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H274-S60- LAW1
High Density Server - Intel® Xeon® 6 Processors - 2U 4-Node DP 24-Bay Gen5 NVMe/SATA/SAS-4 DLC
- Direct liquid cooling solution
- 2U 4-node rear access server system
- Dual Intel® Xeon® 6 Processors per node, LGA 4710
- 8-Channel DDR5 RDIMM / MCR DIMM, 16 x DIMMs per node
- Dual ROM Architecture
- 8 x 1Gb/s LAN ports via Intel® I350-AM2
- 24 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays
- 4 x M.2 slots with PCIe Gen4 x4 interface (optional)
- 4 x LP PCIe Gen5 x16 slots
- 4 x OCP NIC 3.0 PCIe Gen5 x16 slots
- Dual 3000W 80 PLUS Titanium redundant power supply
* I materiali qui forniti sono solo di riferimento. GIGABYTE si riserva il diritto di modificare o rivedere il contenuto in qualsiasi momento senza preavviso.
* Le prestazioni pubblicate si basano su valori massimi teorici fornite dai rispettivi fornitori di chipset o organizzazione che hanno definito le specifiche di interfaccia. Le prestazioni effettive possono variare in base alla configurazione del sistema.
* Tutti i marchi ei loghi sono di proprietà dei rispettivi titolari.
* A causa dell'architettura standard del PC, una certa quantità di memoria è riservata al sistema e quindi la capacità di memoria reale è inferiore a quella dichiarata.
* Le prestazioni pubblicate si basano su valori massimi teorici fornite dai rispettivi fornitori di chipset o organizzazione che hanno definito le specifiche di interfaccia. Le prestazioni effettive possono variare in base alla configurazione del sistema.
* Tutti i marchi ei loghi sono di proprietà dei rispettivi titolari.
* A causa dell'architettura standard del PC, una certa quantità di memoria è riservata al sistema e quindi la capacità di memoria reale è inferiore a quella dichiarata.
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 877
440 x 87.5 x 877
Motherboard
MS64-HD0
CPU
Intel® Xeon® 6 Processors
- Intel® Xeon® 6700E-Series Processors
- Intel® Xeon® 6700P-Series Processors (available Q1'25)
- Intel® Xeon® 6500P-Series Processors (available Q1'25)
Dual processor per node, TDP up to 300W at 35°C ambient
- No OCP cards at 35°C ambient, TDP up to 350W
- With OCP cards at 30°C ambient, TDP up to 350W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
- Intel® Xeon® 6700E-Series Processors
- Intel® Xeon® 6700P-Series Processors (available Q1'25)
- Intel® Xeon® 6500P-Series Processors (available Q1'25)
Dual processor per node, TDP up to 300W at 35°C ambient
- No OCP cards at 35°C ambient, TDP up to 350W
- With OCP cards at 30°C ambient, TDP up to 350W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
8 x LGA 4710
Socket E2
Socket E2
Chipset
System on Chip
Memory
64 x DIMM slots
DDR5 memory supported
8-Channel memory architecture
MCR DIMM supported [1]
RDIMM: Up to 6400 MT/s
MCR DIMM: Up to 8000 MT/s
[1] MCR DIMMs are only supported with Intel® Xeon® 6 Processors with P-cores.
DDR5 memory supported
8-Channel memory architecture
MCR DIMM supported [1]
RDIMM: Up to 6400 MT/s
MCR DIMM: Up to 8000 MT/s
[1] MCR DIMMs are only supported with Intel® Xeon® 6 Processors with P-cores.
LAN
Rear (I/O board - CLBH160 x 4):
8 x 1Gb/s LAN (4 x Intel® I350-AM2)
- Support NCSI function
4 x 10/100/1000 Mbps Management LAN [1]
[1] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
8 x 1Gb/s LAN (4 x Intel® I350-AM2)
- Support NCSI function
4 x 10/100/1000 Mbps Management LAN [1]
[1] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
Video
Integrated in Aspeed® AST2600 x 4
- 4 x Mini-DP
- 4 x Mini-DP
Storage
Front hot-swap:
24 x 2.5" Gen5 NVMe/SATA/SAS-4 [1]
- (NVMe & SATA from CPU_1)
Optional internal M.2 (CMTP160 x 4):
4 x M.2 (2260/2280/22110), PCIe Gen4 x4, from CPU_1
[1] SAS card is required to support SAS drives.
