E163-S30- AAB1

Edge Server - 5th/4th Gen Intel^® Xeon^® Scalable - 1U UP 2-Bay Gen4 NVMe/SATA/SAS

# Networking # Edge # Hybrid/Private Cloud Server

Single 5th/4th Gen Intel^® Xeon^® Scalable Processors
Single Intel^® Xeon^® CPU Max Series
8-Channel DDR5 RDIMM, 16 x DIMMs
Dual ROM Architecture
1 x 1Gb/s LAN port via Intel^® I210-AT
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
1 x M.2 slot with PCIe Gen3 x4 interface
2 x FHHL PCIe Gen5 x16 slots
2 x OCP 3.0 Gen5 x16 slots
1+1 800W 80 PLUS Platinum redundant power supplies

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* ここに記載されている全ての資料は参考用です。 GIGABYTEは、予告なしに変更する場合があります。
* パフォーマンスについては、インターフェイス仕様の理論上の最大値に基づいています。実際のパフォーマンスは、システム構成によって異なる場合があります。
* 記載されている会社名、商品名、およびロゴは各社の商標または登録商標です。
* メモリー容量は、システムリソースに予約され実際の搭載メモリーより少なくなる場合があります。

SPECIFICATIONS

Dimensions (WxHxD, mm)

1U
438 x 43.5 x 520

Motherboard

MS33-DC0

CPU

5th Generation Intel^® Xeon^® Scalable Processors
4th Generation Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® CPU Max Series
Single processor, TDP up to 350W

Socket

1 x LGA 4677
Socket E

Chipset

Intel^® C741

Memory

16 x DIMM slots
DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported

5th Gen Intel^® Xeon^®: Up to *5600 MT/s (1DPC), 4400 MT/s (2DPC)
4th Gen Intel^® Xeon^®: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
Intel^® Xeon^® Max Series: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)

*5600 MT/s support under 2DPC configuration requires verified memory and BIOS setup. Please refer to the QVL for more information.

LAN

Rear side:
1 x 1Gb/s LAN port (1 x Intel^® I210-AT)
Supports NCSI function

1 x 10/100/1000 Mbps Management LAN

Video

Integrated in Aspeed^® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Storage

Front side:
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays

SAS card is required for SAS devices support

SAS

Depends on SAS add-in cards

RAID

Intel^® SATA RAID 0/1

Expansion Slots

Riser Card CRS101O:
- 1 x PCIe x16 (Gen5 x16) FHHL slot, from CPU

Riser Card CRS101P:
- 1 x PCIe x16 (Gen5 x16) FHHL slot, from CPU

2 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU
Support NCSI function

1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from PCH
- Supports 2280/22110 cards

Internal I/O

1 x TPM header
1 x VROC connector

Front I/O

1 x USB 3.2 Gen1
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x LAN activity LED
1 x Storage activity LED
1 x System status LED

Rear I/O

2 x USB 3.2 Gen1
1 x Mini-DP
1 x RJ45
1 x MLAN
1 x ID button with LED

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

1+1 800W 80 PLUS Platinum redundant power supplies

AC Input:
- 100-240V~/ 10-4A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 4.5A

DC Output:
- Max 800W
+12V/ 66A
+12Vsb/ 2.5A

Note: The default power supply is based on a basic system configuration. Please contact with technical representatives to determine the best power supply selection for your system configuration requirements and preferred efficiency.

System Management

Aspeed^® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

Additional certifications:
Windows Server 2022 (x64)

System Fans

5 x 40x40x56mm (30,000rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 13.2 kg
Gross Weight: 15.2 kg

Packaging Dimensions

782 x 588 x 212 mm

Packaging Content

1 x E163-S30-AAB1
1 x CPU heatsink
1 x Mini-DP to D-Sub cable
3 x Carriers

Note: Rail kit not included. Please refer to optional parts for compatible rail kit.

Part Numbers

- Barebone package (5th/4th Gen): 6NE163S30DR000ABB1*
- Barebone package (4th Gen): 6NE163S30DR000AAB1*
- Motherboard: 9MS33DC0UR-000
- CPU heatsink: 25ST1-4Z3200-S7R
- M.2 heatsink: 12SP2-11000E-00R
- Front panel board - CFP1000: 9CFP1000NR-00
- Backplane board - CBP2023: 9CBP2023NR-00
- Fan module: 25ST2-40562E-A0R
- Riser card - CRS101O: 9CRS101ONR-00
- Riser card - CRS101P: 9CRS101PNR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-208004-L0S

Optional parts:

- 2-Section Rail kit (385-480mm): 25HB2-3A0204-K0R (MOQ: 500)
- 2-Section Rail kit (660-840mm): 25HB2-3A0203-K0R

SUPPORT

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サポートリスト

Online Support

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BIOS

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Firmware

QVL

All
All
Windows Server 2022
Windows Server 2019
Linux

Chipset

バージョン

サイズ

日付

Intel^® Chipset Driver

Version : 10.1.19485.8386

3.81 MB

Jan 04, 2024

E163-S30- AAB1 .svg-ArrowDownSolid-color { fill: #707070 }

SPECIFICATIONS

SUPPORT

RESOURCES

E163-S30-AAB1

E163-S30- AAB1