H223-V10-AAW1

HPC/AI Arm Server - NVIDIA GH200 Grace Hopper Superchip - 2U 2-Node 8-Bay Gen5 NVMe
  • CPU+GPU design for giant-scale AI and HPC
  • 2U 2-node rear access server system
  • NVIDIA GH200 Grace Hopper Superchip
  • 900GB/s NVIDIA® NVLink®-C2C Interconnect
  • Up to 480GB CPU LPDDR5X ECC memory per module
  • Up to 96GB GPU HBM3 per module
  • Compatible with NVIDIA BlueField®-3 DPUs
  • 4 x 10Gb/s LAN ports via Intel® X550-AT2
  • 1 x CMC port
  • 8 x 2.5" Gen5 NVMe hot-swap bays
  • 4 x M.2 slots with PCIe Gen5 x4 interface
  • 2 x FHHL Dual slot PCIe Gen5 x16 slots
  • 2 x FHHL Single slot PCIe Gen5 x16 slots
  • 2 x OCP NIC 3.0 Gen5 x16 slots
  • 2+1 3000W 80 PLUS Titanium redundant power supplies
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* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
2U 2-Node - Rear access
440 x 87.5 x 850
Motherboard
MV13-HD0
Superchip
Per node:
NVIDIA GH200 Grace Hopper Superchip:
- 1 x NVIDIA Grace™ CPU
- 1 x NVIDIA Hopper™ GPU
- Connected with NVIDIA® NVLink®-C2C
- TDP up to 1000W (CPU + GPU + memory)
Memory
Per node:
NVIDIA Grace CPU:
- Up to 480GB of LPDDR5X memory with ECC
- Memory bandwidth up to 512GB/s

NVIDIA Hopper GPU:
- Up to 96GB HBM3
- Memory bandwidth up to 4TB/s
LAN
Rear:
4 x 10Gb/s LAN (2 x Intel® X550-AT2)
- Support NCSI function

2 x 10/100/1000 Mbps Management LAN
1 x CMC Management LAN
Video
Integrated in Aspeed® AST2600 x 2
- 2 x Mini-DP
Storage
Front hot-swap:
8 x 2.5" Gen5 NVMe

Internal M.2:
4 x M.2 (2280/22110), PCIe Gen5 x4, from PEX89048
SAS
N/A
RAID
N/A
PCIe Expansion Slots
PCIe Cable x 4:
- 2 x FHHL x16 (Gen5 x16), Dual slot [1]
- 2 x FHHL x16 (Gen5 x16), Single slot

2 x OCP NIC 3.0 (Gen5 x16)
- Support NCSI function

[1] When BlueField-3 DPUs are installed, the ambient temperature is limited to 25℃.
Front I/O
2 x Power buttons with LED
2 x ID buttons with LED
2 x Reset buttons
2 x System status LEDs
1 x CMC status LED
1 x CMC reset button
Rear I/O
4 x USB 3.2 Gen1 ports (Type-A)
2 x Mini-DP
4 x RJ45 ports
2 x MLAN ports
2 x ID LEDs
1 x CMC port
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM012
Power Supply
2+1 3000W 80 PLUS Titanium redundant power supplies [1]

AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 16A

DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A

[1] The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 Baseboard Management Controller
Aspeed® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 80x80x80mm (16,500rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1180 x 706 x 306 mm
Packaging Content
1 x H223-V10-AAW1
4 x Superchip heatsinks
1 x Mini-DP to D-Sub cable
1 x 3-Section Rail kit
Part Numbers
- Barebone w/ NVIDIA module: 6NH223V10MR000AAW1*
- Motherboard: 9MV13HD0NR-000*
- 3-Section Rail kit: 25HB2-A66125-K0R
- Superchip heatsink: 25ST1-2532Z3-A0R
- Superchip heatsink: 25ST1-2532Z5-A0R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH7O1: 9CBPH7O1NR-00*
- Fan module: 25ST2-888020-S1R
- M.2 riser card - CMTP0A2: 9CMTP0A2NR-00*
- LAN board - CLBH010: 9CLBH010NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000L-L0S

Optional parts:

- RMA packaging: 6NH223V10SR-RMA-A100
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SUPPORT

Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.

什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。

Firmware
說明
版本
檔案大小
日期

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