S183-SH0- AAV1

Storage Server - 5th/4th Gen Intel^® Xeon^® Scalable - 1U DP 32-Bay E1.S NVMe 1600W

# 儲存伺服器

Dual 5th/4th Gen Intel^® Xeon^® Scalable Processors
Dual Intel^® Xeon^® CPU Max Series
8-Channel DDR5 RDIMM, 32 x DIMMs
Dual ROM Architecture
2 x 1Gb/s LAN ports via Intel^® I350-AM2
32 x E1.S NVMe hot-swap bays
2 x M.2 slots with PCIe Gen3 x4 or SATA interface
3 x FHHL PCIe Gen5 x16 and x8 slots
Compatible with SupremeRAID™ by Graid Technology
Dual 1600W 80 PLUS Titanium redundant power supply

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* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

1U
438 x 43.5 x 730

Motherboard

MSH3-ES0

CPU

5th Generation Intel^® Xeon^® Scalable Processors
4th Generation Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® CPU Max Series

Dual processor, TDP up to 350W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

2 x LGA 4677
Socket E

Chipset

Intel^® C741

Memory

32 x DIMM slots
DDR5 memory supported
8-Channel memory architecture

5th Gen Intel^® Xeon^®:
RDIMM: Up to 5600 MT/s (1DPC), 4400 MT/s (2DPC)^[1]

4th Gen Intel^® Xeon^®:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)

Intel^® Xeon^® Max Series:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)

^[1]5600 MT/s support under 2DPC configuration requires verified memory and BIOS setup. Please refer to the QVL for more information.

LAN

Rear (G-SCM board - CDCR112):
2 x 1Gb/s LAN (1 x Intel^® I350-AM2)
- Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Video

Integrated in Aspeed^® AST2600
- 1 x Mini-DP

Storage

Front hot-swap:
32 x 9.5mm E1.S NVMe
- (16 x NVMe from CPU_0, 16 x NVMe from CPU_1)

Internal M.2 (CMTP0C0):
1 x M.2 (2280/22110), PCIe Gen3 x4 or SATA, from PCH

Internal M.2 (CMTP0C1):
1 x M.2 (2280/22110), PCIe Gen3 x4 or SATA, from PCH

SAS

N/A

RAID

Optional compatible RAID Cards:

NVMe/NVMe-oF RAID Cards with SupremeRAID™ by Graid Technology
RAID Card models: SR-1000-FD32, SR-1010-FD32
Support RAID 0/1/5/6/10

PCIe Expansion Slots

Riser Card CRSD013:
- 1 x FHHL x16 (Gen5 x16), from CPU_1

Riser Card CRSD022:
- 1 x FHHL x16 (Gen5 x16 or x8), from CPU_0
- 1 x FHHL x16 (Gen5 x0 or x8), from CPU_0

Front I/O

1 x USB 3.2 Gen1 port (Type-A)
1 x Power button with LED
1 x ID button with LED
1 x Storage activity LED
1 x System status LED

Rear I/O

G-SCM board - CDCR112:
2 x USB 3.2 Gen1 ports (Type-A)
1 x Mini-DP
2 x RJ45 ports
1 x MLAN port
1 x ID LED

Backplane Board

N/A

Security Modules

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

Dual 1600W 80 PLUS Titanium redundant power supply

AC Input:
- 100-240V~/ 12-9.5A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 9.5A

DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 82A
+12Vsb/ 3A
- Max 1600W/ 200-240V~ or 240Vdc Input
+12.2V/ 131.2A
+12Vsb/ 3A

System Management

Aspeed^® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

Additional certifications:
Windows Server 2022 (x64)

System Fans

7 x 40x40x56mm (32,000rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Packaging Dimensions

985 x 588 x 250 mm

Packaging Content

1 x S183-SH0-AAV1
2 x CPU heatsinks
1 x Mini-DP to D-Sub cable
6 x Carriers
1 x 2-Section Rail kit

Part Numbers

- Barebone package (5th/4th Gen): 6NS183SH0DR000ABV1*
- Barebone package (4th Gen): 6NS183SH0DR000AAV1*
- Motherboard: 9MSH3ES0UR-000*
- 2-Section Rail kit (CMA not supported): 25HB2-3A0202-K0R
- CPU heatsink: 25ST1-4Z3200-S7R
- M.2 heatsink: 12SP2-11000E-00R
- Front panel board - CFPD040: 9CFPD040NR-00*
- Fan module: 25ST2-40562H-A0R
- M.2 expansion card - CMTP0C0: 9CMTP0C0NR-00*
- M.2 expansion card - CMTP0C1: 9CMTP0C1NR-00*
- Riser card - CRSD013: 9CRSD013NR-00*
- Riser card - CRSD022: 9CRSD022NR-00*
- EDSFF bridge board - CBG060: 9CBG60NR-00*
- EDSFF bridge board - CBG061: 9CBG61NR-00*
- G-SCM board - CDCR112: 9CDCR112NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-21600E-L0S

Optional parts:

- RAID card (SR-1000-FD32): 25FC1-SRBUN0-AFS
- RAID card (SR-1010-FD32): 25FC1-SRBUN4-AFR
- 3-Section Rail kit (CMA supported): 25HB2-AA6105-K0R
- Cable Management Arm: 25HBZ-R18100-K0R
- RMA packaging: 6NS183SH0SR-RMA-A100

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

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驅動程式
BIOS
工具程式
Firmware

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支援列表

Online Support

驅動程式

BIOS

工具程式

Firmware

QVL

All
All
Windows Server 2022
Windows Server 2019
Linux

晶片組

版本

檔案大小

日期

Intel^® Chipset Driver

Version : 10.1.19485.8386

3.81 MB

Jan 04, 2024

S183-SH0- AAV1 .svg-ArrowDownSolid-color { fill: #707070 }

SPECIFICATIONS

SUPPORT

RESOURCES

S183-SH0-AAV1

S183-SH0- AAV1