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HPC Server - AMD EPYC™ 7003/7002 - 2U DP 16 x Gen4 GPUs (Broadcom solution) Immersion
- Immersion Cooling Server
- Supports up to 16 x Single slot Gen4 GPUs
- Dual AMD EPYC™ 7003/7002 Series Processors
- 8-Channel DDR4 RDIMM/LRDIMM, 16 x DIMMs
- 2 x 10Gb/s LAN ports via Intel® X550-AT2
- 4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
- 4 x 2.5" SATA/SAS hot-swappable bays
- 16 x FHFL PCIe Gen4 x16 slots for GPUs
- 2 x LP PCIe Gen4 x16 slots for add-in cards
- Dual 2200W 80 PLUS Titanium power supply
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U
448 x 87.5 x 800
448 x 87.5 x 800
Motherboard
MZ42-G20 Rev. 3.0
CPU
AMD EPYC™ 7003 Series Processors
AMD EPYC™ 7002 Series Processors
Dual processor, 7nm technology
Up to 64 cores, 128 threads per processor
cTDP up to 240W with 35°C oil inlet
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
AMD EPYC™ 7002 Series Processors
Dual processor, 7nm technology
Up to 64 cores, 128 threads per processor
cTDP up to 240W with 35°C oil inlet
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 4094
Socket SP3
Socket SP3
Chipset
System on Chip
Memory
16 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
Memory speed: Up to 3200 MT/s
DDR4 memory supported only
8-Channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
Memory speed: Up to 3200 MT/s
LAN
Top side:
2 x 10Gb/s LAN ports (1 x Intel® X550-AT2)
Support NCSI function
1 x 10/100/1000 Mbps Management LAN
2 x 10Gb/s LAN ports (1 x Intel® X550-AT2)
Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Storage
SAS
Depends on SAS add-in cards
RAID
Depends on SAS add-in cards
Expansion Slots
16 x PCIe x16 (Gen4 x16) FHFL slots, from PEX88096, for single slot GPUs (Broadcom solution)
1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0
1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_1
- Maximum limitation of GPU cards: 285mm (L) x 111.5mm (W) x 39.5mm (H).
- System is validated for population with a uniform GPU model.
- Support is not provided for mixed GPU populations.
- For the latest GPU cards QVL, please contact your GIGABYTE representative.
1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0
1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_1
- Maximum limitation of GPU cards: 285mm (L) x 111.5mm (W) x 39.5mm (H).
- System is validated for population with a uniform GPU model.
- Support is not provided for mixed GPU populations.
- For the latest GPU cards QVL, please contact your GIGABYTE representative.
Internal I/O
1 x TPM header
Top I/O
2 x USB 3.2 Gen1
1 x VGA
2 x RJ45
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x System status LED
1 x VGA
2 x RJ45
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x System status LED
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
- Optional TPM2.0 kit: CTM010
Power Supply
Dual 2200W 80 PLUS Titanium power supply
AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-240V~/ 15.5A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 15.5A
DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 81A
+12Vsb/ 3A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.2V/ 180A
+12Vsb/ 3A
Note: The system power supply requires C19 power cord.
AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-240V~/ 15.5A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 15.5A
DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 81A
+12Vsb/ 3A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.2V/ 180A
+12Vsb/ 3A
Note: The system power supply requires C19 power cord.
System Management
Aspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- JAVA Based Serial Over LAN
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage/Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Citrix Hypervisor 8.2.0 or later
Red Hat Enterprise Linux 8.3 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 8.3 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022
Operating Properties
Operating coolant temperature: 25°C to 35°C
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1133 x 724 x 261 mm
Packaging Content
1 x G292-Z43-ICM1
2 x CPU heatsinks
2 x CPU heatsinks
Part Numbers
- Barebone package: 6NG292Z43MR000ICM1*
- Motherboard: 9MZ42G20NR-00
- CPU heatsink: 25ST1-44320N-A3R/25ST1-44320P-A3R
- Backplane board - CBPG084: 9CBPG084NR-00
- Riser card for GPU: 9CRSG740NR-00/9CRSG741NR-00
- Power supply: 25EP0-22200B-G1S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- Motherboard: 9MZ42G20NR-00
- CPU heatsink: 25ST1-44320N-A3R/25ST1-44320P-A3R
- Backplane board - CBPG084: 9CBPG084NR-00
- Riser card for GPU: 9CRSG740NR-00/9CRSG741NR-00
- Power supply: 25EP0-22200B-G1S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SUPPORT
驅動程式
BIOS
工具程式
Firmware
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 64bit
晶片組
晶片組
版本
檔案大小
日期
AMD Chipset Driver
For AMD EPYC 7002/ 7003
For AMD EPYC 7002/ 7003
Version : 2.10.09.156
17.22 MB
Mar 05, 2021
作業系統: Windows Server 2016 64bit,Windows Server 2019
Broadcom PCIe Switch Driver
Version : F18
3.56 MB
Dec 15, 2021
作業系統: Windows Server 2016 64bit,Windows Server 2019
網路介面
BIOS
說明
版本
檔案大小
日期
1) Updated to AGESA RomePI 1.0.0.J.
2) Updated to AGESA MilanPI 1.0.0.D.
3) Included multiple security updates.
2) Updated to AGESA MilanPI 1.0.0.D.
3) Included multiple security updates.
Version : M23_R29
35.47 MB
Nov 04, 2024
1) Fixed PKfail Vulnerability.
2) Optimized BcpPro tool compatibility.
2) Optimized BcpPro tool compatibility.
Version : M22_R28
35.46 MB
Aug 26, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
工具程式
說明
版本
檔案大小
日期
GSM CLI
Version : 2.1.77
147.89 MB
Sep 27, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
說明
版本
檔案大小
日期
BMC Firmware with embedded GIGABYTE Management Console
(AST2500 AMI)
(AST2500 AMI)
Version : 12.61.21
105.38 MB
Apr 11, 2024
英語
使用手冊
說明
版本
檔案大小
日期
RESOURCES
Solutions
Cooling
Modern Data Center Cooling Solution: Immersion Cooling
The scalable, faster, and energy-efficient way to cool your data center, immersion cooling can save more for your business and is overall more reliable.
Cooling
Single-Phase Immersion Cooling with Asperitas
GIGABYTE has joined forces with Asperitas to offer a Single-Phase Immersion Cooling solution, allowing customers to dramatically reduce their data center energy consumption and improve PUE, radically reducing operating costs and environmental impact.
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