H374-A80-AAW1

High Density Server - Intel^® Xeon^® 6 Processors - 3U 4-Node DP 24-Bay Gen5 NVMe/SATA/SAS-4

3U 4-node rear access server system
Dual Intel^® Xeon^® 6 Processors per node, LGA 7529
12-Channel DDR5 RDIMM / MRDIMM, 24 x DIMMs per node
Dual ROM Architecture
8 x 1Gb/s LAN ports via Intel^® I350-AM2
24 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays
16 x LP PCIe Gen5 x16 slots
3 x 3000W 80 PLUS Titanium redundant power supply

Get a Quote

加入比較表

Get a Quote

* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

3U 4-Node - Rear access
447 x 130.8 x 895

Motherboard

MA84-HD0

CPU

Intel^® Xeon^® 6 Processors
- Intel^® Xeon^® 6900-Series Processors

Dual processor per node
- With 2 x LP cards at 30°C ambient, TDP up to 500W
- With 4 x LP cards at 25°C ambient, TDP up to 500W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

8 x LGA 7529
Socket BR

Chipset

System on Chip

Memory

96 x DIMM slots
DDR5 memory supported
12-Channel memory architecture
MRDIMM supported^[1]
RDIMM: Up to 6400 MT/s
MRDIMM: Up to 8800 MT/s

^[1]MRDIMMs are only supported with Intel^® Xeon^® 6 Processors with P-cores.

LAN

Rear (I/O board - CLNP319 x 4):
8 x 1Gb/s LAN (4 x Intel^® I350-AM2)
- Support NCSI function

4 x 10/100/1000 Mbps Management LAN^[1]

^[1]Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.

Video

Integrated in Aspeed^® AST2600 x 4
- 4 x Mini-DP

Storage

Front hot-swap:
24 x 2.5" Gen5 NVMe/SATA/SAS-4^[1]
- (NVMe from CPU_1)

^[1]Storage card is required to support SATA and SAS drives.

SAS

Require SAS add-in cards

RAID

Require RAID add-in cards
Onboard VROC key header

PCIe Expansion Slots

PCIe Cable x 8:
- 8 x LP x16 (Gen5 x16), from CPU_1

Riser Card CRCH010 x 8:
- 8 x LP x16 (Gen5 x16), from CPU_0

Front I/O

4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button

Rear I/O

I/O board - CLNP319 x 4:
8 x USB 3.2 Gen1 ports (Type-A)
4 x Mini-DP
8 x RJ45 ports
4 x MLAN ports
4 x ID buttons with LED
4 x System status LEDs

Backplane Board

Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s

Security Modules

4 x TPM headers with SPI interface
- Optional TPM2.0 kit: CTM012

4 x PRoT connectors (only enabled on RoT SKU)

Power Supply

3 x 3000W 80 PLUS Titanium redundant power supply^[1]

AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 16A

DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A

^[1]The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 Baseboard Management Controller
Aspeed^® AST2620 Chassis Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

4 x 92x92x76mm (TBD)

Operating Properties

Operating temperature: 10°C to 30°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Packaging Dimensions

1179 x 700 x 411 mm

Packaging Content

1 x H374-A80-AAW1
8 x CPU heatsinks
1 x Mini-DP to D-Sub cable
8 x Carriers
1 x L-shape Rail kit

Part Numbers

- Barebone package: 6NH374A80DR000AAW1*
- Motherboard: 9MA84HD0UR-000*
- L-shape Rail kit: 25HB2-A86104-K0R
- CPU heatsink: 25ST1-253210-C1R / 25ST1-253211-C1R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH0O8: 9CBPH0O8NR-00*
- Fan module: 25ST2-997620-A0R
- Riser card - CRCH010: 9CRCH010NR-00*
- I/O board - CLNP319: 9CLNP319NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-230009-L0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

下載

驅動程式
BIOS
工具程式
Firmware

使用手冊
支援列表

Online Support

驅動程式

BIOS

工具程式

Firmware

All
All
Windows Server 2022
Windows Server 2019
Linux

晶片組

版本

檔案大小

日期

Intel^® Chipset Driver

Version : 10.1.19975.8620

6.41 MB

Oct 08, 2024

H374-A80-AAW1

SPECIFICATIONS

SUPPORT

RESOURCES

H374-A80-AAW1