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- G292-280
HPC/AI Server - 3rd Gen Intel® Xeon® Scalable - 2U DP 8 x PCIe Gen4 GPUs Immersion
- Immersion Cooling Server
- Supports up to 8 x Dual slot Gen4 GPUs
- Dual 3rd Gen Intel® Xeon® Scalable Processors
- 8-Channel DDR4 RDIMM/LRDIMM, 24 x DIMMs
- Dual ROM Architecture
- 2 x 10Gb/s LAN ports via Intel® X710-AT2
- 4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
- 4 x 2.5" SATA/SAS hot-swappable bays
- 8 x FHFL PCIe Gen4 x16 slots for GPUs
- 2 x LP PCIe Gen4 x16 slots for add-in cards
- Dual 3200W 80 PLUS Platinum redundant power supply
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U
448 x 87.5 x 800
448 x 87.5 x 800
Motherboard
MG52-G20
CPU
3rd Generation Intel® Xeon® Scalable Processors
Dual processor, 10nm technology
TDP up to 270W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Dual processor, 10nm technology
TDP up to 270W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 4189
Socket P+
Socket P+
Chipset
Intel® C621A
Memory
24 x DIMM slots
DDR4 memory supported only
8-channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
1.2V modules: 3200/2933/2666 MT/s
DDR4 memory supported only
8-channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
1.2V modules: 3200/2933/2666 MT/s
LAN
Top side:
2 x 10Gb/s LAN ports (1 x Intel® X710-AT2)
Support NCSI function
1 x 10/100/1000 Mbps Management LAN
2 x 10Gb/s LAN ports (1 x Intel® X710-AT2)
Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Storage
Bottom side:
4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
4 x 2.5" SATA/SAS hot-swappable bays
- (2 x NVMe from CPU_0, 2 x NVMe from CPU_1)
SAS card is required for SAS devices support
4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
4 x 2.5" SATA/SAS hot-swappable bays
- (2 x NVMe from CPU_0, 2 x NVMe from CPU_1)
SAS card is required for SAS devices support
SAS
Depends on SAS add-in cards
RAID
Intel® SATA RAID 0/1/10/5
Expansion Slots
Riser Card CRSG620 x 2:
4 x PCIe x16 (Gen4 x16) FHFL slots, from PEX88048, for GPUs
Riser Card CRSG621 x 2:
4 x PCIe x16 (Gen4 x16) FHFL slots, from PEX88048, for GPUs
Riser Card CRSG01A x 2:
1 x PCIe x16 (Gen4 x16) low-profile slot on the top side, from CPU_0
1 x PCIe x16 (Gen4 x16) low-profile slot on the top side, from CPU_1
- Maximum limitation of GPU cards: 285mm (L) x 111.5mm (W) x 39.5mm (H).
- System is validated for population with a uniform GPU model.
- Support is not provided for mixed GPU populations.
4 x PCIe x16 (Gen4 x16) FHFL slots, from PEX88048, for GPUs
Riser Card CRSG621 x 2:
4 x PCIe x16 (Gen4 x16) FHFL slots, from PEX88048, for GPUs
Riser Card CRSG01A x 2:
1 x PCIe x16 (Gen4 x16) low-profile slot on the top side, from CPU_0
1 x PCIe x16 (Gen4 x16) low-profile slot on the top side, from CPU_1
- Maximum limitation of GPU cards: 285mm (L) x 111.5mm (W) x 39.5mm (H).
- System is validated for population with a uniform GPU model.
- Support is not provided for mixed GPU populations.
Internal I/O
1 x TPM header
1 x VROC connector
1 x VROC connector
Top I/O
2 x USB 3.2 Gen1
1 x VGA
2 x RJ45
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x System status LED
1 x VGA
2 x RJ45
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x System status LED
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
- Optional TPM2.0 kit: CTM010
Power Supply
Dual 3200W 80 PLUS Platinum redundant power supply
AC Input:
- 100-127V~/ 14A, 50/60Hz
- 200-208V~/ 16A, 50/60Hz
- 214-234V~/ 16A, 50/60Hz
- 240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output: - Max 1106W/ 100-127V~
+12.3V/ 87A
+12Vsb/ 3A
- Max 2434W/ 200-208V~
+12.3V/ 195A
+12Vsb/ 3A
- Max 2828W/ 214-234V~
+12.3V/ 227A
+12Vsb/ 3A
- Max 3234W/ 240V~ or 240Vdc Input
+12.3V/ 260A
+12Vsb/ 3A
Note: The system power supply requires C19 power cord.
