G363-ZR0- LAX1

Rev. 1.x Rev. 3.x

HPC/AI Server - AMD EPYC™ 9004 - 3U DP HGX™ H100 4-GPU DLC

# AI # AI Training # AI Inference # HPC

CPU+GPU Direct liquid cooling solution
Liquid-cooled NVIDIA HGX™ H100 4-GPU
4th-generation NVIDIA^® NVLink^® 900GB/s
Dual AMD EPYC™ 9004 Series Processors
12-Channel DDR5 RDIMM, 24 x DIMMs
Dual ROM Architecture
2 x 10Gb/s LAN ports via Broadcom^® BCM57416
2 x 1Gb/s LAN ports via Intel^® I350-AM2
4 x 2.5" Gen5 NVMe/SATA/SAS hot-swap bays
4 x 2.5" Gen5 NVMe hot-swap bays
1 x M.2 slot with PCIe Gen4 x4 interface
6 x LP PCIe Gen5 x16 slots
2+1 3000W 80 PLUS Titanium redundant power supplies

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* ここに記載されている全ての資料は参考用です。 GIGABYTEは、予告なしに変更する場合があります。
* パフォーマンスについては、インターフェイス仕様の理論上の最大値に基づいています。実際のパフォーマンスは、システム構成によって異なる場合があります。
* 記載されている会社名、商品名、およびロゴは各社の商標または登録商標です。
* メモリー容量は、システムリソースに予約され実際の搭載メモリーより少なくなる場合があります。

SPECIFICATIONS

Dimensions (WxHxD, mm)

3U
448 x 130 x 800

Motherboard

MZ83-HD1

CPU

AMD EPYC™ 9005 Series Processors
AMD EPYC™ 9004 Series Processors

Dual processor, cTDP up to 400W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

2 x LGA 6096
Socket SP5

Chipset

System on Chip

Memory

24 x DIMM slots
DDR5 memory supported
12-Channel memory architecture
RDIMM: Up to 4800 MT/s

LAN

Front (I/O board - CLBH160):
2 x 1Gb/s LAN (1 x Intel^® I350-AM2)
- Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Rear:
2 x 10Gb/s LAN (1 x Broadcom^® BCM57416)
- Support NCSI function

Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN

^[Note]When both MLAN ports are connected with cables, the front MLAN port will be set as the default.

Video

Integrated in Aspeed^® AST2600
- 1 x Mini-DP

Storage

Front hot-swap:
4 x 2.5" Gen5 NVMe/SATA/SAS^[1]
4 x 2.5" Gen5 NVMe
- (4 x NVMe from CPU_0, 4 x NVMe from CPU_1)
- (SATA from CPU_0)

Internal M.2 (CMTP192):
1 x M.2 (2280/22110), PCIe Gen4 x4, from CPU_0

^[1]SAS card is required to support SAS drives.

SAS

Require SAS add-in cards

RAID

Require RAID add-in cards

Modular GPU

Liquid-cooled NVIDIA HGX™ H100 with 4 x SXM5 GPUs

PCIe Expansion Slots

Front:
1 x LP x16 (Gen5 x16), from CPU_0
1 x LP x16 (Gen5 x16), from CPU_1

1 x OCP NIC 3.0, from CPU_0, disabled

Rear:
4 x LP x16 (Gen5 x16), from PEX89144, support RDMA
- (Equipped with full-height brackets)

Front I/O

1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x Storage activity LED
1 x System status LED

I/O board - CLBH160:
2 x USB 3.2 Gen1 ports (Type-A)
1 x Mini-DP
2 x RJ45 ports (Intel I350)
1 x MLAN port (default)

Rear I/O

2 x RJ45 ports (Broadcom BCM57416)

MLAN board - CDB66:
1 x MLAN port

Backplane Board

Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS 12Gb/s

Security Modules

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

2+1 3000W 80 PLUS Titanium redundant power supplies^[1]

AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 14A

DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A

^[1]The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

4 x 80x80x80mm (17,000rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

^[Note]To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.

Weight

Net Weight: 50.44 kg
Gross Weight: 55.2 kg

Packaging Dimensions

1176 x 782 x 295 mm

Packaging Content

1 x G363-ZR0-LAX1
1 x CoolIT CPU cold plate loop
1 x Mini-DP to D-Sub cable
1 x L-shape Rail kit

Part Numbers

- Barebone w/ NVIDIA module (9005/9004): 6NG363ZR0DR000LBX1*
- Barebone w/ NVIDIA module (9004): 6NG363ZR0DR000LAX1*
- Motherboard: 9MZ83HD1UR-000*
- L-shape Rail kit: 25HB2-A86102-K0R
- CoolIT CPU cold plate loop: 25ST7-20000C-C4R
- CoolIT GPU cold plate loop: 25ST7-3000Z5-C4R
- Front panel board - CFP1000: 9CFP1000NR-00*
- Backplane board - CBP2081: 9CBP2081NR-00*
- Fan module: 25ST2-888030-S1R
- Fan module: 25ST2-888031-S1R
- M.2 expansion card - CMTP192: 9CMTP192NR-00*
- Riser card - CRSH01R: 9CRSH01RNR-00*
- OCP card - CNVC171: 9CNVC171NR-00*
- Front I/O board (incl. I350-AM2) - CLBH160: 9CLBH160NR-00*
- PCIe switch board - CPBG901: 9CPBG901NR-00*
- Rear MLAN board - CDB66: 9CDB66NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000A-D0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- RMA packaging: 6NG363ZR0SR-RMA-L100

SUPPORT

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日付

Updated support for AMD EPYC™ 9005 series processors.

Version : R01_F15

44.3 MB

Oct 24, 2024

G363-ZR0- LAX1 .svg-ArrowDownSolid-color { fill: #707070 }

SPECIFICATIONS

SUPPORT

RESOURCES

G363-ZR0-LAX1 (Rev. 1.x)

G363-ZR0- LAX1