H261-PC0
High Density Server - 1st/2nd Gen Intel® Xeon® Scalable - 2U 4-Node DP 24-Bay SATA/SAS
- 2U 4-node with rear access server system
- 1st/2nd Gen Intel® Xeon® Scalable Processors
- Dual processor per node, LGA 3647
- Intel® C621 Chipset
- 6-Channel RDIMM/LRDIMM DDR4, 64 x DIMMs
- Supports Intel® Optane™ DC Persistent Memory
- 4 x Dedicated management ports
- 1 x CMC port
- 24 x 2.5" SATA/SAS hot-swappable bays
- 4 x LP PCIe Gen3 x16 slots
- 4 x LP PCIe Gen3 x8 slots
- 4 x OCP Gen3 x16 mezzanine slots
- Dual 2200W 80 PLUS Platinum redundant power supply
- Optimized performance with Mellanox Infiniband products
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87 x 840
440 x 87 x 840
Motherboard
MH61-HD6
CPU
2nd Generation Intel® Xeon® Scalable Processors
Intel® Xeon® Scalable Processors
Dual processor per node, TDP up to 205W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Note: This device does not support Intel Omni-Path function.
Intel® Xeon® Scalable Processors
Dual processor per node, TDP up to 205W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Note: This device does not support Intel Omni-Path function.
Socket
Per Node:
2 x LGA 3647
Total:
8 x LGA 3647
Socket P
2 x LGA 3647
Total:
8 x LGA 3647
Socket P
Chipset
Intel® C621 Chipset
Memory
Per node:
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
6-channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Supports Intel® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MT/s
Maximum verified DCPMM configuration:
* Ambient temperature 35°C
* 2nd Generation Intel® Xeon® Scalable processor 165W (Max.)
* DCPMM 256GB x2 pcs (Per Node)
DCPMM installation locations:
DIMM_P1_(G1, J1)
Note:
1. 2933MT/s for 2nd Generation Intel® Xeon® Scalable Processors only.
2. Intel® Optane™ DC Persistent Memory for 2nd Generation Intel® Xeon® Scalable Processors only.
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C.
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative.
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
6-channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Supports Intel® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MT/s
Maximum verified DCPMM configuration:
* Ambient temperature 35°C
* 2nd Generation Intel® Xeon® Scalable processor 165W (Max.)
* DCPMM 256GB x2 pcs (Per Node)
DCPMM installation locations:
DIMM_P1_(G1, J1)
Note:
1. 2933MT/s for 2nd Generation Intel® Xeon® Scalable Processors only.
2. Intel® Optane™ DC Persistent Memory for 2nd Generation Intel® Xeon® Scalable Processors only.
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C.
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative.
LAN
Per node:
1 x Dedicated management port
Total:
4 x Dedicated management ports
1 x 10/100/1000 Mbps CMC port
Note: Please contact FAE if NCSI function of OCP mezzanine card is needed.
1 x Dedicated management port
Total:
4 x Dedicated management ports
1 x 10/100/1000 Mbps CMC port
Note: Please contact FAE if NCSI function of OCP mezzanine card is needed.
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
6 x 2.5" SATA/SAS hot-swappable bays
Onboard SATA DOM support (PIN_7, PIN_8 or external cable)
Total:
24 x 2.5" SATA/SAS hot-swappable bays
SAS card is required for SAS devices support
6 x 2.5" SATA/SAS hot-swappable bays
Onboard SATA DOM support (PIN_7, PIN_8 or external cable)
Total:
24 x 2.5" SATA/SAS hot-swappable bays
SAS card is required for SAS devices support
RAID
Intel® SATA RAID 0/1/5/10
Expansion Slots
Per node:
Riser Card CRSH010:
- 1 x PCIe x16 (Gen3 x16) low-profile slot
Riser Card CRSH011:
- 1 x PCIe x8 (Gen3 x8) low-profile slot
1 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth
Total:
Riser Card CRSH010 x 4:
- 4 x PCIe x16 (Gen3 x16) low-profile slots
Riser Card CRSH011 x 4:
- 4 x PCIe x8 (Gen3 x8) low-profile slots
4 x OCP mezzanine slots with PCIe Gen3 x16 bandwidth
Riser Card CRSH010:
- 1 x PCIe x16 (Gen3 x16) low-profile slot
Riser Card CRSH011:
- 1 x PCIe x8 (Gen3 x8) low-profile slot
1 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth
Total:
Riser Card CRSH010 x 4:
- 4 x PCIe x16 (Gen3 x16) low-profile slots
Riser Card CRSH011 x 4:
- 4 x PCIe x8 (Gen3 x8) low-profile slots
4 x OCP mezzanine slots with PCIe Gen3 x16 bandwidth
Internal I/O
Per node:
1 x COM header
2 x SATA 7-pin connectors
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x Buzzer
1 x COM header
2 x SATA 7-pin connectors
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x Buzzer
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x Reset buttons
*1 x CMC Status LED
*1 x CMC Reset button
*Only one CMC Status LED and Reset button per system.
