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G4L3-ZD1-LAX3
即將推出
HPC/AI Server - AMD EPYC™ 9005/9004 - 4U DP HGX™ H200 8-GPU DLC
- Liquid-cooled NVIDIA HGX™ H200 8-GPU
- CPU+GPU direct liquid cooling solution with leak detection
- 900GB/s GPU-to-GPU bandwidth with NVLink® and NVSwitch™
- Dual AMD EPYC™ 9005/9004 Series Processors
- 12-Channel DDR5 RDIMM, 24 x DIMMs
- Dual ROM Architecture
- Compatible with NVIDIA BlueField®-3 DPUs and ConnectX®-7 NICs
- 2 x 10Gb/s LAN ports via Intel® X710-AT2
- 2 x M.2 slots with PCIe Gen3 x4 and x1 interface
- 8 x 2.5" Gen5 NVMe hot-swap bays
- 4 x FHHL dual-slot PCIe Gen5 x16 slots
- 8 x FHHL single-slot PCIe Gen5 x16 slots
- 4+4 3000W 80 PLUS Titanium redundant power supplies
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
4U
447 x 175.3 x 900
447 x 175.3 x 900
Motherboard
MZB3-PE0
CPU
AMD EPYC™ 9005 Series Processors
AMD EPYC™ 9004 Series Processors
Dual processor, cTDP up to 500W [1]
[1] The ambient temperature is limited to 30°C when NVIDIA BlueField®-3 DPUs are installed.
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
AMD EPYC™ 9004 Series Processors
Dual processor, cTDP up to 500W [1]
[1] The ambient temperature is limited to 30°C when NVIDIA BlueField®-3 DPUs are installed.
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 6096
Socket SP5
Socket SP5
Chipset
System on Chip
Memory
24 x DIMM slots
DDR5 memory supported
12-Channel memory architecture
AMD EPYC™ 9005:
RDIMM: Up to 6000 MT/s
AMD EPYC™ 9004:
RDIMM: Up to 4800 MT/s
DDR5 memory supported
12-Channel memory architecture
AMD EPYC™ 9005:
RDIMM: Up to 6000 MT/s
AMD EPYC™ 9004:
RDIMM: Up to 4800 MT/s
LAN
Front (I/O board - CFPG540):
2 x 10Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN
[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
2 x 10Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN
[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
Video
Integrated in Aspeed® AST2600
- 1 x VGA port
- 1 x VGA port
Storage
Front hot-swap:
8 x 2.5" Gen5 NVMe
- (NVMe from PEX89104)
Internal M.2:
1 x M.2 (2280/22110), PCIe Gen3 x4, from CPU_1
1 x M.2 (2280/22110), PCIe Gen3 x1, from CPU_0
8 x 2.5" Gen5 NVMe
- (NVMe from PEX89104)
Internal M.2:
1 x M.2 (2280/22110), PCIe Gen3 x4, from CPU_1
1 x M.2 (2280/22110), PCIe Gen3 x1, from CPU_0
SAS
N/A
RAID
Require RAID add-in cards
Modular GPU
Liquid-cooled NVIDIA HGX™ H200 with 8 x SXM GPUs
PCIe Expansion Slots
PCIe Bridge Board - CBG76:
- 8 x FHHL x16 (Gen5 x16), from PEX89104
PCIe Bridge Board - CPBG045 x 2:
- 4 x FHHL x16 (Gen5 x16), from PEX89048
- 8 x FHHL x16 (Gen5 x16), from PEX89104
PCIe Bridge Board - CPBG045 x 2:
- 4 x FHHL x16 (Gen5 x16), from PEX89048
Front I/O
I/O board - CFPG540:
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
Rear I/O
MLAN board - CDB66:
1 x MLAN port
1 x MLAN port
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4
PCIe Gen5 x4
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
- Optional TPM2.0 kit: CTM010
Power Supply
4+4 3000W 80 PLUS Titanium redundant power supplies [1]
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
Motherboard:
2 x 60x60x56mm
2 x 60x60x76mm
PCIe slots:
4 x 80x80x56mm (15,500rpm)
GPU tray:
4 x 60x60x38mm (24,000rpm)
2 x 60x60x56mm
2 x 60x60x76mm
PCIe slots:
4 x 80x80x56mm (15,500rpm)
GPU tray:
4 x 60x60x38mm (24,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.
Packaging Content
1 x G4L3-ZD1-LAX3
1 x CPU cold plate loop
1 x L-shape Rail kit
1 x CPU cold plate loop
1 x L-shape Rail kit
* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
SUPPORT
BIOS
BIOS
說明
版本
檔案大小
日期
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
更新BIOS有其潛在的風險，如果您使用目前版本的BIOS沒有問題，我們建議您不要任意更新BIOS。如需更新BIOS，請小心的執行，以避免不當的操作而造成系統毀損.
什麼是 BETA 版？
BETA版是正式推出前的試用版本。雖然該版本已經過測試，但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本，並請密切注意正式版本的推出。
更新BIOS有其潛在的風險，如果您使用目前版本的BIOS沒有問題，我們建議您不要任意更新BIOS。如需更新BIOS，請小心的執行，以避免不當的操作而造成系統毀損.
什麼是 BETA 版？
BETA版是正式推出前的試用版本。雖然該版本已經過測試，但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本，並請密切注意正式版本的推出。
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