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- G363-ZR0-AAX1
G363-ZR0- AAX1
HPC/AI Server - AMD EPYC™ 9004 - 3U DP HGX™ H100 4-GPU
- NVIDIA-Certified Systems™ - Data Center Servers
- NVIDIA HGX™ H100 with 4 x SXM5 GPUs
- 4th-generation NVIDIA® NVLink® 900GB/s
- Dual AMD EPYC™ 9004 Series Processors (with AMD 3D V-Cache™ Technology)
- 12-Channel DDR5 RDIMM, 24 x DIMMs
- Dual ROM Architecture
- 2 x 10Gb/s LAN ports via Broadcom® BCM57416
- 2 x 1Gb/s LAN ports via Intel® I350-AM2
- 4 x 2.5" Gen5 NVMe/SATA/SAS hot-swappable bays
- 4 x 2.5" Gen5 NVMe hot-swappable bays
- 1 x M.2 slot with PCIe Gen4 x4 interface
- 6 x LP PCIe Gen5 x16 slots
- 2+1 3000W 80 PLUS Titanium redundant power supplies
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
3U
448 x 130 x 800
448 x 130 x 800
Motherboard
MZ83-HD1
CPU
AMD EPYC™ 9004 Series Processors
AMD EPYC™ 9004 Series Processors with AMD 3D V-Cache™ Technology
Dual processor, 5nm technology
*Up to 128 cores, 256 threads per processor
cTDP up to 300W at ambient 35°C
*cTDP supported up to 400W under limited thermal conditions. Please contact technical support for more details.
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
AMD EPYC™ 9004 Series Processors with AMD 3D V-Cache™ Technology
Dual processor, 5nm technology
*Up to 128 cores, 256 threads per processor
cTDP up to 300W at ambient 35°C
*cTDP supported up to 400W under limited thermal conditions. Please contact technical support for more details.
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 6096
Socket SP5
Socket SP5
Chipset
System on Chip
Memory
24 x DIMM slots
DDR5 memory supported only
12-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported
Memory speed: Up to 4800 MT/s
DDR5 memory supported only
12-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported
Memory speed: Up to 4800 MT/s
LAN
Front side:
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function (by switch setting)
1 x 10/100/1000 Mbps Management LAN
Rear side:
2 x 10Gb/s LAN ports (1 x Broadcom® BCM57416)
Support NCSI function (by switch setting)
1 x 10/100/1000 Mbps Management LAN
Notice: When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function (by switch setting)
1 x 10/100/1000 Mbps Management LAN
Rear side:
2 x 10Gb/s LAN ports (1 x Broadcom® BCM57416)
Support NCSI function (by switch setting)
1 x 10/100/1000 Mbps Management LAN
Notice: When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Storage
Front side:
4 x 2.5" Gen5 NVMe/SATA/SAS* hot-swappable bays
4 x 2.5" Gen5 NVMe hot-swappable bays
- (4 x NVMe from CPU_0, 4 x NVMe from CPU_1, SATA from CPU_0)
*SAS card is required to support SAS drives.
4 x 2.5" Gen5 NVMe/SATA/SAS* hot-swappable bays
4 x 2.5" Gen5 NVMe hot-swappable bays
- (4 x NVMe from CPU_0, 4 x NVMe from CPU_1, SATA from CPU_0)
*SAS card is required to support SAS drives.
SAS
Require SAS add-in cards
RAID
Require RAID add-in cards
Expansion Slots
NVIDIA HGX™ H100 with 4 x SXM5 GPUs
Front side:
1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0
1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_1
Rear side:
4 x PCIe x16 (Gen5 x16) low-profile slots, from PEX89144, support RDMA
(Equipped with full-height brackets)
1 x OCP 3.0 slot on the front side disabled, from CPU_0
1 x M.2 slot (CMTP192):
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22110 cards
Front side:
1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0
1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_1
Rear side:
4 x PCIe x16 (Gen5 x16) low-profile slots, from PEX89144, support RDMA
(Equipped with full-height brackets)
1 x OCP 3.0 slot on the front side disabled, from CPU_0
1 x M.2 slot (CMTP192):
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22110 cards
Internal I/O
1 x TPM header
Front I/O
2 x USB 3.2 Gen1
1 x Mini-DP
2 x RJ45 (Intel I350)
1 x MLAN (default port)
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x Storage activity LED
1 x System status LED
1 x Mini-DP
2 x RJ45 (Intel I350)
1 x MLAN (default port)
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x Storage activity LED
1 x System status LED
Rear I/O
2 x RJ45 (Broadcom BCM57416)
1 x MLAN
1 x MLAN
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS 12Gb/s
PCIe Gen5 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
- Optional TPM2.0 kit: CTM010
Power Supply
2+1 3000W 80 PLUS Titanium redundant power supplies
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
Note: The system power supply requires C19 power cord.
