H223-S10-AAP1

High Density Server - 5th/4th Gen Intel^® Xeon^® Scalable - 2U 3-Node UP 6-Bay E1.S Gen4 NVMe

# 高效能運算伺服器 # 超融合伺服器 # 邊緣運算伺服器 # 私有雲/混和雲伺服器

2U 3-node front access server system
Single 5th/4th Gen Intel^® Xeon^® Scalable Processors per node
Single Intel^® Xeon^® CPU Max Series per node
8-Channel DDR5 RDIMM, 8 x DIMMs per node
Dual ROM Architecture
2 x CMC ports
6 x 9.5mm E1.S Gen4 NVMe hot-swap bays
3 x M.2 slots with SATA interface
6 x FHHL PCIe Gen5 x16 slots
3 x LP PCIe Gen5 x16 slots
3 x LP PCIe Gen5 x8 slots
1+1 3000W 80 PLUS Titanium redundant power supplies

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* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 3-Node - Front access
447.8 x 87.5 x 500

Motherboard

MS13-HD0

CPU

5th Generation Intel^® Xeon^® Scalable Processors
4th Generation Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® CPU Max Series

Single processor per node
- With 1 x PCIe card per node at 35°C ambient, TDP up to 350W
- With 2 x PCIe cards per node at 30°C ambient, TDP up to 350W
- With 3 x PCIe cards per node at 35°C ambient, TDP up to 300W
- With 4 x PCIe cards per node at 30°C ambient, TDP up to 300W

Socket

3 x LGA 4677
Socket E

Chipset

Intel^® C741

Memory

24 x DIMM slots
DDR5 memory supported
8-Channel memory per processor

5th Gen Intel^® Xeon^®:
RDIMM: Up to 5600 MT/s

4th Gen Intel^® Xeon^®:
RDIMM: Up to 4800 MT/s

Intel^® Xeon^® Max Series:
RDIMM: Up to 4800 MT/s

LAN

Front:
2 x CMC Management LAN

Video

Integrated in Aspeed^® AST2600 x 3
- 3 x Mini-DP

Storage

Front hot-swap:
6 x 9.5mm E1.S Gen4 NVMe

Internal M.2 (CFPH010 x 3):
3 x M.2 (2242/2260/2280/22110), SATA, from PCH

SAS

N/A

RAID

Onboard VROC key header

PCIe Expansion Slots

Riser Card CRSH02D x 3:
- 6 x FHHL x16 (Gen5 x16)

Riser Card CRSH02E x 3:
- 3 x LP x16 (Gen5 x16)
- 3 x LP x16 (Gen5 x8)

Front I/O

2 x CMC ports
1 x CMC status LED

I/O board - CFPH010 x 3:
3 x USB 3.2 Gen1 ports (Type-C)
3 x Mini-DP
3 x Power buttons with LED
3 x System status LEDs
3 x ID LEDs

Rear I/O

N/A

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4

Security Modules

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

1+1 3000W 80 PLUS Titanium redundant power supplies^[1]

AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 15.5A

DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 81A
+12Vsb/ 3A
- Max 2600W/ 200-220V~
+12.2V/ 213A
+12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+12.2V/ 245A
+12Vsb/ 3A

^[1]The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 Baseboard Management Controller
Aspeed^® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

Additional certifications:
Windows Server 2022

System Fans

4 x 80x80x38mm (18,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 17.2 kg
Gross Weight: 29 kg

Packaging Dimensions

857 x 670 x 280 mm

Packaging Content

1 x H223-S10-AAP1
3 x CPU heatsinks
1 x Mini-DP to D-Sub cable
9 x Carriers
1 x L-shape Rail kit

Part Numbers

- Barebone package (5th/4th Gen): 6NH223S10DR000ABP1*
- Barebone package (4th Gen): 6NH223S10DR000AAP1*
- Motherboard: 9MS13HD0UR-000*
- L-shape Rail kit: 25HB2-A86105-K0R
- CPU heatsink: 25ST1-453207-C1R
- Front panel board - CFPH030: 9CFPH030NR-00*
- Backplane board - CBP2060: 9CBP2060NR-00*
- Fan module: 25ST2-88382V-S1R
- Riser card - CRSH02D: 9CRSH02DNR-00*
- Riser card - CRSH02E: 9CRSH02ENR-00*
- EDSFF riser card - CSPP010: 9CSPP010NR-00*
- I/O board with M.2 slot - CFPH010: 9CFPH010NR-00*
- LAN bridge board - CLSH13: 9CLSH13NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000F-G1S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- RMA packaging: 6NH223S10SR-RMA-A100

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

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驅動程式
BIOS
工具程式
Firmware

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支援列表

Online Support

驅動程式

BIOS

工具程式

Firmware

QVL

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Windows Server 2022
Windows Server 2019
Linux

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版本

檔案大小

日期

Intel^® Chipset Driver

Version : 10.1.19485.8386

3.81 MB

Jan 04, 2024

H223-S10-AAP1

SPECIFICATIONS

SUPPORT

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H223-S10-AAP1