H263-V60- AAW1
High Density Arm Server - NVIDIA Grace™ CPU Superchip - 2U 4-Node 16-Bay Gen5 NVMe
- High-performance CPU for HPC and cloud computing
- 2U 4-node rear access server system
- NVIDIA Grace™ CPU Superchip
- 900GB/s NVIDIA® NVLink®-C2C Interconnect
- Up to 960GB LPDDR5X ECC memory per module
- Compatible with NVIDIA BlueField®-3 DPUs
- 16 x 2.5" Gen5 NVMe hot-swappable bays
- 8 x M.2 slots with PCIe Gen5 x4 interface
- 8 x LP PCIe Gen5 x16 slots
- 4 x OCP 3.0 Gen5 x16 slots
- 2+1 3000W 80 PLUS Titanium redundant power supplies
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 850
440 x 87.5 x 850
Motherboard
MV63-HD0
Superchip
NVIDIA Grace™ CPU Superchip:
- 2 x NVIDIA Grace™ CPUs
- Connected with NVIDIA® NVLink®-C2C
- TDP up to 500W (CPU + memory)
- 2 x NVIDIA Grace™ CPUs
- Connected with NVIDIA® NVLink®-C2C
- TDP up to 500W (CPU + memory)
Memory
Per node:
Up to 960GB of LPDDR5X memory with ECC
Memory bandwidth up to 1TB/s
Up to 960GB of LPDDR5X memory with ECC
Memory bandwidth up to 1TB/s
LAN
Per node:
1 x 10/100/1000 Mbps Management LAN
Total:
4 x 10/100/1000 Mbps Management LAN
1 x CMC port
1 x 10/100/1000 Mbps Management LAN
Total:
4 x 10/100/1000 Mbps Management LAN
1 x CMC port
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
4 x 2.5" Gen5 NVMe hot-swappable bays
- (2 x from CPU_0, 2 x from CPU_1)
Total:
16 x 2.5" Gen5 NVMe hot-swappable bays
- (8 x from CPU_0, 8 x from CPU_1)
4 x 2.5" Gen5 NVMe hot-swappable bays
- (2 x from CPU_0, 2 x from CPU_1)
Total:
16 x 2.5" Gen5 NVMe hot-swappable bays
- (8 x from CPU_0, 8 x from CPU_1)
SAS
N/A
RAID
N/A
Expansion Slots
Per node:
PCIe Cable x 2:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_1
1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function
2 x M.2 slots:
- M-key
- PCIe Gen5 x4, from CPU_1
- Support 2280/22110 cards
Total:
PCIe Cable x 8:
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_1
4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU_0
Support NCSI function
8 x M.2 slots:
- M-key
- PCIe Gen5 x4, from CPU_1
- Support 2280/22110 cards
PCIe Cable x 2:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_1
1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function
2 x M.2 slots:
- M-key
- PCIe Gen5 x4, from CPU_1
- Support 2280/22110 cards
Total:
PCIe Cable x 8:
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_1
4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU_0
Support NCSI function
8 x M.2 slots:
- M-key
- PCIe Gen5 x4, from CPU_1
- Support 2280/22110 cards
Internal I/O
Per node:
1 x TPM header
1 x TPM header
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
*1 x CMC status LED
*1 x CMC reset button
*Only one CMC status LED and reset button per system.
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
*1 x CMC status LED
*1 x CMC reset button
*Only one CMC status LED and reset button per system.
Rear I/O
Per node:
2 x USB 3.2 Gen1
1 x VGA
1 x MLAN
1 x ID button with LED
Total:
8 x USB 3.2 Gen1
4 x VGA
4 x MLAN
4 x ID buttons with LED
*1 x CMC port
*Only one CMC port per system.
2 x USB 3.2 Gen1
1 x VGA
1 x MLAN
1 x ID button with LED
Total:
8 x USB 3.2 Gen1
4 x VGA
4 x MLAN
4 x ID buttons with LED
*1 x CMC port
*Only one CMC port per system.
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4
PCIe Gen5 x4
TPM
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM012
- Optional TPM2.0 kit: CTM012
Power Supply
2+1 3000W 80 PLUS Titanium redundant power supplies
AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A
Note: The system power supply requires C19 power cord.
AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A
Note: The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 80x80x80mm (16,500rpm)
Operating Properties
Operating temperature: 10°C to 30°C
Operating humidity: 10-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-90% (non-condensing)
Operating humidity: 10-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-90% (non-condensing)
Packaging Dimensions
1180 x 706 x 306 mm
Packaging Content
1 x H263-V60-AAW1
8 x Superchip heatsinks
1 x Mini-DP to D-Sub cable
1 x 3-Section Rail kit
8 x Superchip heatsinks
1 x Mini-DP to D-Sub cable
1 x 3-Section Rail kit
Part Numbers
- Barebone w/ Nvidia module: 6NH263V60MR000AAW1*
- Motherboard: 9MV63HD0UR-000
- 3-Section Rail kit: 25HB2-A66125-K0R
- Superchip heatsink: 25ST1-2532Z1-A0R
- Superchip heatsink: 25ST1-2532Z4-A0R
- Front panel board - CFPH004: 9CFPH004NR-00
- Backplane board - CBPH7O1: 9CBPH7O1NR-00
- Fan module: 25ST2-888020-S1R
- M.2 riser card - CMTP0A2: 9CMTP0A2NR-00
- LAN board - CLBH010: 9CLBH010NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000L-L0S
Optional parts:
- RMA packaging: 6NH263V60SR-RMA-A100
- Motherboard: 9MV63HD0UR-000
- 3-Section Rail kit: 25HB2-A66125-K0R
- Superchip heatsink: 25ST1-2532Z1-A0R
- Superchip heatsink: 25ST1-2532Z4-A0R
- Front panel board - CFPH004: 9CFPH004NR-00
- Backplane board - CBPH7O1: 9CBPH7O1NR-00
- Fan module: 25ST2-888020-S1R
- M.2 riser card - CMTP0A2: 9CMTP0A2NR-00
- LAN board - CLBH010: 9CLBH010NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000L-L0S
Optional parts:
- RMA packaging: 6NH263V60SR-RMA-A100
* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
SUPPORT
BIOS
Firmware
OS
BIOS
說明
版本
檔案大小
日期
1. Removed Mellanox CX7 duplicate MAC in boot option
2. Added SMBIOS Type39 PSU detected
3. Modified Redfish BiosAttribute item
2. Added SMBIOS Type39 PSU detected
3. Modified Redfish BiosAttribute item
Version : F18
18.21 MB
Nov 11, 2024
1) Fixed PKfail Vulnerability.
2) Updated to NVIDIA Firmware 02.02.02.
3) Multiple feature updates and bug fixes.
2) Updated to NVIDIA Firmware 02.02.02.
3) Multiple feature updates and bug fixes.
Version : F15
18.04 MB
Aug 23, 2024
1. Updated CVE Patch LogoFAIL CVE-2023-39539 and CVE-2023-39538
2. Fixed previous BIOS chipset item not load default issue
2. Fixed previous BIOS chipset item not load default issue
Version : F07
17.4 MB
May 16, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
更新BIOS有其潛在的風險，如果您使用目前版本的BIOS沒有問題，我們建議您不要任意更新BIOS。如需更新BIOS，請小心的執行，以避免不當的操作而造成系統毀損.
什麼是 BETA 版？
BETA版是正式推出前的試用版本。雖然該版本已經過測試，但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本，並請密切注意正式版本的推出。
更新BIOS有其潛在的風險，如果您使用目前版本的BIOS沒有問題，我們建議您不要任意更新BIOS。如需更新BIOS，請小心的執行，以避免不當的操作而造成系統毀損.
什麼是 BETA 版？
BETA版是正式推出前的試用版本。雖然該版本已經過測試，但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本，並請密切注意正式版本的推出。
Firmware
說明
版本
檔案大小
日期
BMC firmware with embedded GIGABYTE Management Console
(AST2600)
For NVIDIA Grace/ Grace Hopper platform
For NVIDIA Grace/ Grace Hopper platform
Version : 13.99.09
114.4 MB
Mar 29, 2024
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