- Single AMD EPYC™ 7003/7002 Series Processors
- 8-Channel DDR4 RDIMM/LRDIMM, 16 x DIMMs
- 2 x 1Gb/s LAN ports via Intel® I350-AM2
- 36 x 3.5"/2.5" SATA/SAS hot-swappable bays
- 4 x 2.5" NVMe/SATA hot-swappable bays on the rear side
- 2 x 2.5" SATA hot-swappable bays on the rear side
- SAS expander with 12Gb/s transfer speed
- 2 x M.2 slots with PCIe Gen3 x4 interface
- 4 x LP PCIe Gen4 x16 and x8 slots
- 2 x LP PCIe Gen3 x16 and x8 slots
- 1+1 1200W 80 PLUS Platinum redundant power supplies (-A00)
- 1+1 1300W 80 PLUS Platinum redundant power supplies (-A01)
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
4U
482.6 x 177 x 625
482.6 x 177 x 625
Motherboard
CPU
AMD EPYC™ 7003 Series Processors
AMD EPYC™ 7002 Series Processors
Single processor, 7nm technology
Up to 64 cores, 128 threads
cTDP up to 180W
AMD EPYC™ 7002 Series Processors
Single processor, 7nm technology
Up to 64 cores, 128 threads
cTDP up to 180W
Socket
1 x LGA 4094
Socket SP3
Socket SP3
Chipset
System on Chip
Memory
16 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
Memory speed: Up to 3200*/2933 MT/s
*Follow BIOS setting and memory QVL if running 3200 MT/s with 2DPC.
DDR4 memory supported only
8-Channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
Memory speed: Up to 3200*/2933 MT/s
*Follow BIOS setting and memory QVL if running 3200 MT/s with 2DPC.
LAN
Rear side:
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function
1 x 10/100/1000 Mbps Management LAN
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Video
Integrated in Aspeed® AST2500
- 1 x VGA port
- 1 x VGA port
Storage
Front side:
24 x 3.5"/2.5" SATA/SAS hot-swappable bays
Rear side:
12 x 3.5"/2.5" SATA/SAS hot-swappable bays
4 x 2.5" NVMe/SATA hot-swappable bays*
2 x 2.5" SATA hot-swappable bays*
*Rear side 2.5" bays only support Solid State Drives due to thermal consideration.
1 x Broadcom SAS35x48 expander
Bandwidth: SATA 6Gb/s or SAS 12Gb/s
Default configuration supports:
4 x NVMe/SATA/SAS and 2 x SATA/SAS devices available on the rear side
SAS card is required to enable the drive bays
Suggested 12Gb/s SAS cards:
CRA4648
CSA4648
24 x 3.5"/2.5" SATA/SAS hot-swappable bays
Rear side:
12 x 3.5"/2.5" SATA/SAS hot-swappable bays
4 x 2.5" NVMe/SATA hot-swappable bays*
2 x 2.5" SATA hot-swappable bays*
*Rear side 2.5" bays only support Solid State Drives due to thermal consideration.
1 x Broadcom SAS35x48 expander
Bandwidth: SATA 6Gb/s or SAS 12Gb/s
Default configuration supports:
4 x NVMe/SATA/SAS and 2 x SATA/SAS devices available on the rear side
SAS card is required to enable the drive bays
Suggested 12Gb/s SAS cards:
CRA4648
CSA4648
SAS
Supported via SAS add-in cards
RAID
Depends on SAS add-in cards
Expansion Slots
Slot_6: PCIe x16 (Gen4 x16) low-profile slot
Slot_5: PCIe x16 (Gen4 x8) low-profile slot
Slot_4: PCIe x16 (Gen4 x16) low-profile slot
Slot_3: PCIe x16 (Gen4 x16) low-profile slot
Slot_2: PCIe x8 (Gen3 x0 or x8) low-profile slot
Slot_1: PCIe x16 (Gen3 x16 or x8) low-profile slot, shared with slot_2
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4)*
Supports NCSI function
*If OCP 2.0 mezzanine slot is required, rear side 4-bay cage needs to be removed.
2 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280 cards
Slot_5: PCIe x16 (Gen4 x8) low-profile slot
Slot_4: PCIe x16 (Gen4 x16) low-profile slot
Slot_3: PCIe x16 (Gen4 x16) low-profile slot
Slot_2: PCIe x8 (Gen3 x0 or x8) low-profile slot
Slot_1: PCIe x16 (Gen3 x16 or x8) low-profile slot, shared with slot_2
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4)*
Supports NCSI function
*If OCP 2.0 mezzanine slot is required, rear side 4-bay cage needs to be removed.
