H223-S10-AAP1

High Density Server - 5th/4th Gen Intel^® Xeon^® Scalable - 2U 3-Node UP 6-Bay E1.S Gen4 NVMe

# HPC # HCI # Edge # Hybrid/Private Cloud Server

2U 3-node front access server system
Single 5th/4th Gen Intel^® Xeon^® Scalable Processors per node
Single Intel^® Xeon^® CPU Max Series per node
8-Channel DDR5 RDIMM, 24 x DIMMs
Dual ROM Architecture
2 x CMC ports
6 x 9.5mm E1.S Gen4 NVMe hot-swappable bays
3 x M.2 slots with SATA interface
6 x FHHL PCIe Gen5 x16 slots
3 x LP PCIe Gen5 x16 slots
3 x LP PCIe Gen5 x8 slots
1+1 3000W 80 PLUS Titanium redundant power supplies

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* ここに記載されている全ての資料は参考用です。 GIGABYTEは、予告なしに変更する場合があります。
* パフォーマンスについては、インターフェイス仕様の理論上の最大値に基づいています。実際のパフォーマンスは、システム構成によって異なる場合があります。
* 記載されている会社名、商品名、およびロゴは各社の商標または登録商標です。
* メモリー容量は、システムリソースに予約され実際の搭載メモリーより少なくなる場合があります。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 3-Node - Front access
447.8 x 87.5 x 500

Motherboard

MS13-HD0

CPU

5th Generation Intel^® Xeon^® Scalable Processors
4th Generation Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® CPU Max Series
Single processor per node

TDP up to 350W at ambient 35°C with 1 x PCIe slot occupied
TDP up to 350W at ambient 30°C with 2 x PCIe slots occupied
TDP up to 300W at ambient 35°C with 3 x PCIe slots occupied
TDP up to 300W at ambient 30°C with 4 x PCIe slots occupied

Please contact technical support for more details.

Socket

Per Node:
1 x LGA 4677

Total:
3 x LGA 4677

Socket E

Chipset

Intel^® C741

Memory

Per node:
8 x DIMM slots

Total:
24 x DIMM slots

DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported

5th Gen Intel^® Xeon^®: Up to 5600 MT/s
4th Gen Intel^® Xeon^®: Up to 4800 MT/s
Intel^® Xeon^® Max Series: Up to 4800 MT/s

LAN

Total:
2 x CMC ports

Video

Integrated in Aspeed^® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Management chip on CMC board:
Integrated in Aspeed^® AST2520A2-GP

Storage

Per node:
2 x 9.5mm E1.S Gen4 NVMe hot-swappable bays

Total:
6 x 9.5mm E1.S Gen4 NVMe hot-swappable bays

SAS

N/A

RAID

N/A

Expansion Slots

Per node:
Riser Card CRSH02D:
- 2 x PCIe x16 (Gen5 x16) FHHL slots

Riser Card CRSH02E:
- 1 x PCIe x16 (Gen5 x16) low-profile slot
- 1 x PCIe x16 (Gen5 x8) low-profile slot

1 x M.2 slot (CFPH010):
- M-key
- SATA, from PCH
- Supports 2242/2260/2280/22110 cards

Total:
Riser Card CRSH02D x 3:
- 6 x PCIe x16 (Gen5 x16) FHHL slots

Riser Card CRSH02E x 3:
- 3 x PCIe x16 (Gen5 x16) low-profile slots
- 3 x PCIe x16 (Gen5 x8) low-profile slots

3 x M.2 slots (CFPH010):
- M-key
- SATA, from PCH
- Support 2242/2260/2280/22110 cards

Internal I/O

Per node:
1 x TPM header
1 x VROC connector

Front I/O

Per node:
1 x USB 3.2 Gen1 (Type-C)
1 x Mini-DP
1 x Power button with LED
1 x System status LED
1 x ID LED

Total:
3 x USB 3.2 Gen1 (Type-C)
3 x Mini-DP
3 x Power buttons with LED
3 x System status LEDs
3 x ID LEDs
2 x CMC ports
1 x CMC status LED

Rear I/O

N/A

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4

TPM

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

1+1 3000W 80 PLUS Titanium redundant power supplies

AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 15.5A

DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 81A
+12Vsb/ 3A
- Max 2600W/ 200-220V~
+12.2V/ 213A
+12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+12.2V/ 245A
+12Vsb/ 3A

Note: The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

Additional certifications:
Windows Server 2022 (x64)

System Fans

4 x 80x80x38mm (18,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 17.2 kg
Gross Weight: 29 kg

Packaging Dimensions

857 x 670 x 280 mm

Packaging Content

1 x H223-S10-AAP1
3 x CPU heatsinks
1 x Mini-DP to D-Sub cable
9 x Carriers
1 x L-shape Rail kit

Part Numbers

- Barebone package (5th/4th Gen): 6NH223S10DR000ABP1*
- Barebone package (4th Gen): 6NH223S10DR000AAP1*
- Motherboard: 9MS13HD0UR-000
- L-shape Rail kit: 25HB2-A86105-K0R
- CPU heatsink: 25ST1-453207-C1R
- Front panel board - CFPH030: 9CFPH030NR-00
- Backplane board - CBP2060: 9CBP2060NR-00
- Fan module: 25ST2-88382V-S1R
- Riser card - CRSH02D: 9CRSH02DNR-00
- Riser card - CRSH02E: 9CRSH02ENR-00
- EDSFF riser card - CSPP010: 9CSPP010NR-00
- I/O board with M.2 slot - CFPH010: 9CFPH010NR-00
- LAN bridge board - CLSH13: 9CLSH13NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000F-G1S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- RMA packaging: 6NH223S10SR-RMA-A100

SUPPORT

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Chipset

バージョン

サイズ

日付

Intel^® Chipset Driver

Version : 10.1.19485.8386

3.81 MB

Jan 04, 2024

H223-S10-AAP1

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H223-S10-AAP1