24 x 2.5" Gen5 NVMe/SATA/SAS-4 [1]
- (NVMe & SATA from CPU_1)
Optional internal M.2 (CMTP160 x 4):
4 x M.2 (2260/2280/22110), PCIe Gen4 x4, from CPU_1
[1] SAS card is required to support SAS drives.
SAS
Require SAS add-in cards
RAID
Require RAID add-in cards
Onboard VROC key headers
Onboard VROC key headers
PCIe Expansion Slots
Riser Card CRSH01R x 4:
- 4 x LP x16 (Gen5 x16), from CPU_0
4 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Support NCSI function
- 4 x LP x16 (Gen5 x16), from CPU_0
4 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Support NCSI function
Front I/O
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button
Rear I/O
I/O board - CLBH160 x 4:
8 x USB 3.2 Gen1 ports (Type-A)
4 x Mini-DP
8 x RJ45 ports
4 x MLAN ports
4 x System status LEDs
8 x USB 3.2 Gen1 ports (Type-A)
4 x Mini-DP
8 x RJ45 ports
4 x MLAN ports
4 x System status LEDs
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
Security Modules
4 x TPM headers with SPI interface
- Optional TPM2.0 kit: CTM012
4 x PRoT connectors (only enabled on RoT SKU)
- Optional TPM2.0 kit: CTM012
4 x PRoT connectors (only enabled on RoT SKU)
Power Supply
Dual 3000W 80 PLUS Titanium redundant power supply [1]
AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A
[1] The system power supply requires C19 power cord.
AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A
[1] The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 Baseboard Management Controller
Aspeed® AST2620 Chassis Management Controller
GIGABYTE Management Console web interface
Aspeed® AST2620 Chassis Management Controller
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 80x80x80mm (16,500rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
[Note] The ambient temperature and relative humidity of the environment depend on the inlet supply water temperature and the coolant flow rate.
[Note] If the relative humidity surpasses 60%, maintain the inlet water temperature between 40°C and 45°C to prevent condensation and ensure optimal system performance.
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
[Note] The ambient temperature and relative humidity of the environment depend on the inlet supply water temperature and the coolant flow rate.
[Note] If the relative humidity surpasses 60%, maintain the inlet water temperature between 40°C and 45°C to prevent condensation and ensure optimal system performance.
Packaging Dimensions
w/ cold plate loops: 1185 x 705 x 409 mm
w/o cold plate loops: 1176 x 709 x 322 mm
w/o cold plate loops: 1176 x 709 x 322 mm
Packaging Content
1 x H274-S60-LAW1
8 x CoolIT CPU cold plate loops
1 x Mini-DP to D-Sub cable
16 x Carriers
1 x 3-Section Rail kit
8 x CoolIT CPU cold plate loops
1 x Mini-DP to D-Sub cable
16 x Carriers
1 x 3-Section Rail kit
Part Numbers
- Barebone w/ cold plates: 6NH274S60DR000LAW1*
- Barebone w/o cold plates: 6NH274S60DZ000LAW1*
- Motherboard: 9MS64HD0UR-000*
- 3-Section Rail kit: 25HB2-A66125-K0R
- CoolIT CPU cold plate loop: 25ST7-10000E-C4R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH0O8: 9CBPH0O8NR-00*
- Fan module: 25ST2-888020-S1R
- Riser card - CRSH01R: 9CRSH01RNR-00*
- I/O board - CLBH160: 9CLBH160NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000V-L0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 riser card - CMTP160: 9CMTP160NR-00*
- CoolIT leak sensor board: 6NH274S60S1000LAW10 (QPA:4)
- RMA packaging: 6NH274S60SR-RMA-L100
- Barebone w/o cold plates: 6NH274S60DZ000LAW1*
- Motherboard: 9MS64HD0UR-000*
- 3-Section Rail kit: 25HB2-A66125-K0R
- CoolIT CPU cold plate loop: 25ST7-10000E-C4R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH0O8: 9CBPH0O8NR-00*
- Fan module: 25ST2-888020-S1R
- Riser card - CRSH01R: 9CRSH01RNR-00*
- I/O board - CLBH160: 9CLBH160NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000V-L0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 riser card - CMTP160: 9CMTP160NR-00*
- CoolIT leak sensor board: 6NH274S60S1000LAW10 (QPA:4)
- RMA packaging: 6NH274S60SR-RMA-L100
* I materiali qui forniti sono solo di riferimento. GIGABYTE si riserva il diritto di modificare o rivedere il contenuto in qualsiasi momento senza preavviso.
