H223-S10-AAP1

2U 3-Node - Front access
447.8 x 87.5 x 500

MS13-HD0

5th Generation Intel^® Xeon^® Scalable Processors
4th Generation Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® CPU Max Series

Single processor per node
- With 1 x PCIe card per node at 35°C ambient, TDP up to 350W
- With 2 x PCIe cards per node at 30°C ambient, TDP up to 350W
- With 3 x PCIe cards per node at 35°C ambient, TDP up to 300W
- With 4 x PCIe cards per node at 30°C ambient, TDP up to 300W

3 x LGA 4677
Socket E

Intel^® C741

24 x DIMM slots
DDR5 memory supported
8-Channel memory per processor

5th Gen Intel^® Xeon^®:
RDIMM: Up to 5600 MT/s

4th Gen Intel^® Xeon^®:
RDIMM: Up to 4800 MT/s

Intel^® Xeon^® Max Series:
RDIMM: Up to 4800 MT/s

Front:
2 x CMC Management LAN

Integrated in ASPEED^® AST2600 x 3
- 3 x Mini-DP

Front hot-swap:
6 x 9.5mm E1.S Gen4 NVMe

Internal M.2 (CFPH010 x 3):
3 x M.2 (2242/2260/2280/22110), SATA, from PCH

N/A

Onboard VROC key header

Riser Card CRSH02D x 3:
- 6 x FHHL x16 (Gen5 x16)

Riser Card CRSH02E x 3:
- 3 x LP x16 (Gen5 x16)
- 3 x LP x16 (Gen5 x8)

2 x CMC ports
1 x CMC status LED

I/O board - CFPH010 x 3:
3 x USB 3.2 Gen1 ports (Type-C)
3 x Mini-DP
3 x Power buttons with LED
3 x System status LEDs
3 x ID LEDs

N/A

Speed and bandwidth:
PCIe Gen4 x4

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

1+1 3000W 80 PLUS Titanium redundant power supplies ^[1]

AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 15.5A

DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 81A
+12Vsb/ 3A
- Max 2600W/ 200-220V~
+12.2V/ 213A
+12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+12.2V/ 245A
+12Vsb/ 3A

^[1] The system power supply requires C19 power cord.

ASPEED^® AST2600 Baseboard Management Controller
ASPEED^® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface

• Dashboard
• HTML5 KVM
• Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
• Sensor Reading History Data
• FRU Information
• SEL Log in Linear Storage / Circular Storage Policy
• Hardware Inventory
• Fan Profile
• System Firewall
• Power Consumption
• Power Control
• Advanced power capping
• LDAP / AD / RADIUS Support
• Backup & Restore Configuration
• Remote BIOS/BMC/CPLD Update
• Event Log Filter
• User Management
• Media Redirection Settings
• PAM Order Settings
• SSL Settings
• SMTP Settings

Please refer to OS compatibility table in support page

Additional certifications:
Windows Server 2022
Windows Server 2025

4 x 80x80x38mm (18,300rpm)

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Net Weight: 17.2 kg
Gross Weight: 29 kg

857 x 670 x 280 mm

1 x H223-S10-AAP1
3 x CPU heatsinks
1 x Mini-DP to D-Sub cable
9 x Carriers
1 x L-shape Rail kit

- Barebone package (5th/4th Gen): 6NH223S10DR000ABP1*
- Barebone package (4th Gen): 6NH223S10DR000AAP1*
- Motherboard: 9MS13HD0UR-000*
- L-shape Rail kit: 25HB2-A86105-K0R
- CPU heatsink: 25ST1-453207-C1R
- Front panel board - CFPH030: 9CFPH030NR-00*
- Backplane board - CBP2060: 9CBP2060NR-00*
- Fan module: 25ST2-88382V-S1R
- Riser card - CRSH02D: 9CRSH02DNR-00*
- Riser card - CRSH02E: 9CRSH02ENR-00*
- EDSFF riser card - CSPP010: 9CSPP010NR-00*
- I/O board with M.2 slot - CFPH010: 9CFPH010NR-00*
- LAN bridge board - CLSH13: 9CLSH13NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000F-G1S

Optional parts:

- RMA packaging: 6NH223S10SR-RMA-A100