ADCU3-100

AI Mobile Edge Computing Platform - Intel 9th-Gen Core™ with Nvidia GPU

AI In-Vehicle ECU & ITS Edge Computing Platform

Powerful Artificial Intelligence system with GPU/VPU accelerator
Anti-vibration enhancement with key components soldered on board
Endures wide range working temperature and harsh environment
Rich and flexible I/O design for versatile peripherals support
Easy expansion capabilities by FLEXIO slot to support customized requirement
Various type of communication interfaces such as CAN, BT5.0, LTE(4G/5G), WIFI, C-V2X
Equip with accuracy global satellite positioning (GPS, Galileo, GLONASS, Bei Dou, etc.)
Wide range power management (9-36V) build-in ignition power control
Smart operating conditions monitoring and management
High performance fanless ECU with high efficient thermal exchange design

Get a Quote

ADCU3-100 developed as in-vehicle computer and application of AI edge computing platform, focuses on easy system integration, connection and control. It’s the perfect choice for vertical market such as automated driving system (ADS), Autonomous Mobile Robot (AMR), smart transportation and smart city… etc.
Powered by Intel® Xeon® E or 9th -Gen Core™ CPUs with optional Nvidia GPU and high-efficiency multi-core heterogeneous AI acceleration module to enhance the computing performance to match AI deep learning technologies demand.
Integrated CAN bus and provide various high-speed interfaces for the connection to varieties of sensors such as LiDAR, cameras and radar to collect and transmit data.
4G/LTE 5G communication allow real-time system monitoring, data collection and transmission to cloud control center for big data analysis.
Smart ignition power control system provides a wide range of operating voltage from 9Vdc to 36Vdc. Fully rugged and fanless chassis mechanism designed for the harsh environment, secure all the functions work steady and sufficiently under a wide temperature environment.

* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。