2 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280 cards
Internal I/O
1 x TPM header
Front I/O
2 x USB 3.0
1 x Power button with LED
1 x ID button with LED
1 x NMI button
2 x LAN activity LEDs
1 x System status LED
1 x Power button with LED
1 x ID button with LED
1 x NMI button
2 x LAN activity LEDs
1 x System status LED
Rear I/O
3 x USB 3.0
1 x VGA
1 x COM_1
2 x RJ45
1 x MLAN
1 x ID button with LED
1 x VGA
1 x COM_1
2 x RJ45
1 x MLAN
1 x ID button with LED
Backplane Board
Speed and bandwidth:
Front side - CBPD4O0: SATA 6Gb/s or SAS 12Gb/s
Rear side - CBPD0C0: SATA 6Gb/s or SAS 12Gb/s
Rear side - CBP2021: SATA 6Gb/s
Rear side - COBPU43: PCIe Gen3 x4 or SATA 6Gb/s
Front side - CBPD4O0: SATA 6Gb/s or SAS 12Gb/s
Rear side - CBPD0C0: SATA 6Gb/s or SAS 12Gb/s
Rear side - CBP2021: SATA 6Gb/s
Rear side - COBPU43: PCIe Gen3 x4 or SATA 6Gb/s
TPM
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
- Optional TPM2.0 kit: CTM010
Power Supply
1+1 1200W 80 PLUS Platinum redundant power supplies (-A00)
AC Input:
- 100-127V~/ 12.47A, 47-63Hz
- 200-240V~/ 7.08A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 7A
DC Output:
- Max 1000W/ 100-127V~
+12V/ 82A
+12Vsb/ 2A
- Max 1200W/ 200-240V~ or 240Vdc Input
+12V/ 98A
+12Vsb/ 2A
1+1 1300W redundant 80 PLUS Platinum power supplies (-A01)
AC Input:
- 100-240V~/ 12-7A, 50-60Hz
- 200-240V~/ 8A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 6.5A
DC Output:
- Max 1000W/ 100-240V~
+12V/ 80.5A
+12Vsb/ 3A
- Max 1300W/ 200-240V~ or 240Vdc Input
+12V/ 105.4A
+12Vsb/ 3A
AC Input:
- 100-127V~/ 12.47A, 47-63Hz
- 200-240V~/ 7.08A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 7A
DC Output:
- Max 1000W/ 100-127V~
+12V/ 82A
+12Vsb/ 2A
- Max 1200W/ 200-240V~ or 240Vdc Input
+12V/ 98A
+12Vsb/ 2A
1+1 1300W redundant 80 PLUS Platinum power supplies (-A01)
AC Input:
- 100-240V~/ 12-7A, 50-60Hz
- 200-240V~/ 8A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 6.5A
DC Output:
- Max 1000W/ 100-240V~
+12V/ 80.5A
+12Vsb/ 3A
- Max 1300W/ 200-240V~ or 240Vdc Input
+12V/ 105.4A
+12Vsb/ 3A
System Management
Aspeed® AST2500 Baseboard Management Controller
GIGABYTE Management Console web interface
GIGABYTE Management Console web interface
- Dashboard
- JAVA Based Serial Over LAN
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage/Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Citrix Hypervisor 8.2.0 or later
Red Hat Enterprise Linux 8.3 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later
Ubuntu 18.04.5 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 8.3 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later
Ubuntu 18.04.5 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 30.18 kg
Gross Weight: 53.7 kg
Gross Weight: 53.7 kg
Packaging Dimensions
843 x 610 x 290 mm
Packaging Content
1 x S452-Z30
1 x CPU heatsink
1 x 3-Section Rail kit
1 x CPU heatsink
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NS452Z30MR-00-A*
- Motherboard: 9MZ32AR0NR-00
- 3-Section Rail kit: 25HB2-3A6104-I0R
- CPU heatsink: 25ST1-44320G-A0R
- Backplane board - CBPD0C0: 9CBPD0C0NR-00
- Backplane board - CBPD4O0: 9CBPD4O0NR-00
- Backplane board - CBP2021: 9CBP2021NR-00
- Backplane board - COBPU43: 9COBPU43NR-00
- Fan module: 25ST2-883829-D0R
- 1200W Power supply (-A00): 25EP0-212003-D0S
- 1300W Power supply (-A01): 25EP0-21300B-F3S
Optional parts:
- RMA packaging: 6NS452Z30SR-RMA-A100
- Motherboard: 9MZ32AR0NR-00
- 3-Section Rail kit: 25HB2-3A6104-I0R
- CPU heatsink: 25ST1-44320G-A0R
- Backplane board - CBPD0C0: 9CBPD0C0NR-00
- Backplane board - CBPD4O0: 9CBPD4O0NR-00
- Backplane board - CBP2021: 9CBP2021NR-00
- Backplane board - COBPU43: 9COBPU43NR-00
- Fan module: 25ST2-883829-D0R
- 1200W Power supply (-A00): 25EP0-212003-D0S
- 1300W Power supply (-A01): 25EP0-21300B-F3S
Optional parts:
- RMA packaging: 6NS452Z30SR-RMA-A100
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SUPPORT
驅動程式
BIOS
工具程式
Firmware
QVL
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 64bit
晶片組
網路介面
BIOS
說明
版本
檔案大小
日期
1) Updated to AGESA RomePI 1.0.0.J.
