- Home
- Enterprise
- High Density Servers
- H252-Z10
- 2U 4-node rear access server system
- Single AMD EPYC™ 7003/7002 Series Processors per node
- 8-Channel DDR4 RDIMM/LRDIMM, 32 x DIMMs
- 8 x 1Gb/s LAN ports via Intel® I350-AM2
- 1 x CMC port
- 24 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
- 8 x M.2 slots with PCIe Gen3 x4 interface
- 4 x LP PCIe Gen4 x16 slots
- 4 x LP PCIe Gen3 x16 slots
- 4 x OCP 2.0 Gen3 x16 mezzanine slots
- Dual 2000W 80 PLUS Platinum redundant power supply
* Les informations ici proposées le sont pour référence uniquement. GIGABYTE se réserve le droit de modifier ce contenu à tout moment et sans préavis.
* Marques et logos appartiennent aux détenteurs respectifs de leurs droits.
* L'architecture de grand nombre de PC affectera directement la capacité mémoire, en effet, une certaine quantité de RAM sera affectée au système, la quantité totale affichée pourra alors varier de celle insérée sur votre carte mère
* Marques et logos appartiennent aux détenteurs respectifs de leurs droits.
* L'architecture de grand nombre de PC affectera directement la capacité mémoire, en effet, une certaine quantité de RAM sera affectée au système, la quantité totale affichée pourra alors varier de celle insérée sur votre carte mère
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 695
440 x 87.5 x 695
Motherboard
MZ12-HD0 Rev. 3.0
CPU
AMD EPYC™ 7003 Series Processors
AMD EPYC™ 7002 Series Processors
Single processor per node, 7nm technology
Up to 64 cores, 128 threads
TDP up to 225W, cTDP up to 240W
Supports cTDP 280W at ambient 30°C
M.2 devices not supported if using 280W CPU
AMD EPYC™ 7002 Series Processors
Single processor per node, 7nm technology
Up to 64 cores, 128 threads
TDP up to 225W, cTDP up to 240W
Supports cTDP 280W at ambient 30°C
M.2 devices not supported if using 280W CPU
Socket
Per Node:
1 x LGA 4094
Total:
4 x LGA 4094
Socket SP3
1 x LGA 4094
Total:
4 x LGA 4094
Socket SP3
Chipset
System on Chip
Memory
Per node:
8 x DIMM slots
Total:
32 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
Memory speed: Up to 3200 MT/s
8 x DIMM slots
Total:
32 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
Memory speed: Up to 3200 MT/s
LAN
Per node:
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function
1 x 10/100/1000 Mbps Management port
Total:
8 x 1Gb/s LAN ports (4 x Intel® I350-AM2)
Support NCSI function
4 x 10/100/1000 Mbps Management ports
1 x CMC port
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function
1 x 10/100/1000 Mbps Management port
Total:
8 x 1Gb/s LAN ports (4 x Intel® I350-AM2)
Support NCSI function
4 x 10/100/1000 Mbps Management ports
1 x CMC port
Video
Integrated in Aspeed® AST2500 x 4
- 4 x VGA ports
- 4 x VGA ports
Storage
Per node:
6 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
Total:
24 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
6 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
Total:
24 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
SAS
Depends on SAS add-in cards
RAID
N/A
Expansion Slots
Per node:
1 x PCIe x16 (Gen4 x16) low-profile slot
1 x PCIe x16 (Gen3 x16) low-profile slot
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)
2 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Total:
4 x PCIe x16 (Gen4 x16) low-profile slots
4 x PCIe x16 (Gen3 x16) low-profile slots
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)
8 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
1 x PCIe x16 (Gen4 x16) low-profile slot
1 x PCIe x16 (Gen3 x16) low-profile slot
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)
2 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Total:
4 x PCIe x16 (Gen4 x16) low-profile slots
4 x PCIe x16 (Gen3 x16) low-profile slots
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)
8 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Internal I/O
Per node:
1 x TPM header
1 x TPM header
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x System status LED
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x System status LEDs
*1 x CMC status LED
*Only one CMC status LED per system.
1 x Power button with LED
1 x ID button with LED
1 x System status LED
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x System status LEDs
*1 x CMC status LED
*Only one CMC status LED per system.
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port
*Only one CMC port per system.
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port
*Only one CMC port per system.
