G593-SD1- LAX3

HPC/AI Server - 5th/4th Gen Intel^® Xeon^® Scalable - 5U DP NVIDIA HGX™ H200 8-GPU DLC

# AI # AI Training # AI Inference # HPC

Liquid-cooled NVIDIA HGX™ H200 8-GPU
CPU+GPU direct liquid cooling solution
900GB/s GPU-to-GPU bandwidth with NVIDIA^® NVLink^® and NVSwitch™
Dual 5th/4th Gen Intel^® Xeon^® Scalable Processors
Dual Intel^® Xeon^® CPU Max Series
8-Channel DDR5 RDIMM, 32 x DIMMs
Dual ROM Architecture
Compatible with NVIDIA BlueField^®-3 DPUs/SuperNICs
2 x 10Gb/s LAN ports via Intel^® X710-AT2
8 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays
4 x FHHL PCIe Gen5 x16 slots
8 x LP PCIe Gen5 x16 slots
4+2 3000W 80 PLUS Titanium redundant power supplies

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* 사이트에서 제공되는 모든 자료는 참조용일 뿐입니다. 기가바이트는 사이트의 자료를 사전 통지없이 언제든지 수정할 권리를 지닙니다.
* 모든 상표와 로고는 해당 소유자의 자산입니다.
* PC의 표준 아키텍쳐에 의해, 메모리의 특정 부분이 시스템에 사용되어 실제 메모리 크기는 표준보다 적게 표시될 수 있습니다.

SPECIFICATIONS

Dimensions (WxHxD, mm)

5U
447 x 219.7 x 945

Motherboard

MSB3-G41

CPU

5th Generation Intel^® Xeon^® Scalable Processors
4th Generation Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® CPU Max Series

Dual processor, TDP up to 350W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

2 x LGA 4677
Socket E

Chipset

Intel^® C741

Memory

32 x DIMM slots
DDR5 memory supported
8-Channel memory per processor

5th Gen Intel^® Xeon^®:
RDIMM: Up to 5600 MT/s (1DPC), 4400 MT/s (2DPC)

4th Gen Intel^® Xeon^®:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)

Intel^® Xeon^® Max Series:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)

LAN

Front (I/O board - CDCG120):
2 x 10Gb/s LAN (1 x Intel^® X710-AT2)
- Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN

^[Note]When both MLAN ports are connected with cables, the front MLAN port will be set as the default.

Video

Integrated in Aspeed^® AST2600
- 1 x VGA port

Storage

Front hot-swap:
8 x 2.5" Gen5 NVMe/SATA/SAS-4^[1]
- (NVMe from PEX89104)

^[1]SAS card is required to support SAS drives.

SAS

Require SAS add-in cards

RAID

Intel^® SATA RAID 0/1/10/5

Support optional RAID add-in cards

Modular GPU

Liquid-cooled NVIDIA HGX™ H200 with 8 x SXM GPUs

PCIe Expansion Slots

Extension Board CPBG044 x 2:
- 8 x LP x16 (Gen5 x16), from PEX89104

Riser Card CPBGD20 x 2:
- 4 x FHHL x16 (Gen5 x16), from PEX89048

Front I/O

I/O board - CDCG120:
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED

Rear I/O

MLAN board - CDB66:
1 x MLAN port

Backplane Board

Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s

Security Modules

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

4+2 3000W 80 PLUS Titanium redundant power supplies^[1]

AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 14A

DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A

^[1]The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

Additional certifications:
Red Hat Enterprise Linux 9.2 or later
Windows Server 2022

System Fans

Motherboard:
2 x 40x40x28mm (25,000rpm)
3 x 60x60x56mm (24,000rpm)

PCIe slots:
4 x 40x40x28mm (25,000rpm)
2 x 40x40x56mm (32,000rpm)

GPU tray:
4 x 80x80x80mm (17,000rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

^[Note]To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.

Packaging Dimensions

1200 x 890 x 700 mm

Packaging Content

1 x G593-SD1-LAX3
6 x Carriers
1 x L-shape Rail kit

Part Numbers

- Barebone w/ NVIDIA module: 6NG593SD1DR000LBX3*
- Motherboard: 9MSB3G41NR-000*
- L-shape Rail kit: 25HB2-A96102-K0R
- CoolIT CPU cold plate loop: 25ST7-100009-C4R
- CoolIT GPU cold plate loop: 25ST7-3000G5-C4R
- CoolIT Switch cold plate loop: 25ST7-3000Z6-C4R
- Backplane board - CBPG680: 9CBPG680NR-00*
- Fan module 40x40x28mm: 25ST2-44282D-D0R
- Fan module 40x40x56mm: 25ST2-40562M-A0R
- Fan module 60x60x56mm: 25ST2-665620-S1R
- Fan module 80x80x80mm: 25ST2-808037-S1R
- Riser card - CPBGD20: 9CPBGD20NR-00*
- I/O board - CDCG120: 9CDCG120UR-00*
- PCIe extension board - CPBG044: 9CPBG044NR-00*
- PCIe switch board - CPBG903: 9CPBG903NR-00*
- Rear MLAN board - CDB66: 9CDB66NR-00*
- Power supply: 25EP0-23000J-D0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R

SUPPORT

다운로드

드라이버
BIOS
유틸리티
Firmware

매뉴얼
Support List

Online Support

드라이버

BIOS

유틸리티

Firmware

QVL

All
All
Windows Server 2022
Windows Server 2019
Linux

Chipset

버전

사이즈

날짜

Intel^® Chipset Driver

Version : 10.1.19485.8386

3.81 MB

Jan 04, 2024

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SPECIFICATIONS

SUPPORT

RESOURCES

G593-SD1-LAX3

G593-SD1- LAX3