required to support SAS drives.
SAS
Require SAS add-in cards
RAID
Intel® SATA RAID 0/1
Onboard VROC key header
Support optional RAID add-in cards
Onboard VROC key header
Support optional RAID add-in cards
PCIe Expansion Slots
Riser Card CRSH01T x 4:
- 4 x LP x16 (Gen5 x16), from CPU_0
Riser Card CRSH01U x 4:
- 4 x LP x16 (Gen5 x16), from CPU_0
Optional Riser Card CRSH310 x 4:
- 4 x LP x16 (Gen5 x16), from CPU_1
4 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Support NCSI function
- 4 x LP x16 (Gen5 x16), from CPU_0
Riser Card CRSH01U x 4:
- 4 x LP x16 (Gen5 x16), from CPU_0
Optional Riser Card CRSH310 x 4:
- 4 x LP x16 (Gen5 x16), from CPU_1
4 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Support NCSI function
Front I/O
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button
Rear I/O
8 x USB 3.2 Gen1 ports (Type-A)
4 x VGA ports
4 x MLAN ports
4 x ID buttons with LED
1 x CMC port
4 x VGA ports
4 x MLAN ports
4 x ID buttons with LED
1 x CMC port
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
- Optional TPM2.0 kit: CTM010
Power Supply
Dual 2600W 80 PLUS Titanium redundant power supply [1]
Available for 2+1 redundant power supply configuration (optional)
AC Input:
- 100-127V~/ 15A, 50-60Hz
- 200-240V~/ 15A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 15A
DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 82A
+12.2Vsb/ 4.5A
- Max 2600W/ 200-240V~ or 240Vdc Input
+12.2V/ 213A
+12.2Vsb/ 4.5A
[1] The system power supply requires C19 power cord.
Available for 2+1 redundant power supply configuration (optional)
AC Input:
- 100-127V~/ 15A, 50-60Hz
- 200-240V~/ 15A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 15A
DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 82A
+12.2Vsb/ 4.5A
- Max 2600W/ 200-240V~ or 240Vdc Input
+12.2V/ 213A
+12.2Vsb/ 4.5A
[1] The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 Baseboard Management Controller
Aspeed® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface
Aspeed® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
Additional certifications:
Windows Server 2022
Additional certifications:
Windows Server 2022
System Fans
8 x 80x80x38mm (18,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 49.53 kg
Packaging Dimensions
1180 x 779 x 300 mm
Packaging Content
1 x H263-S63-AAN1
8 x CPU heatsinks
24 x Carriers
1 x 3-Section Rail kit
8 x CPU heatsinks
24 x Carriers
1 x 3-Section Rail kit
Part Numbers
- Barebone package (5th/4th Gen): 6NH263S63DR000ABN1*
- Barebone package (4th Gen): 6NH263S63DR000AAN1*
- Motherboard: 9MS63HD1UR-000*
- 3-Section Rail kit: 25HB2-A66125-K0R
- CPU heatsink: 25ST1-453207-C1R/25ST1-453208-C1R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH081: 9CBPH081NR-00*
- Fan module: 25ST2-88382P-S1R/25ST2-88382Q-S1R
- Riser card - CRSH01T: 9CRSH01TNR-00*
- Riser card - CRSH01U: 9CRSH01UNR-00*
- LAN board - CLBH010: 9CLBH010NR-00*
- Power supply: 25EP0-226001-G1S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 riser card - CMTP061: 9CMTP061NR-00*
- Riser card - CRSH310: 9CRSH310NR-00*
- Ring topology kit (10-kit package): 6NH263S62S1000AAN11
- RMA packaging: 6NH263S63SR-RMA-A100
- Barebone package (4th Gen): 6NH263S63DR000AAN1*
- Motherboard: 9MS63HD1UR-000*
- 3-Section Rail kit: 25HB2-A66125-K0R
- CPU heatsink: 25ST1-453207-C1R/25ST1-453208-C1R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH081: 9CBPH081NR-00*
- Fan module: 25ST2-88382P-S1R/25ST2-88382Q-S1R
- Riser card - CRSH01T: 9CRSH01TNR-00*
- Riser card - CRSH01U: 9CRSH01UNR-00*
- LAN board - CLBH010: 9CLBH010NR-00*
- Power supply: 25EP0-226001-G1S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 riser card - CMTP061: 9CMTP061NR-00*
- Riser card - CRSH310: 9CRSH310NR-00*
- Ring topology kit (10-kit package): 6NH263S62S1000AAN11
- RMA packaging: 6NH263S63SR-RMA-A100
* 사이트에서 제공되는 모든 자료는 참조용일 뿐입니다. 기가바이트는 사이트의 자료를 사전 통지없이 언제든지 수정할 권리를 지닙니다.
