Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 840
CPU
5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Dual processor per node, TDP up to 270W
Supports TDP up to 350W with no support on OCP slot at ambient 35°C.
Supports TDP up to 350W at ambient 30°C.
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
Per Node:
2 x LGA 4677
Total:
8 x LGA 4677
Socket E
Memory
Per node:
16 x DIMM slots
Total:
64 x DIMM slots
DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported
5th Gen Intel® Xeon®: Up to 5600 MT/s
4th Gen Intel® Xeon®: Up to 4800 MT/s
Intel® Xeon® Max Series: Up to 4800 MT/s
LAN
Per node:
1 x 10/100/1000 Mbps Management LAN
Total:
4 x 10/100/1000 Mbps Management LAN
*1 x CMC port
*Please refer to optional parts for ring topology support.
Note: Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
2 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swappable bays, from CPU_1
Total:
8 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swappable bays, from CPU_1
SAS card is required for SAS devices support
SAS
Depends on SAS add-in cards
RAID
Intel® SATA RAID 0/1/10/5
Expansion Slots
Per node:
Riser Card CRSH01U:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0
1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function
Optional 1 x M.2 slot (CMTP061):
- M-key
- PCIe Gen4 x4, from CPU_1
- Supports 2280/22110 cards
Total:
Riser Card CRSH01U x 4:
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0
4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU_0
Support NCSI function
Optional 4 x M.2 slots (CMTP061):
- M-key
- PCIe Gen4 x4, from CPU_1
- Support 2280/22110 cards
Internal I/O
Per node:
1 x TPM header
1 x VROC connector
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
*1 x CMC status LED
*1 x CMC reset button
*Only one CMC status LED and reset button per system.
Rear I/O
Per node:
2 x USB 3.2 Gen1
1 x VGA
1 x MLAN
1 x ID button with LED
Total:
8 x USB 3.2 Gen1
4 x VGA
4 x MLAN
4 x ID buttons with LED
*1 x CMC port
*Only one CMC port per system.
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
TPM
1 x TPM header with SPI interface
-
Optional TPM2.0 kit:
CTM010
Power Supply
Dual 3000W 80 PLUS Titanium redundant power supply
Available for 2+1 redundant power supply configuration (optional)
AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A
Note: The system power supply requires C19 power cord.
System Management
Aspeed
® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 80x80x80mm (16,500rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1180 x 779 x 300 mm
Packaging Content
1 x H263-S67-AAW1
8 x CPU heatsinks
24 x Carriers
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NH263S67DR000ABW1*
- Motherboard: 9MS63HD1UR-000
- 3-Section Rail kit: 25HB2-A66125-K0R
- CPU heatsink: 25ST1-453200-A0R/25ST1-453208-C1R
- Front panel board - CFPH004: 9CFPH004NR-00
- Backplane board - CBPH081: 9CBPH081NR-00
- Fan module: 25ST2-888020-S1R
- Riser card - CRSH01U: 9CRSH01UNR-00
- LAN board - CLBH010: 9CLBH010NR-00
- Power supply: 25EP0-230009-L0S
Optional parts:
- M.2 riser card - CMTP061: 9CMTP061NR-00
- Ring topology kit (10-kit package): 6NH263S62S1000AAN11
- RMA packaging: 6NH263S67SR-RMA-A100
* Les informations ici proposées le sont pour référence uniquement. GIGABYTE se réserve le droit de modifier ce contenu à tout moment et sans préavis.
*Les performances affichées sont basées sur les informations proposées par les constructeurs de chipsets ou sociétés définissant les caractéristiques des interfaces. Performances pouvant varier selon configuration.
* Marques et logos appartiennent aux détenteurs respectifs de leurs droits.
* L'architecture de grand nombre de PC affectera directement la capacité mémoire, en effet, une certaine quantité de RAM sera affectée au système, la quantité totale affichée pourra alors varier de celle insérée sur votre carte mère