Backplane Board
Speed and bandwidth:
PCIe Gen3 x4 or SATA 6Gb/s or SAS 12Gb/s
PCIe Gen3 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
- Optional TPM2.0 kit: CTM010
Power Supply
Dual 2000W 80 PLUS Platinum redundant power supply
AC Input:
- 100-127V~/ 12A, 47-63Hz
- 200-219V~/ 10A, 47-63Hz
- 220-240V~/ 10A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 10A
DC Output:
- Max 1000W/ 100-127V~
+12V/ 83A
+12Vsb/ 3A
- Max 1800W/ 200-219V~
+12V/ 148A
+12Vsb/ 3A
- Max 1968W/ 220-240V~ or 240Vdc Input
+12V/ 162A
+12Vsb/ 3A
AC Input:
- 100-127V~/ 12A, 47-63Hz
- 200-219V~/ 10A, 47-63Hz
- 220-240V~/ 10A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 10A
DC Output:
- Max 1000W/ 100-127V~
+12V/ 83A
+12Vsb/ 3A
- Max 1800W/ 200-219V~
+12V/ 148A
+12Vsb/ 3A
- Max 1968W/ 220-240V~ or 240Vdc Input
+12V/ 162A
+12Vsb/ 3A
System Management
Aspeed® AST2500 Baseboard Management Controller
Aspeed® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface
Aspeed® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface
- Dashboard
- JAVA Based Serial Over LAN
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Citrix Hypervisor 8.2.0 or later
Red Hat Enterprise Linux 8.3 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later
Ubuntu 18.04.5 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 8.3 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later
Ubuntu 18.04.5 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 25.2 kg
Gross Weight: 43.6 kg
Gross Weight: 43.6 kg
Packaging Dimensions
1167 x 700 x 309 mm
Packaging Content
1 x H252-Z10
4 x CPU heatsinks
1 x 3-Section Rail kit
4 x CPU heatsinks
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NH252Z10MR-00-A*
- Motherboard: 9MZ12HD0NR-00
- 3-Section Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320J-A0R
- Backplane board - CBPH0O4: 9CBPH0O4NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power supply: 25EP0-220008-D0S
Optional parts:
- Power cord 125V/15A (JP): 25CPA-018304-Q0R
- M.2 expansion card - CMTP051: 9CMTP051NR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH252Z10SR-RMA-A100
- Motherboard: 9MZ12HD0NR-00
- 3-Section Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320J-A0R
- Backplane board - CBPH0O4: 9CBPH0O4NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power supply: 25EP0-220008-D0S
Optional parts:
- Power cord 125V/15A (JP): 25CPA-018304-Q0R
- M.2 expansion card - CMTP051: 9CMTP051NR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH252Z10SR-RMA-A100
* Les informations ici proposées le sont pour référence uniquement. GIGABYTE se réserve le droit de modifier ce contenu à tout moment et sans préavis.
*Les performances affichées sont basées sur les informations proposées par les constructeurs de chipsets ou sociétés définissant les caractéristiques des interfaces. Performances pouvant varier selon configuration.
* Marques et logos appartiennent aux détenteurs respectifs de leurs droits.
* L'architecture de grand nombre de PC affectera directement la capacité mémoire, en effet, une certaine quantité de RAM sera affectée au système, la quantité totale affichée pourra alors varier de celle insérée sur votre carte mère
*Les performances affichées sont basées sur les informations proposées par les constructeurs de chipsets ou sociétés définissant les caractéristiques des interfaces. Performances pouvant varier selon configuration.
* Marques et logos appartiennent aux détenteurs respectifs de leurs droits.
* L'architecture de grand nombre de PC affectera directement la capacité mémoire, en effet, une certaine quantité de RAM sera affectée au système, la quantité totale affichée pourra alors varier de celle insérée sur votre carte mère
SUPPORT
Driver
BIOS
Utilitaire
Firmware
QVL
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 64bit
Chipset
LAN
BIOS
Description
Version
Taille
Date
1) Updated to AGESA RomePI 1.0.0.J.
2) Updated to AGESA MilanPI 1.0.0.D.
3) Included multiple security updates.
2) Updated to AGESA MilanPI 1.0.0.D.
3) Included multiple security updates.
Version : M19_R33
35.33 MB
Oct 11, 2024
1) Fixed PKfail Vulnerability.
2) Optimized BcpPro tool compatibility.
2) Optimized BcpPro tool compatibility.
Version : M18_R32
35.32 MB
Aug 26, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
Because BIOS flashing is potentially risky, if you do not encounter problems using the current version of BIOS, it is recommended that you not flash the BIOS. To flash the BIOS, do it with caution. Inadequate BIOS flashing may result in system malfunction.
What is a BETA?
BETA describes a new version that is reliable yet may not include all the features of the final product. During this phase we are previewing new features and gathering customer input to insure our product provides the best experience possible.
Update CPU ID/Micro codes in new BIOS means?
[1] To support new series of CPUs, or [2] To support the same CPU but with new stepping. CPU support of motherboard is consist of BIOS and hardware design, detail CPU support information please see CPU support list.
Because BIOS flashing is potentially risky, if you do not encounter problems using the current version of BIOS, it is recommended that you not flash the BIOS. To flash the BIOS, do it with caution. Inadequate BIOS flashing may result in system malfunction.
What is a BETA?
BETA describes a new version that is reliable yet may not include all the features of the final product. During this phase we are previewing new features and gathering customer input to insure our product provides the best experience possible.
Update CPU ID/Micro codes in new BIOS means?
[1] To support new series of CPUs, or [2] To support the same CPU but with new stepping. CPU support of motherboard is consist of BIOS and hardware design, detail CPU support information please see CPU support list.
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
Utilitaire
Description
Version
Taille
Date
GSM CLI
Version : 2.1.78
147.79 MB
Dec 12, 2024
OS: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
OS: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
OS: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
Description
Version
Taille
Date
BMC Firmware with embedded GIGABYTE Management Console
(AST2500 AMI)
(AST2500 AMI)
Version : 12.61.21
105.38 MB
Apr 11, 2024
Anglais
CMC Firmware (AST2520)
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Version : 12.41.36
83.16 MB
Nov 02, 2023
Anglais
Mode d'emploi
Description
Version
Taille
Date
Description
Version
Taille
Date
RESOURCES
Success Case
Articles
Video
News
Others
Back to H252-Z10
