G893-SD1- AAX3

HPC/AI Server - 5th/4th Gen Intel^® Xeon^® Scalable - 8U DP NVIDIA HGX™ H200 8-GPU

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NVIDIA HGX™ H200 8-GPU
900GB/s GPU-to-GPU bandwidth with NVIDIA^® NVLink™ and NVSwitch™
Dual 5th/4th Gen Intel^® Xeon^® Scalable Processors
Dual Intel^® Xeon^® CPU Max Series
8-Channel DDR5 RDIMM, 32 x DIMMs
Dual ROM Architecture
Compatible with NVIDIA^® BlueField^®-3 DPUs and ConnectX^®-7 NICs
2 x 10Gb/s LAN ports via Intel^® X710-AT2
2 x M.2 slots with PCIe Gen3 x2 and x1 interface
8 x 2.5" Gen5 NVMe/SATA hot-swap bays
4 x FHHL dual-slot PCIe Gen5 x16 slots
8 x FHHL single-slot PCIe Gen5 x16 slots
6+6 3000W 80 PLUS Titanium redundant power supplies

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* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

8U
447 x 351 x 900

Motherboard

MSB3-PE0

CPU

5th Generation Intel^® Xeon^® Scalable Processors
4th Generation Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® CPU Max Series

Dual processor, TDP up to 350W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

2 x LGA 4677
Socket E

Chipset

Intel^® C741

Memory

32 x DIMM slots
DDR5 memory supported
8-Channel memory per processor

5th Gen Intel^® Xeon^®:
RDIMM: Up to 5600 MT/s (1DPC), 4400 MT/s (2DPC)

4th Gen Intel^® Xeon^®:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)

Intel^® Xeon^® Max Series:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)

LAN

Front (I/O board - CFPG540):
2 x 10Gb/s LAN (1 x Intel^® X710-AT2)
- Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN

^[Note]When both MLAN ports are connected with cables, the front MLAN port will be set as the default.

Video

Integrated in Aspeed^® AST2600
- 1 x VGA port

Storage

Front hot-swap:
8 x 2.5" Gen5 NVMe/SATA
- (NVMe from PEX89104)

Internal M.2:
1 x M.2 (2280/22110), PCIe Gen3 x2, from PCH
1 x M.2 (2280/22110), PCIe Gen3 x1, from PCH

SAS

N/A

RAID

Intel^® SATA RAID 0/1/10/5

Modular GPU

NVIDIA HGX™ H200 with 8 x SXM GPUs

PCIe Expansion Slots

PCIe Bridge Board - CBG76:
- 8 x FHHL x16 (Gen5 x16), from PEX89104

PCIe Bridge Board - CPBG045 x 2:
- 4 x FHHL x16 (Gen5 x16), from PEX89048

Front I/O

I/O board - CFPG540:
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED

Rear I/O

MLAN board - CDB66:
1 x MLAN port

Backplane Board

Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s

Security Modules

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

6+6 3000W 80 PLUS Titanium redundant power supplies^[1]

AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 14A

DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A

^[1]The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

Motherboard:
2 x 60x60x56mm (24,600rpm)
4 x 60x60x76mm (21,800rpm)

PCIe slots:
4 x 80x80x56mm (15,500rpm)

GPU tray:
21 x 80x80x80mm (20,400rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Packaging Content

1 x G893-SD1-AAX3
2 x CPU heatsinks
6 x Carriers
1 x L-shape Rail kit

Part Numbers

- Barebone w/ NVIDIA module: 6NG893SD1DR000ABX3*
- Motherboard: 9MSB3PE0UR-000*
- L-shape Rail kit: 25HB2-UM6100-K0R
- CPU heatsink: 25ST1-323208-A0R
- Front panel board - CFPG540: 9CFPG540NR-00*
- Backplane board - CBPG641: 9CBPG641NR-00*
- Fan module 60x60x56mm: 25ST2-665623-S1R
- Fan module 60x60x76mm: 25ST2-667621-A0R
- Fan module 80x80x56mm: 25ST2-885622-A0R
- Fan module 80x80x80mm: 25ST2-888035-D0R
- Fan module 80x80x80mm: 25ST2-888036-D0R
- PCIe bridge board - CPBG045: 9CPBG045NR-00*
- PCIe switch board - CBG76: 9CBG76NR-00*
- Rear MLAN board - CDB66: 9CDB66NR-00*
- Power supply: 25EP0-23000J-D0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

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版本

檔案大小

日期

Intel^® Chipset Driver

Version : 10.1.19485.8386

3.81 MB

Jan 04, 2024

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