H253-Z10-AAP1

High-Density Server - AMD EPYC™ 9004 - 2U 4-Node UP 8-Bay E1.S Gen4 NVMe
  • 2U 4-node front access server system
  • Single AMD EPYC™ 9004 Series Processors per node
  • 12-Channel DDR5 RDIMM, 24 x DIMMs per node
  • Dual ROM Architecture
  • 8 x 1Gb/s LAN ports via Intel® I350-AM2
  • 2 x CMC ports
  • 8 x E1.S Gen4 NVMe hot-swap bays
  • 12 x M.2 slots with PCIe Gen5 x4 and SATA interface
  • 4 x LP PCIe Gen5 x16 slots
  • 4 x OCP NIC 3.0 PCIe Gen5 x16 slots
  • Dual 3000W 80 PLUS Titanium redundant power supply
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* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
2U 4-Node - Front access
447 x 86.8 x 902
Motherboard
MZ13-SH0
CPU
AMD EPYC™ 9005 Series Processors
AMD EPYC™ 9004 Series Processors

Single processor per node, cTDP up to 300W [1]
- At ambient 30°C, cTDP up to 400W [1]

[1] Please refer to the QVL on the support page or contact our sales representatives for verified CPU SKUs.
Socket
4 x LGA 6096
Socket SP5
Chipset
System on Chip
Memory
96 x DIMM slots
DDR5 memory supported
12-Channel memory architecture

AMD EPYC™ 9005:
RDIMM: Up to 4800 MT/s (1DPC)
RDIMM: Up to 4400 MT/s (1R 2DPC), 4000 MT/s (2R 2DPC)

AMD EPYC™ 9004:
RDIMM: Up to 4800 MT/s (1DPC), 3600 MT/s (2DPC)
LAN
Front:
8 x 1Gb/s LAN (4 x Intel® I350-AM2)
- Support NCSI function

4 x 10/100/1000 Mbps Management LAN
2 x CMC ports

[Note] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
Video
Integrated in Aspeed® AST2600 x 4
- 4 x Mini-DP
Storage
Front hot-swap:
8 x 9.5mm E1.S Gen4 NVMe

Internal M.2:
4 x M.2 (2280/22110), PCIe Gen5 x4
8 x M.2 (2280), SATA via ASM1062R
- Support SATA Hardware RAID 0/1
SAS
N/A
RAID
N/A
PCIe Expansion Slots
Riser Card CRSH01Q x 4:
- 4 x LP x16 (Gen5 x16)

4 x OCP NIC 3.0 (Gen5 x16)
- Support NCSI function
Front I/O
8 x USB 3.2 Gen1 ports (Type-A)
4 x Mini-DP
8 x RJ45 ports
4 x MLAN ports
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
Rear I/O
2 x CMC ports
Backplane Board
N/A
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
Power Supply
Dual 3000W 80 PLUS Titanium redundant power supply [1]

AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 15.5A

DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 81A
+12Vsb/ 3A
- Max 2600W/ 200-220V~
+12.2V/ 213A
+12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+12.2V/ 245A
+12Vsb/ 3A

[1] The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 Baseboard Management Controller
Aspeed® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 80x80x80mm (16,500rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 29.4 kg
Gross Weight: 46.8 kg
Packaging Dimensions
1180 x 779 x 300 mm
Packaging Content
1 x H253-Z10-AAP1
4 x CPU heatsinks
1 x L-shape Rail kit
Part Numbers
- Barebone package (EPYC 9005/9004): 6NH253Z10DR000ABP1*
- Barebone package (EPYC 9004): 6NH253Z10DR000AAP1*
- Motherboard: 9MZ13SH0UR-000*
- L-shape Rail kit: 25HB2-A86104-K0R
- CPU heatsink: 25ST1-553202-A0R
- Fan module: 25ST2-888020-S1R
- Riser card - CRSH01Q: 9CRSH01QNR-00*
- EDSFF riser card - CRSH01X: 9CRSH01XNR-00*
- CMC module - CMBH42: 9CMBH42NR-00*
- Power supply: 25EP0-23000H-G1S

Optional parts:

- E1.S Latch with dummy tray (24 in 1): 6NH253Z10S1000AAP11
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- RMA packaging: 6NH253Z10SR-RMA-A100
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SUPPORT

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Linux
BIOS
說明
版本
檔案大小
日期
1) Update to Genoa AGESA 1.0.0.C.
2) Security updates: CVE-2023-31315, CVE-2023-31355, CVE-2024-21978, CVE-2024-21980.
3) Multiple feature updates.
Version : F17
20.91 MB
Jul 11, 2024
Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.

什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • VMware
  • Ubuntu
  • Linux CentOS
  • Linux
工具程式
說明
版本
檔案大小
日期
GSM CLI
Version : 2.1.77
147.89 MB
Sep 27, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
使用手冊
說明
版本
檔案大小
日期

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