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x Reset buttons
*1 x CMC Status LED
*1 x CMC Reset button
*Only one CMC Status LED and Reset button per system.
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
4 x MLAN
4 x ID LEDs
*1 x CMC port
*Only one CMC port per system.
2 x USB 3.0
1 x VGA
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
4 x MLAN
4 x ID LEDs
*1 x CMC port
*Only one CMC port per system.
Backplane Board
Speed and bandwidth:
SATA 6Gb/s or SAS 12Gb/s
SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with LPC interface
Optional TPM2.0 kit: CTM000
Optional TPM2.0 kit: CTM000
Power Supply
Dual 2200W 80 PLUS Platinum redundant power supply
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 12.6A
DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A - Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A
Note: The system power supply requires C19 power cord.
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 12.6A
DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A - Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A
Note: The system power supply requires C19 power cord.
System Management
Aspeed® AST2500 management controller
AMI MegaRAC SP-X Solution Web interface
AMI MegaRAC SP-X Solution Web interface
- Dashboard
- JAVA Based Serial Over LAN
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
For Skylake processors:
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019
Red Hat Enterprise Linux 6.9 or later
Red Hat Enterprise Linux 7.3 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 11 SP4 or later
SUSE Linux Enterprise Server 12 SP2 or later
SUSE Linux Enterprise Server 15 or later
Ubuntu 16.04.1 LTS or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later
For Cascade Lake processors:
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019
Red Hat Enterprise Linux 7.6 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP3 or later
SUSE Linux Enterprise Server 15 or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later
VMware ESXi 6.0 Update 3 or later
VMware ESXi 6.5 Update 2 or later
VMware ESXi 6.7 Update 1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019
Red Hat Enterprise Linux 6.9 or later
Red Hat Enterprise Linux 7.3 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 11 SP4 or later
SUSE Linux Enterprise Server 12 SP2 or later
SUSE Linux Enterprise Server 15 or later
Ubuntu 16.04.1 LTS or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later
For Cascade Lake processors:
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019
Red Hat Enterprise Linux 7.6 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP3 or later
SUSE Linux Enterprise Server 15 or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later
VMware ESXi 6.0 Update 3 or later
VMware ESXi 6.5 Update 2 or later
VMware ESXi 6.7 Update 1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 27.3 kg
Gross Weight: 45.92 kg
Gross Weight: 45.92 kg
Packaging Dimensions
1180 x 779 x 300 mm
Packaging Content
1 x H261-PC0
8 x CPU heatsinks
1 x Rail kit
8 x Non-Fabric CPU carriers
8 x CPU heatsinks
1 x Rail kit
8 x Non-Fabric CPU carriers
Part Numbers
- Barebone package: 6NH261PC0MR-00-1*
- Motherboard: 9MH61HD6NR-00
- VROC module: 25FD0-R181N0-10R
- Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-253208-F2R/25ST1-253209-F2R
- Backplane board - CBPH0O4: 9CBPH0O4NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222003-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 extension card: 9CMTP01LNR-00
- Ring topology kit: 6NH262Z65SR-00-100
- Motherboard: 9MH61HD6NR-00
- VROC module: 25FD0-R181N0-10R
- Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-253208-F2R/25ST1-253209-F2R
- Backplane board - CBPH0O4: 9CBPH0O4NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222003-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 extension card: 9CMTP01LNR-00
- Ring topology kit: 6NH262Z65SR-00-100
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SUPPORT
驅動程式
BIOS
工具程式
Firmware
QVL
- All
- All
- Windows Server 2019
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Linux
晶片組
晶片組
版本
檔案大小
日期
Intel® Chipset Driver
Version : 10.1.17861.8101
3.34 MB
Apr 18, 2019
作業系統: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
Intel® Chipset Driver
Version : 10.1.18228.8176
3.12 MB
Dec 29, 2019
作業系統: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
SATA RAID/AHCI
SATA RAID/AHCI
版本
檔案大小
日期
Intel® SATA Preinstall driver
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
Version : 6.0.0.1357
6.54 MB
Apr 19, 2019
作業系統: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
Intel® Rapid Storage Technology enterprise (Intel® RSTe)
Version : 6.0.0.1357
265.09 MB
Apr 21, 2019
作業系統: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
公用程式
BIOS
說明
版本
檔案大小
日期
Update for security: Vulnerabilities in EDK2 NetworkPkg include CVE-2023-45236, CVE- 2023-45237.