AC Input:
- 100-127V~/ 14A, 50/60Hz
- 200-208V~/ 16A, 50/60Hz
- 214-234V~/ 16A, 50/60Hz
- 240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output: - Max 1106W/ 100-127V~
+12.3V/ 87A
+12Vsb/ 3A
- Max 2434W/ 200-208V~
+12.3V/ 195A
+12Vsb/ 3A
- Max 2828W/ 214-234V~
+12.3V/ 227A
+12Vsb/ 3A
- Max 3234W/ 240V~ or 240Vdc Input
+12.3V/ 260A
+12Vsb/ 3A
Note: The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Citrix Hypervisor 8.2.0 or later
Red Hat Enterprise Linux 7.9 (x64) or later
Red Hat Enterprise Linux 8.2 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later
Windows Server 2016
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 7.9 (x64) or later
Red Hat Enterprise Linux 8.2 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later
Windows Server 2016
Windows Server 2019
Windows Server 2022
Operating Properties
Operating coolant temperature: 25°C to 35°C
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1133 x 724 x 261 mm
Packaging Content
1 x G292-280-IAY1
2 x CPU heatsinks
2 x CPU heatsinks
Part Numbers
- Barebone package: 6NG292280DR000IAY1*
- Motherboard: 9MG52G20NR-00
- CPU heatsink: 25ST1-343203-M1R/25ST1-343204-M1R
- Backplane board - CBPG084: 9CBPG084NR-00
- Riser card - CRSG620: 9CRSG620NR-00
- Riser card - CRSG621: 9CRSG621NR-00
- Riser card - CRSG01A: 9CRSG01ANR-00
- Power supply: 25EP0-230008-D0S
Optional parts:
- VROC module: 25FD0-R181N0-10R (Supported for Intel SSD only)
- 2 x 7mm internal SSD cable kit: 6NG291281SR-00-100
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- RMA packaging: 6NG292280SR-RMA-I101
- Motherboard: 9MG52G20NR-00
- CPU heatsink: 25ST1-343203-M1R/25ST1-343204-M1R
- Backplane board - CBPG084: 9CBPG084NR-00
- Riser card - CRSG620: 9CRSG620NR-00
- Riser card - CRSG621: 9CRSG621NR-00
- Riser card - CRSG01A: 9CRSG01ANR-00
- Power supply: 25EP0-230008-D0S
Optional parts:
- VROC module: 25FD0-R181N0-10R (Supported for Intel SSD only)
- 2 x 7mm internal SSD cable kit: 6NG291281SR-00-100
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- RMA packaging: 6NG292280SR-RMA-I101
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SUPPORT
驅動程式
BIOS
工具程式
Firmware
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 64bit
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晶片組
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版本
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日期
Intel® LAN Driver and Utility
Version : 26.2
678.06 MB
Jun 10, 2021
作業系統: Windows Server 2016 64bit,Windows Server 2019
Intel® LAN Driver and Utility
Version : 27.0
714.97 MB
Apr 21, 2022
作業系統: Windows Server 2022
SATA RAID/AHCI
SATA RAID/AHCI
版本
檔案大小
日期
Intel® SATA Preinstall driver
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
Version : 7.5.0.1991
4.17 MB
Sep 08, 2021
作業系統: Windows Server 2016 64bit,Windows Server 2019
Intel® Rapid Storage Technology enterprise (Intel® RSTe)
Version : 7.5.0.1991
23.93 MB
Sep 08, 2021
作業系統: Windows Server 2016 64bit,Windows Server 2019
Intel® SATA Preinstall driver
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
Version : 7.7.0.1273
7.07 MB
Apr 25, 2022
作業系統: Windows Server 2022
Intel® Rapid Storage Technology enterprise (Intel® RSTe)
Version : 7.7.0.1273
23.58 MB
Apr 25, 2022
作業系統: Windows Server 2022
BIOS
說明
版本
檔案大小
日期
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
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- VMware
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- Linux
工具程式
說明
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GSM CLI
Version : 2.1.78
147.79 MB
Dec 12, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
使用手冊
說明
版本
檔案大小
日期
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
11.72 MB
Aug 12, 2024
英語
RESOURCES
Success Case
Articles
Solutions
Cooling
Single-phase Immersion Cooling with GIGABYTE
Complete single-phase immersion cooling solution under one roof.
Cooling
Modern Data Center Cooling Solution: Immersion Cooling
The scalable, faster, and energy-efficient way to cool your data center, immersion cooling can save more for your business and is overall more reliable.
Cooling
Single-Phase Immersion Cooling with Asperitas
GIGABYTE has joined forces with Asperitas to offer a Single-Phase Immersion Cooling solution, allowing customers to dramatically reduce their data center energy consumption and improve PUE, radically reducing operating costs and environmental impact.
Success Case | June 07, 2023
Japanese Telco Leader KDDI Invents Immersion Cooling Small Data Center with GIGABYTE
Japanese telco giant KDDI Corporation has invented a new class of data centers that are mobile and eco-friendly. These “container-type immersion cooling small data centers” employ “single-phase immersion cooling” to reduce power consumption by 43% and lower the PUE below 1.07. GIGABYTE Technology drew from its years of experience in the telco sector to provide the R282-Z93 and R182-Z91 Rack Servers for KDDI to use as the management and GPU computing nodes in the data center. KDDI benefits from the servers’ powerful 3rd Gen AMD EPYC™ CPUs, the scalable, high-density configuration of NVIDIA® GPUs in small form factors, and the servers’ optimized compatibility with the liquid-based data center cooling solution. GIGABYTE’s participation in KDDI’s project is in line with GIGABYTE’s long-term CSR and ESG efforts, which are focused on working with global industry leaders to “Upgrade Your Life” with high tech while building a greener, more sustainable environment for our future.
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