2) Updated to AGESA MilanPI 1.0.0.D.
3) Included multiple security updates.
2) Updated to AGESA MilanPI 1.0.0.D.
3) Included multiple security updates.
Version : M23_R40
35.37 MB
Nov 04, 2024
1) Fixed PKfail Vulnerability.
2) Optimized BcpPro tool compatibility.
2) Optimized BcpPro tool compatibility.
Version : M22_R39
35.36 MB
Aug 26, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
工具程式
說明
版本
檔案大小
日期
GSM CLI
Version : 2.1.78
147.79 MB
Dec 12, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
說明
版本
檔案大小
日期
BMC Firmware with embedded GIGABYTE Management Console
(AST2500 AMI)
(AST2500 AMI)
Version : 12.61.21
105.38 MB
Apr 11, 2024
英語
使用手冊
說明
版本
檔案大小
日期
說明
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日期
RESOURCES
Articles
Solutions
Cloud
RAIDIX 5.X for GIGABYTE platforms
With GIGABYTE platforms, the RAIDIX team have come up with enterprise-scale software solutions that can make a huge difference for a business, both technological and financial. RAIDIX 5.X software enables all-flash and hybrid storage with a high-speed block (SAN) and file (NAS) access deployment.
Tech Guide | May 31, 2022
What is Private Cloud, and is it Right for You?
In the era of cloud computing, just about everyone has heard of the terms “private cloud” and “public cloud”. Chances are, you are using one or both of them in your everyday life—but how much do you really know about them? If you had the chance, could you build a private cloud for yourself or your organization? GIGABYTE Technology, an industry leader in server solutions used by global cloud service providers, is pleased to present our latest Tech Guide. We will examine the difference between private and public clouds, introduce the private cloud’s advantages and limitations, and then introduce GIGABYTE products that may help you build and operate a private cloud of your own.
Tech Guide | January 11, 2022
Cluster Computing: An Advanced Form of Distributed Computing
Cluster computing is a form of distributed computing that is similar to parallel or grid computing, but categorized in a class of its own because of its many advantages, such as high availability, load balancing, and HPC. GIGABYTE Technology, an industry leader in high-performance servers, presents this tech guide to help you learn about cluster computing. We also recommend GIGABYTE servers that can help you benefit from cluster computing.
Tech Guide | January 10, 2022
Setting the Record Straight: What is HPC? A Tech Guide by GIGABYTE
The term HPC, which stands for high performance computing, gets thrown around a lot nowadays, as server solutions become more and more ubiquitous. It is running the risk of becoming a catchall phrase: anything that is “HPC” must be the right choice for your computing needs. You may be wondering: what exactly are the benefits of HPC, and is HPC right for you? GIGABYTE Technology, an industry leader in high-performance servers, presents this tech guide to help you understand what HPC means on both a theoretical and a practical level. In doing so, we hope to help you evaluate if HPC is right for you, while demonstrating what GIGABYTE has to offer in the field of HPC.
Video
Video | July 28, 2021
Heroes Ascension
Over the past year or so, due to global warming and climate changes, all parts of the world have witnessed extreme weather events that are more severe than ...
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