Version : R21
18.87 MB
May 27, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
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- Windows 10 64bit
- VMware
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- Linux CentOS
- Linux
工具程式
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GSM CLI
Version : 2.1.77
147.89 MB
Sep 27, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
說明
版本
檔案大小
日期
BMC Firmware with embedded GIGABYTE Management Console
(AST2500 AMI)
(AST2500 AMI)
Version : 12.61.21
105.38 MB
Apr 11, 2024
英語
CMC Firmware (AST2520)
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Version : 12.41.36
83.16 MB
Nov 02, 2023
英語
使用手冊
說明
版本
檔案大小
日期
說明
版本
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RESOURCES
Success Case
Articles
Success Case | June 02, 2023
NCHC and Xanthus Elevate Taiwanese Animation on the World Stage with GIGABYTE Servers
Created by Greener Grass Production, the Taiwanese sci-fi mini-series “2049” made its debut on Netflix and various local TV channels. The animated spin-off “2049+ Voice of Rebirth”, crafted by Xanthus Animation Studio, premiered on the streaming service myVideo. The CGI show was created with the NCHC Render Farm’s GIGABYTE servers, which employ top-of-the-line NVIDIA® graphics cards to empower artists with industry-leading rendering capabilities. The servers can take on multiple workloads simultaneously through parallel computing, and they boast a wide range of patented smart features that ensure stability and availability. With all it has going for it, “2049+ Voice of Rebirth” may garner enough attention to become the breakout hit that will introduce Taiwanese animation to international audiences.
Success Case | May 30, 2023
Spain’s IFISC Tackles COVID-19, Climate Change with GIGABYTE Servers
By using GIGABYTE, Spain’s Institute for Cross-Disciplinary Physics and Complex Systems is pitting the world’s foremost server solutions against some of the world’s most pressing issues, including the effects of climate change, pollution, and COVID-19. GIGABYTE servers are up to the diverse and daunting tasks, because they are designed for high performance computing, intensive numerical simulations, AI development, and big data management.
Success Case | March 07, 2023
Satisfying Your Need for Speed: Server Technology Helps to Achieve Aerodynamic Vehicle Design
A world-renowned automotive manufacturer uses Computational Fluid Dynamics (CFD) simulation software, analyzing huge amounts of data to optimize the design of their vehicles. They selected GIGABYTE’s high density multi-node servers to build a high-performance computing cluster for their vehicle design center, making the most efficient use of the limited space available to deliver maximum computing power to their aerodynamic engineering team.
Success Case | February 17, 2023
GIGABYTE Servers Become Part of the German Aerospace Center’s Data Center
When the German Aerospace Center (Deutsches Zentrum für Luft- und Raumfahrt, abbreviated as DLR) wanted to expand their data center, they searched for servers that could operate smoothly in an ambient temperature of 40°C without the need for air conditioning. GIGABYTE’s server team provided a solution from its High Density Server product line that combined computing, storage, and connectivity in a single system. The High Density Servers are equipped with liquid-cooling technology to run without a hitch in high-temperature environments, enabling the data center to efficiently process an enormous amount of space-related research data in the limited space available.
Tech Guide | July 18, 2023
How to Pick a Cooling Solution for Your Servers? A Tech Guide by GIGABYTE
As CPUs and GPUs continue to advance, they consume more power and generate more heat. It is vital to keep temperature control in mind when purchasing servers. A good cooling solution keeps things running smoothly without hiking up the energy bill or requiring persistent maintenance. GIGABYTE Technology, an industry leader in high-performance servers, presents this Tech Guide to help you choose a suitable cooling solution. We analyze three popular options—air, liquid, immersion—and demonstrate what GIGABYTE can do for you.