* 모든 상표와 로고는 해당 소유자의 자산입니다.
* PC의 표준 아키텍쳐에 의해, 메모리의 특정 부분이 시스템에 사용되어 실제 메모리 크기는 표준보다 적게 표시될 수 있습니다.
* 모든 상표와 로고는 해당 소유자의 자산입니다.
* PC의 표준 아키텍쳐에 의해, 메모리의 특정 부분이 시스템에 사용되어 실제 메모리 크기는 표준보다 적게 표시될 수 있습니다.
SUPPORT
드라이버
BIOS
유틸리티
Firmware
OS
- All
- All
- Windows Server 2022
- Windows Server 2019
- Linux
Chipset
Chipset
버전
사이즈
날짜
Intel® Chipset Driver
Version : 10.1.19485.8386
3.81 MB
Jan 04, 2024
OS: Windows Server 2019,Windows Server 2022
RAID
RAID
버전
사이즈
날짜
Intel® VROC
Intel® SATA RAID and Utility
Intel® SATA RAID and Utility
Version : 8.5.0.1593
99.21 MB
Jan 04, 2024
OS: Windows Server 2019,Windows Server 2022
Utility
BIOS
설명
버전
사이즈
날짜
1. Updates RC 113.D55 (EagleStream uPLR3 BKC 2024 WW37).
2. Updates EMR Microcode:
EMR Production A*/R* Step:
m_87_c06f2_21000291.pdb
3. Updates SPR Microcode:
SPR Production E*/S* Step:
m_87_806f8_2b000620.pdb
SPR HBM Production B* Step:
m_10_806f8_2c0003e0.pdb
4. Includes security updates for
CVE-2024-21781, CVE-2024-21820,
CVE-2024-21829, CVE-2024-21850,
CVE-2024-21853, CVE-2024-21859,
CVE-2024-22185, CVE-2024-23599,
CVE-2024-23918, CVE-2024-23984,
CVE-2024-24968, CVE-2024-24985,
CVE-2024-25565, CVE-2024-25571,
CVE-2024-26021, CVE-2024-27457,
CVE-2024-28047, CVE-2024-30211,
CVE-2024-31068, CVE-2024-31155,
CVE-2024-31157, CVE-2024-33607,
CVE-2024-36242, CVE-2024-37020,
CVE-2024-39279.
Version : R10
29.79 MB
Jan 20, 2025
Include AMI SA50248 (CWE-119), and multiple feature updates.
Version : R07
29.22 MB
May 15, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
경고:
BIOS 플래시는 잠재적인 위험요소가 있기 때문에 현재 버전의 BIOS를 사용하는 동안 문제가 발생하지 않았다면 BIOS를 플래시하지 않는 것을 권장합니다. BIOS를 플래시하려면 조심해야 하며 부적절한 BIOS 플래시는 시스템에 고장을 일으킬 수 있습니다.
What is a BETA?
BETA는 최종 제품의 기능 중 일부는 포함되지 않을 수도 있습니다. BETA 서비스 동안에 제품의 새로운 특징을 미리 살펴볼 수 있으며 기가바이트의 제품을 최대한 경험할 수 있습니다.
BIOS 플래시는 잠재적인 위험요소가 있기 때문에 현재 버전의 BIOS를 사용하는 동안 문제가 발생하지 않았다면 BIOS를 플래시하지 않는 것을 권장합니다. BIOS를 플래시하려면 조심해야 하며 부적절한 BIOS 플래시는 시스템에 고장을 일으킬 수 있습니다.
What is a BETA?
BETA는 최종 제품의 기능 중 일부는 포함되지 않을 수도 있습니다. BETA 서비스 동안에 제품의 새로운 특징을 미리 살펴볼 수 있으며 기가바이트의 제품을 최대한 경험할 수 있습니다.
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
유틸리티
설명
버전
사이즈
날짜
GSM CLI
Version : 2.1.78
147.79 MB
Dec 12, 2024
OS: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
OS: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
OS: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
설명
버전
사이즈
날짜
BMC firmware with embedded GIGABYTE Management Console (AST2600)
Version : 13.06.12
123.6 MB
Dec 18, 2024
English
GIGABYTE Management Console Web GUI Tool
GCT Diagnostic Analyzer
GCT Diagnostic Analyzer
Version : 1.0
2519.27 MB
Aug 15, 2024
English
CMC Firmware (AST2520)
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Version : 12.41.36
83.16 MB
Nov 02, 2023
English
매뉴얼
설명
버전
사이즈
날짜
설명
버전
사이즈
날짜
OS Support List
Version : R12
0.22 MB
Jul 15, 2024
4th Generation Intel® Xeon® Scalable Processors
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
RESOURCES
Media Review
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