* Le prestazioni pubblicate si basano su valori massimi teorici fornite dai rispettivi fornitori di chipset o organizzazione che hanno definito le specifiche di interfaccia. Le prestazioni effettive possono variare in base alla configurazione del sistema.
* Tutti i marchi ei loghi sono di proprietà dei rispettivi titolari.
* A causa dell'architettura standard del PC, una certa quantità di memoria è riservata al sistema e quindi la capacità di memoria reale è inferiore a quella dichiarata.
* Le prestazioni pubblicate si basano su valori massimi teorici fornite dai rispettivi fornitori di chipset o organizzazione che hanno definito le specifiche di interfaccia. Le prestazioni effettive possono variare in base alla configurazione del sistema.
* Tutti i marchi ei loghi sono di proprietà dei rispettivi titolari.
* A causa dell'architettura standard del PC, una certa quantità di memoria è riservata al sistema e quindi la capacità di memoria reale è inferiore a quella dichiarata.
SUPPORT
Driver
BIOS
Utility
Firmware
OS
- All
- All
- Windows Server 2022
- Windows Server 2019
- Linux
Chipset
Chipset
Versione
Dimension
Data
Intel® Chipset Driver
Version : 10.1.19975.8620
6.41 MB
Oct 08, 2024
OS: Windows Server 2019,Windows Server 2022
LAN
LAN
Versione
Dimension
Data
Intel® LAN Driver and Utility
Version : 29.0
32.88 MB
Oct 08, 2024
OS: Windows Server 2019,Windows Server 2022
RAID
RAID
Versione
Dimension
Data
Intel® VROC
Intel® SATA RAID and Utility
Intel® SATA RAID and Utility
Version : 9.0.0.1837
101.14 MB
Oct 09, 2024
OS: Windows Server 2019,Windows Server 2022
Utility
Utility
Versione
Dimension
Data
Intel® QuickAssist Technology
Version : 2.0.w.2.2.0-0018_1
37.67 MB
Oct 09, 2024
OS: Windows Server 2019,Windows Server 2022
BIOS
Descrizione
Versione
Dimension
Data
1) Fixes the bug about device resource related function.
2) Updates AST2600 driver to 1.13.05.
3) Updates VR solution to A8.
2) Updates AST2600 driver to 1.13.05.
3) Updates VR solution to A8.
Version : F18
51.23 MB
Nov 22, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
Because BIOS flashing is potentially risky, if you do not encounter problems using the current version of BIOS, it is recommended that you not flash the BIOS. To flash the BIOS, do it with caution. Inadequate BIOS flashing may result in system malfunction.
What is a BETA?
BETA describes a new version that is reliable yet may not include all the features of the final product. During this phase we are previewing new features and gathering customer input to insure our product provides the best experience possible.
Because BIOS flashing is potentially risky, if you do not encounter problems using the current version of BIOS, it is recommended that you not flash the BIOS. To flash the BIOS, do it with caution. Inadequate BIOS flashing may result in system malfunction.
What is a BETA?
BETA describes a new version that is reliable yet may not include all the features of the final product. During this phase we are previewing new features and gathering customer input to insure our product provides the best experience possible.
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
Utility
Descrizione
Versione
Dimension
Data
GSM CLI
Version : 2.1.78
147.79 MB
Dec 12, 2024
OS: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
OS: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
OS: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
Descrizione
Versione
Dimension
Data
BMC firmware with embedded GIGABYTE Management Console (AST2600)
Version : 13.06.10
123.4 MB
Dec 18, 2024
English
GIGABYTE Management Console Web GUI Tool
GCT Diagnostic Analyzer
GCT Diagnostic Analyzer
Version : 1.0
2519.27 MB
Aug 15, 2024
English
Manuale
Descrizione
Versione
Dimension
Data
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
11.72 MB
Aug 12, 2024
English
Descrizione
Versione
Dimension
Data
RESOURCES
Others
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