Tech Guide | October 27, 2022
Data Center Cooling: The Key to Green Computing and a Low-Carbon Transition
Tech Guide | May 31, 2022
What is Private Cloud, and is it Right for You?
In the era of cloud computing, just about everyone has heard of the terms “private cloud” and “public cloud”. Chances are, you are using one or both of them in your everyday life—but how much do you really know about them? If you had the chance, could you build a private cloud for yourself or your organization? GIGABYTE Technology, an industry leader in server solutions used by global cloud service providers, is pleased to present our latest Tech Guide. We will examine the difference between private and public clouds, introduce the private cloud’s advantages and limitations, and then introduce GIGABYTE products that may help you build and operate a private cloud of your own.
Tech Guide | March 16, 2022
What is Big Data, and How Can You Benefit from It?
You may be familiar with the term, “big data”, but how firm is your grasp of the concept? Have you heard of the “5 V’s” of big data? Can you recite the “Three Fundamental Steps” of how to use big data? Most importantly, do you know how to reap the benefits through the use of the right tools? GIGABYTE Technology, an industry leader in high-performance server solutions, is pleased to present our latest Tech Guide. We will walk you through the basics of big data, explain why it boasts unlimited potential, and finally delve into the GIGABYTE products that will help you ride high on the most exciting wave to sweep over the IT sector.
Tech Guide | February 11, 2022
The Advantages of ARM: From Smartphones to Supercomputers and Beyond
Processors based on the ARM architecture, an alternative to the mainstream x86 architecture, is gradually making the leap from mobile devices to servers and data centers. In this Tech Guide, GIGABYTE Technology, an industry leader in high-performance server solutions, recounts how ARM was developed. We also explain the various benefits of ARM processors and recommend ARM servers for different sectors and applications.
Tech Guide | January 11, 2022
Cluster Computing: An Advanced Form of Distributed Computing
Cluster computing is a form of distributed computing that is similar to parallel or grid computing, but categorized in a class of its own because of its many advantages, such as high availability, load balancing, and HPC. GIGABYTE Technology, an industry leader in high-performance servers, presents this tech guide to help you learn about cluster computing. We also recommend GIGABYTE servers that can help you benefit from cluster computing.
Tech Guide | January 10, 2022
Setting the Record Straight: What is HPC? A Tech Guide by GIGABYTE
The term HPC, which stands for high performance computing, gets thrown around a lot nowadays, as server solutions become more and more ubiquitous. It is running the risk of becoming a catchall phrase: anything that is “HPC” must be the right choice for your computing needs. You may be wondering: what exactly are the benefits of HPC, and is HPC right for you? GIGABYTE Technology, an industry leader in high-performance servers, presents this tech guide to help you understand what HPC means on both a theoretical and a practical level. In doing so, we hope to help you evaluate if HPC is right for you, while demonstrating what GIGABYTE has to offer in the field of HPC.
5G | October 07, 2019
Looking Towards 5G and the Transformation of Our Technology Ecosystem
When everything in the world becomes connected to the internet, human society will become a huge, highly intelligent organism. The “brain” of this organism will be the cloud, and its limbs will be a variety of end applications such as smart phones, AI-enabled robots, self-driving cars and smart factories.
Video
Video | October 17, 2023
Explore AmpereOne servers by GIGABYTE with Ampere's Jeff Wittich
At Computex 2023 we had one of our important partners, Ampere Computing, stop by our booth to discover the future with the new ...
Video | October 17, 2023
Dive into GIGABYTE's ARM servers with the AmpereOne platform
Akira Hoshino, Head of Product Planning at Giga Computing, discusses how and what GIGABYTE has developed for Ampere ...
Video | July 28, 2021
Heroes Ascension
Over the past year or so, due to global warming and climate changes, all parts of the world have witnessed extreme weather events that are more severe than ...
Video | March 25, 2021
60秒小科普:看懂什麼是 Data Center 資料中心
數據中心是什麼? 數據中心(Data Center)是容納組織中IT設備的設施,包括伺服器、儲存、網路設備(如交換機、路由器和防火牆),以及組織和 ...
News
News | December 04, 2020
「技嘉新產品介紹暨合作夥伴年會」隆重登場 AMD解決方案成就多項代表性成功案例
EPYC™系列處理器提供高性價比與超強效能 推動高效能運算應用於粒子物理學、太空探索、氣候變遷等研究領域
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