H231-H60

Rev. 100/A00

HPC/AI Server - 2nd/1st Intel^® Xeon^® Scalable - 2U 2-Node DP 2 x PCIe Gen3 GPUs

# AI # AI Training # AI Inference # Visual Computing # HPC # HCI # Hybrid/Private Cloud Server

Supports up to 2 x Dual slot Gen3 GPUs
NVIDIA^® validated GPU platform; Supports for NVIDIA^® Tesla^® GPUs
2U 2-node rear access server system
Dual 2nd/1st Gen Intel^® Xeon^® Scalable Processors per node
6-Channel DDR4 RDIMM/LRDIMM, 32 x DIMMs
Supports Intel^® Optane™ DC Persistent Memory
1 x CMC port
4 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
20 x 2.5" SATA/SAS hot-swappable bays
2 x LP PCIe Gen3 x16 slots
2 x LP PCIe Gen3 x8 slots
2 x OCP Gen3 x16 mezzanine slots
Dual 2200W 80 PLUS Platinum redundant power supply
Optimized performance with Mellanox Infiniband EDR 100G or Ethernet 100G products

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* 사이트에서 제공되는 모든 자료는 참조용일 뿐입니다. 기가바이트는 사이트의 자료를 사전 통지없이 언제든지 수정할 권리를 지닙니다.
* 모든 상표와 로고는 해당 소유자의 자산입니다.
* PC의 표준 아키텍쳐에 의해, 메모리의 특정 부분이 시스템에 사용되어 실제 메모리 크기는 표준보다 적게 표시될 수 있습니다.

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 2-Node - Rear access
440 x 87 x 820

Motherboard

MH61-HD5

CPU

2nd Generation Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® Scalable Processors
Dual processor per node, TDP up to 165W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Note: This device does not support Intel Omni-Path function.

Socket

Per Node:
2 x LGA 3647

Total:
4 x LGA 3647

Socket P

Chipset

Intel^® C621

Memory

Per node:
16 x DIMM slots

Total:
32 x DIMM slots

DDR4 memory supported only
6-channel memory architecture
RDIMM up to 64GB supported
LRDIMM up to 128GB supported
Supports Intel^® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MT/s

Maximum verified DCPMM configuration:

*Ambient temperature 35°C
*2nd Generation Intel^® Xeon^® Scalable processor 165W (Max.)
*DCPMM 256GB x2 pcs (Per Node)

DCPMM installation locations:
DIMM_P1_(G1, J1)

Note:
1. 2933MT/s memory is supported only with 2nd Generation Intel^® Xeon^® Scalable Processors.
2. Intel^® Optane™ DC Persistent Memory for 2nd Generation Intel^® Xeon^® Scalable Processors only.
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C.
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative.

LAN

Per node:
1 x 10/100/1000 Mbps Management port

Total:
2 x 10/100/1000 Mbps Management ports
1 x 10/100/1000 Mbps CMC port

Note: Please contact FAE if NCSI function of OCP mezzanine card is needed.

Video

Integrated in Aspeed^® AST2500 x 2
- 2 x VGA ports

Storage

Per node:
2 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
10 x 2.5" SATA/SAS hot-swappable bays

1 x Broadcom SAS35x24R expander

Default configuration supports:

2 x U.2 and 0 x SAS/SATA drives
Onboard SATA DOM support (PIN_7, PIN_8 or external cable)

Total:
4 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
20 x 2.5" SATA/SAS hot-swappable bays

2 x Broadcom SAS35x24R expander

Default configuration supports:

4 x U.2 and 0 x SAS/SATA drives

SAS card is required to enable the drive bays

RAID

For SATA drives:
Intel^® SATA RAID 0/1/5/10

For U.2 drives:
Intel^® Virtual RAID On CPU (VROC) RAID 0/1

Note: VROC module is for Intel^® SSD only.

