H263-S63- AAW1

High Density Server - 5th/4th Gen Intel^® Xeon^® Scalable - 2U 4-Node DP 8-Bay Gen4 NVMe/SATA/SAS 3000W

# HPC # HCI

2U 4-node rear access server system
Dual 5th/4th Gen Intel^® Xeon^® Scalable Processors per node
8-Channel DDR5 RDIMM, 64 x DIMMs
Dual ROM Architecture
1 x CMC port
8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
4 x M.2 slots with PCIe Gen4 x4 interface (optional)
8 x LP PCIe Gen5 x16 slots
4 x LP PCIe Gen5 x16 slots (optional)
4 x OCP 3.0 Gen5 x16 slots
Dual 3000W 80 PLUS Titanium redundant power supply

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Comparer

* Les informations ici proposées le sont pour référence uniquement. GIGABYTE se réserve le droit de modifier ce contenu à tout moment et sans préavis.
* Marques et logos appartiennent aux détenteurs respectifs de leurs droits.
* L'architecture de grand nombre de PC affectera directement la capacité mémoire, en effet, une certaine quantité de RAM sera affectée au système, la quantité totale affichée pourra alors varier de celle insérée sur votre carte mère

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Rear access
440 x 87.5 x 840

Motherboard

MS63-HD1

CPU

5th Generation Intel^® Xeon^® Scalable Processors
4th Generation Intel^® Xeon^® Scalable Processors
Dual processor per node, TDP up to 225W

Supports TDP up to 270W with only 1 x low-profile slot being used and no support on OCP slot at ambient 30°C.

Supports TDP up to 270W with 2 x low-profile slots being used and no support on OCP slot at ambient 25°C.

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

Per Node:
2 x LGA 4677

Total:
8 x LGA 4677

Socket E

Chipset

Intel^® C741

Memory

Per node:
16 x DIMM slots

Total:
64 x DIMM slots

DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported

5th Gen Intel^® Xeon^®: Up to 5600 MT/s
4th Gen Intel^® Xeon^®: Up to 4800 MT/s

LAN

Per node:
1 x 10/100/1000 Mbps Management LAN

Total:
4 x 10/100/1000 Mbps Management LAN
*1 x CMC port

*Please refer to optional parts for ring topology support.

Note: Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.

Video

Integrated in Aspeed^® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Management chip on CMC board:
Integrated in Aspeed^® AST2520A2-GP

Storage

Per node:
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1

Total:
8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1

SAS card is required for SAS devices support

SAS

Depends on SAS add-in cards

RAID

Intel^® SATA RAID 0/1

Expansion Slots

Per node:
Riser Card CRSH01T:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0

Riser Card CRSH01U:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0

Riser Card CRSH310 (optional):
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_1

1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function

Optional 1 x M.2 slot (CMTP061):
- M-key
- PCIe Gen4 x4, from CPU_1
- Supports 2280/22110 cards

Total:
Riser Card CRSH01T x 4:
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0

Riser Card CRSH01U x 4:
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0

Riser Card CRSH310 x 4 (optional):
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_1

4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU_0
Support NCSI function

Optional 4 x M.2 slots (CMTP061):
- M-key
- PCIe Gen4 x4, from CPU_1
- Support 2280/22110 cards

Internal I/O

Per node:
1 x TPM header
1 x VROC connector

Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
*1 x CMC status LED
*1 x CMC reset button

*Only one CMC status LED and reset button per system.

Rear I/O

Per node:
2 x USB 3.2 Gen1
1 x VGA
1 x MLAN
1 x ID button with LED

Total:
8 x USB 3.2 Gen1
4 x VGA
4 x MLAN
4 x ID buttons with LED
*1 x CMC port

*Only one CMC port per system.

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

Dual 3000W 80 PLUS Titanium redundant power supply
Available for 2+1 redundant power supply configuration (optional)

AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 16A

DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A

Note: The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

Additional certifications:
Windows Server 2022 (x64)

System Fans

8 x 80x80x38mm (18,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 47.68 kg
Gross Weight: 62.4 kg

Packaging Dimensions

1180 x 779 x 300 mm

Packaging Content

1 x H263-S63-AAW1
8 x CPU heatsinks
24 x Carriers
1 x 3-Section Rail kit

Part Numbers

- Barebone package (5th/4th Gen): 6NH263S63DR000ABW1*
- Barebone package (4th Gen): 6NH263S63DR000AAW1*
- Motherboard: 9MS63HD1UR-000
- 3-Section Rail kit: 25HB2-A66125-K0R
- CPU heatsink: 25ST1-453207-C1R/25ST1-453208-C1R
- Front panel board - CFPH004: 9CFPH004NR-00
- Backplane board - CBPH081: 9CBPH081NR-00
- Fan module: 25ST2-88382P-S1R/25ST2-88382Q-S1R
- Riser card - CRSH01T: 9CRSH01TNR-00
- Riser card - CRSH01U: 9CRSH01UNR-00
- LAN board - CLBH010: 9CLBH010NR-00
- Power supply: 25EP0-23000L-L0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 riser card - CMTP061: 9CMTP061NR-00
- Riser card - CRSH310: 9CRSH310NR-00
- Ring topology kit (10-kit package): 6NH263S62S1000AAN11
- RMA packaging: 6NH263S63SR-RMA-A100

* Les informations ici proposées le sont pour référence uniquement. GIGABYTE se réserve le droit de modifier ce contenu à tout moment et sans préavis.
*Les performances affichées sont basées sur les informations proposées par les constructeurs de chipsets ou sociétés définissant les caractéristiques des interfaces. Performances pouvant varier selon configuration.
* Marques et logos appartiennent aux détenteurs respectifs de leurs droits.
* L'architecture de grand nombre de PC affectera directement la capacité mémoire, en effet, une certaine quantité de RAM sera affectée au système, la quantité totale affichée pourra alors varier de celle insérée sur votre carte mère

SUPPORT

Téléchargements

Driver
BIOS
Utilitaire
Firmware

Mode d'emploi
Liste Compatibilité

Online Support

Driver

BIOS

Utilitaire

Firmware

QVL

All
All
Windows Server 2022
Windows Server 2019
Linux

Chipset

Version

Taille

Date

Intel^® Chipset Driver

Version : 10.1.19485.8386

3.81 MB

Jan 04, 2024

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SPECIFICATIONS

SUPPORT

RESOURCES

H263-S63-AAW1

H263-S63- AAW1