H263-S63- AAN1

High Density Server - 5th/4th Gen Intel^® Xeon^® Scalable - 2U 4-Node DP 8-Bay Gen4 NVMe/SATA/SAS 2600W

# 高效能運算伺服器 # 超融合伺服器

2U 4-node rear access server system
Dual 5th/4th Gen Intel^® Xeon^® Scalable Processors per node
8-Channel DDR5 RDIMM, 16 x DIMMs per node
Dual ROM Architecture
1 x CMC port
8 x 2.5" Gen4 NVMe/SATA/SAS hot-swap bays
4 x M.2 slots with PCIe Gen4 x4 interface (optional)
8 x LP PCIe Gen5 x16 slots
4 x LP PCIe Gen5 x16 slots (optional)
4 x OCP NIC 3.0 PCIe Gen5 x16 slots
Dual 2600W 80 PLUS Titanium redundant power supply

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* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Rear access
440 x 87.5 x 840

Motherboard

MS63-HD1

CPU

5th Generation Intel^® Xeon^® Scalable Processors
4th Generation Intel^® Xeon^® Scalable Processors

Dual processor per node, TDP up to 225W
- With 1 x LP and no OCP card at 30°C ambient, TDP up to 270W
- With 2 x LP and no OCP card at 25°C ambient, TDP up to 270W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

8 x LGA 4677
Socket E

Chipset

Intel^® C741

Memory

64 x DIMM slots
DDR5 memory supported
8-Channel memory architecture

5th Gen Intel^® Xeon^®:
RDIMM: Up to 5600 MT/s

4th Gen Intel^® Xeon^®:
RDIMM: Up to 4800 MT/s

LAN

Rear:
4 x 10/100/1000 Mbps Management LAN
1 x CMC Management LAN^[1]

^[1]Please refer to optional parts for ring topology support.

^[Note]Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.

Video

Integrated in Aspeed^® AST2600 x 4
- 4 x VGA ports

Storage

Front hot-swap:
8 x 2.5" Gen4 NVMe/SATA/SAS^[1]
- (NVMe from CPU_1)

Optional internal M.2 (CMTP061 x 4):
4 x M.2 (2280/22110), PCIe Gen4 x4, from CPU_1

^[1]SAS card is required to support SAS drives.

SAS

Require SAS add-in cards

RAID

Intel^® SATA RAID 0/1
Onboard VROC key header

Support optional RAID add-in cards

PCIe Expansion Slots

Riser Card CRSH01T x 4:
- 4 x LP x16 (Gen5 x16), from CPU_0

Riser Card CRSH01U x 4:
- 4 x LP x16 (Gen5 x16), from CPU_0

Optional Riser Card CRSH310 x 4:
- 4 x LP x16 (Gen5 x16), from CPU_1

4 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Support NCSI function

Front I/O

4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button

Rear I/O

8 x USB 3.2 Gen1 ports (Type-A)
4 x VGA ports
4 x MLAN ports
4 x ID buttons with LED
1 x CMC port

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

Security Modules

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

Dual 2600W 80 PLUS Titanium redundant power supply^[1]
Available for 2+1 redundant power supply configuration (optional)

AC Input:
- 100-127V~/ 15A, 50-60Hz
- 200-240V~/ 15A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 15A

DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 82A
+12.2Vsb/ 4.5A
- Max 2600W/ 200-240V~ or 240Vdc Input
+12.2V/ 213A
+12.2Vsb/ 4.5A

^[1]The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 Baseboard Management Controller
Aspeed^® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

Additional certifications:
Windows Server 2022

System Fans

8 x 80x80x38mm (18,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 49.53 kg

Packaging Dimensions

1180 x 779 x 300 mm

Packaging Content

1 x H263-S63-AAN1
8 x CPU heatsinks
24 x Carriers
1 x 3-Section Rail kit

Part Numbers

- Barebone package (5th/4th Gen): 6NH263S63DR000ABN1*
- Barebone package (4th Gen): 6NH263S63DR000AAN1*
- Motherboard: 9MS63HD1UR-000*
- 3-Section Rail kit: 25HB2-A66125-K0R
- CPU heatsink: 25ST1-453207-C1R/25ST1-453208-C1R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH081: 9CBPH081NR-00*
- Fan module: 25ST2-88382P-S1R/25ST2-88382Q-S1R
- Riser card - CRSH01T: 9CRSH01TNR-00*
- Riser card - CRSH01U: 9CRSH01UNR-00*
- LAN board - CLBH010: 9CLBH010NR-00*
- Power supply: 25EP0-226001-G1S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 riser card - CMTP061: 9CMTP061NR-00*
- Riser card - CRSH310: 9CRSH310NR-00*
- Ring topology kit (10-kit package): 6NH263S62S1000AAN11
- RMA packaging: 6NH263S63SR-RMA-A100

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

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驅動程式
BIOS
工具程式
Firmware

使用手冊
支援列表

Online Support

驅動程式

BIOS

工具程式

Firmware

QVL

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All
Windows Server 2022
Windows Server 2019
Linux

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版本

檔案大小

日期

Intel^® Chipset Driver

Version : 10.1.19485.8386

3.81 MB

Jan 04, 2024

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SPECIFICATIONS

SUPPORT

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H263-S63-AAN1

H263-S63- AAN1