Expansion Slots

Per node:
1 x PCIe x16 (Gen3 x16) FHFL slot, for GPUs
1 x PCIe x16 (Gen3 x16) low-profile slot
1 x PCIe x8 (Gen3 x8) low-profile slot

1 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth

Total:
2 x PCIe x16 (Gen3 x16) FHFL slots, for GPUs
2 x PCIe x16 (Gen3 x16) low-profile slots
2 x PCIe x8 (Gen3 x8) low-profile slots

2 x OCP mezzanine slots with PCIe Gen3 x16 bandwidth

Note: For the latest GPU QVL, please contact your GIGABYTE representative.

Internal I/O

Per node:
1 x TPM header

Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED

Total:
2 x Power buttons with LED
2 x ID buttons with LED
2 x Status LEDs
*1 x CMC status LED

*Only one CMC status LED per system.

Rear I/O

Per node:
2 x USB 3.0
1 x VGA
1 x MLAN
1 x ID LED

Total:
4 x USB 3.0
2 x VGA
2 x MLAN
2 x ID LEDs
*1 x CMC port

*Only one CMC port per system.

Backplane Board

Speed and bandwidth:
PCIe Gen3 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with LPC interface
- Optional TPM2.0 kit: CTM000

Power Supply

Dual 2200W 80 PLUS Platinum redundant power supply

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input: (Only for China)
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A

Note:
1) The system power supply requires C19 power cord.
2) 2000W 80 PLUS Titanium power supply as an option.

System Management

Aspeed^® AST2500 Baseboard Management Controller
Aspeed^® AST1250 Chassis Management Controller (-100/A00)
Aspeed^® AST2520 Chassis Management Controller (-B00)
Avocent^® MergePoint IPMI 2.0 web interface:

Network settings
Network security settings
Hardware information
Users control
Services settings
IPMI settings
Sessions control
LDAP settings
Power control
Fan profiles
Voltages, fans and temperatures monitoring
System event log
Events management (platform events, trap settings, email settings)
Serial Over LAN
vKVM & vMedia (HTML5)

OS Compatibility

For Skylake processors:

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later

Red Hat Enterprise Linux 6.9 or later
Red Hat Enterprise Linux 7.3 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 11 SP4 or later
SUSE Linux Enterprise Server 12 SP2 or later
SUSE Linux Enterprise Server 15 or later

Ubuntu 16.04.1 LTS or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

For Cascade Lake processors:

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later

Red Hat Enterprise Linux 7.6 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 12 SP3 or later
SUSE Linux Enterprise Server 15 or later

Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

System Fans

8 x 80x80x38mm (16,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Note: Please contact Technical Support for more information about optimized GPU system operating temperature.

Weight

30 kg (full packaging)

Packaging Dimensions

1167 x 700 x 309 mm

Packaging Content

1 x H231-H60
4 x CPU heatsinks
1 x Rail kit
1 x VROC module
4 x Non-Fabric CPU carriers

Part Numbers

- Barebone package: 6NH231H60MR-00*
- Motherboard: 9MH61HD5NR-00
- VROC module: 25FD0-R181N0-10R
- Rail kit: 25HB2-NJ2102-N1R
- CPU heatsink: 25ST1-253208-F2R/25ST1-253209-F2R
- Backplane board - CBPH0O0: 9CBPH0O0NR-NJ
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power supply: 25EP0-222001-D0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/15A (US): 25CP1-018300-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- Ring topology kit: 6NH23NR48SR-00

SUPPORT

다운로드

드라이버
BIOS
유틸리티
Firmware

매뉴얼
Support List

Online Support

드라이버

BIOS

유틸리티

Firmware

QVL

All
All
Windows Server 2019
Windows Server 2016 64bit
Windows Server 2012 R2 64bit
Linux

Chipset

버전

사이즈

날짜

Intel^® Chipset Driver

Version : 10.1.17861.8101

3.34 MB

Apr 18, 2019

H231-H60

SPECIFICATIONS

SUPPORT

RESOURCES

H231-H60 (Rev. 100/A00)