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
Note: The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
7 x 80x80x80mm (17,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1176 x 782 x 295 mm
Packaging Content
1 x G363-ZR0-AAX1
2 x CPU heatsinks
1 x Mini-DP to D-Sub cable
1 x L-type Rail kit
2 x CPU heatsinks
1 x Mini-DP to D-Sub cable
1 x L-type Rail kit
Part Numbers
- Barebone w/ NVIDIA module: 6NG363ZR0DR000AAX1*
- Motherboard: 9MZ83HD1UR-000
- L-type Rail kit: 25HB2-A86102-K0R
- CPU heatsink: 25ST1-15320H-A3R
- GPU heatsink: 25ST1-3332G0-F2R
- Front panel board - CFP1000: 9CFP1000NR-00
- Backplane board - CBP2081: 9CBP2081NR-00
- Fan module: 25ST2-808035-S1R
- Fan module: 25ST2-888030-S1R
- Fan module: 25ST2-888031-S1R
- M.2 expansion card - CMTP192: 9CMTP192NR-00
- Riser card - CRSH01R: 9CRSH01RNR-00
- OCP card - CNVC171: 9CNVC171NR-00
- Front I/O board (incl. I350-AM2) - CLBH160: 9CLBH160NR-00
- Rear I/O board (incl. MLAN chip) - CDB66: 9CDB66NR-00
- PCIe switch board - CPBG901: 9CPBG901NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000A-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- RMA packaging: 6NG363ZR0SR-RMA-A100
- Motherboard: 9MZ83HD1UR-000
- L-type Rail kit: 25HB2-A86102-K0R
- CPU heatsink: 25ST1-15320H-A3R
- GPU heatsink: 25ST1-3332G0-F2R
- Front panel board - CFP1000: 9CFP1000NR-00
- Backplane board - CBP2081: 9CBP2081NR-00
- Fan module: 25ST2-808035-S1R
- Fan module: 25ST2-888030-S1R
- Fan module: 25ST2-888031-S1R
- M.2 expansion card - CMTP192: 9CMTP192NR-00
- Riser card - CRSH01R: 9CRSH01RNR-00
- OCP card - CNVC171: 9CNVC171NR-00
- Front I/O board (incl. I350-AM2) - CLBH160: 9CLBH160NR-00
- Rear I/O board (incl. MLAN chip) - CDB66: 9CDB66NR-00
- PCIe switch board - CPBG901: 9CPBG901NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000A-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- RMA packaging: 6NG363ZR0SR-RMA-A100
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SUPPORT
BIOS
工具程式
Firmware
OS
BIOS
說明
版本
檔案大小
日期
1) Optimize AC Loss feature.
2) Enhance PCIe compatibility.
2) Enhance PCIe compatibility.
Version : F09
20.52 MB
May 20, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
工具程式
說明
版本
檔案大小
日期
GSM CLI
Version : 2.1.76
147.87 MB
May 22, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
說明
版本
檔案大小
日期
BMC firmware with embedded GIGABYTE Management Console
(AST2600)
(AST2600)
Version : 13.05.09
113.83 MB
Jan 26, 2024
英語
使用手冊
說明
版本
檔案大小
日期
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
17.39 MB
Aug 29, 2023
英語
說明
版本
檔案大小
日期
作業系統支援列表
Version : 1.2
0.17 MB
Sep 07, 2023
AMD EPYC™ 9004 Series Processors OS Support List
RESOURCES
Articles
Solutions
Tech Guide | September 21, 2023
How to Pick the Right Server for AI? Part Two: Memory, Storage, and More
The proliferation of tools and services empowered by artificial intelligence has made the procurement of “AI servers” a priority for organizations big and small. In Part Two of GIGABYTE Technology’s Tech Guide on choosing an AI server, we look at six other vital components besides the CPU and GPU that can transform your server into a supercomputing powerhouse.
Others
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