H273-Z81- AAW1

Rev. 1.x Rev. 3.x

High Density Server - AMD EPYC™ 9004 - 2U 4-Node DP 8-Bay Gen4 NVMe/SATA/SAS 3000W

# HCI # Hybrid/Private Cloud Server

2U 4-node rear access server system
Dual AMD EPYC™ 9004 Series Processors per node
12-Channel DDR5 RDIMM, 24 x DIMMs per node
Dual ROM Architecture
8 x 1Gb/s LAN ports via Intel^® I350-AM2
8 x 2.5" Gen4 NVMe/SATA/SAS hot-swap bays
4 x M.2 slots with PCIe Gen4 x4 interface (optional)
8 x LP PCIe Gen5 x16 slots
4 x OCP NIC 3.0 PCIe Gen5 x16 slots
Dual 3000W 80 PLUS Titanium redundant power supply

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* ここに記載されている全ての資料は参考用です。 GIGABYTEは、予告なしに変更する場合があります。
* パフォーマンスについては、インターフェイス仕様の理論上の最大値に基づいています。実際のパフォーマンスは、システム構成によって異なる場合があります。
* 記載されている会社名、商品名、およびロゴは各社の商標または登録商標です。
* メモリー容量は、システムリソースに予約され実際の搭載メモリーより少なくなる場合があります。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Rear access
440 x 87.5 x 877

Motherboard

MZ83-HD0

CPU

AMD EPYC™ 9005 Series Processors
AMD EPYC™ 9004 Series Processors

Dual processor per node, cTDP up to 240W
- With 1 x low-profile card at ambient 30°C, cTDP up to 300W
- With OCP NIC 3.0 at ambient 25°C, cTDP up to 300W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

8 x LGA 6096
Socket SP5

Chipset

System on Chip

Memory

96 x DIMM slots
DDR5 memory supported
12-Channel memory architecture
RDIMM: Up to 4800 MT/s

LAN

Rear:
8 x 1Gb/s LAN (4 x Intel^® I350-AM2)
- Support NCSI function

4 x 10/100/1000 Mbps Management LAN

^[Note]Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.

Video

Integrated in Aspeed^® AST2600 x 4
- 4 x Mini-DP

Storage

Front hot-swap:
8 x 2.5" Gen4 NVMe/SATA/SAS^[1]
- (NVMe from CPU_1)
- (SATA from CPU_0)

Optional internal M.2 (CMTP192):
4 x M.2 (2280/22110), PCIe Gen4 x4, from CPU_0

^[1]SAS card is required to support SAS drives.

SAS

Require SAS add-in cards

RAID

Require RAID add-in cards

PCIe Expansion Slots

Riser Card CRSH01Q x 4:
- 4 x LP x16 (Gen5 x16), from CPU_0

Riser Card CRSH01R x 4:
- 4 x LP x16 (Gen5 x16), from CPU_0

4 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Support NCSI function

Front I/O

4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button

Rear I/O

8 x USB 3.2 Gen1 ports (Type-A)
4 x Mini-DP
8 x RJ45 ports
4 x MLAN ports
4 x System status LEDs

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

Security Modules

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

Dual 3000W 80 PLUS Titanium redundant power supply^[1]

AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 16A

DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A

^[1]The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 Baseboard Management Controller
Aspeed^® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

Additional certifications:
Citrix Hypervisor 8.2 LTSR CU1
VMware ESXi 8.0
Windows Server 2022 (x64)

System Fans

4 x 80x80x80mm (16,900rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 51.6 kg
Gross Weight: 52.48 kg

Packaging Dimensions

1179 x 700 x 380 mm

Packaging Content

1 x H273-Z81-AAW1
8 x CPU heatsinks
1 x Mini-DP to D-Sub cable
1 x 3-Section Rail kit

Part Numbers

- Barebone package (EPYC 9005/9004): 6NH273Z81DR000ABW1*
- Barebone package (EPYC 9004): 6NH273Z81DR000AAW1*
- Motherboard: 9MZ83HD0UR-000*
- 3-Section Rail kit: 25HB2-A66125-K0R
- CPU heatsink: 25ST1-25320N-M1R/25ST1-25320Q-M1R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH081: 9CBPH081NR-00*
- Fan module: 25ST2-888022-A0R
- Riser card - CRSH01Q: 9CRSH01QNR-00*
- Riser card - CRSH01R: 9CRSH01RNR-00*
- I/O board (incl. LAN chip) - CLBH160: 9CLBH160NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-230009-L0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 expansion card - CMTP192: 9CMTP192NR-00*
- RMA packaging: 6NH273Z81SR-RMA-A100

SUPPORT

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Chipset

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日付

Chipset driver for AMD EPYC 9004 series processors

Version : 4.06.27.500

16.58 MB

Nov 11, 2022

H273-Z81- AAW1 .svg-ArrowDownSolid-color { fill: #707070 }

SPECIFICATIONS

SUPPORT

RESOURCES

H273-Z81-AAW1 (Rev. 1.x)

H273-Z81- AAW1