G4L3-ZX1- LAX1

To be released

HPC/AI Server - AMD EPYC™ 9005/9004 - 4U DP AMD Instinct™ MI300X 8-GPU DLC
  • Liquid-cooled 8 x AMD Instinct™ MI300X OAM GPUs
  • CPU+GPU direct liquid cooling solution with leak detection
  • Dual AMD EPYC™ 9005/9004 Series Processors
  • 12-Channel DDR5 RDIMM, 24 x DIMMs
  • Dual ROM Architecture
  • 2 x 10Gb/s LAN ports via Intel® X710-AT2
  • 2 x M.2 slots with PCIe Gen3 x4 and x1 interface
  • 8 x 2.5" Gen5 NVMe hot-swap bays
  • 4 x FHHL dual-slot PCIe Gen5 x16 slots
  • 8 x FHHL single-slot PCIe Gen5 x16 slots
  • 4+4 3000W 80 PLUS Titanium redundant power supplies
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SPECIFICATIONS

Dimensions (WxHxD, mm)
4U
447 x 175.3 x 900
Motherboard
MZB3-PE0
CPU
AMD EPYC™ 9005 Series Processors
AMD EPYC™ 9004 Series Processors

Dual processor, cTDP up to 500W [1]

[1] The ambient temperature is limited to 30°C when NVIDIA BlueField®-3 DPUs are installed.

[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 6096
Socket SP5
Chipset
System on Chip
Memory
24 x DIMM slots
DDR5 memory supported
12-Channel memory architecture

AMD EPYC™ 9005:
RDIMM: Up to 6000 MT/s

AMD EPYC™ 9004:
RDIMM: Up to 4800 MT/s
LAN
Front (I/O board - CFPG540):
2 x 10Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN

[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
Video
Integrated in Aspeed® AST2600
- 1 x VGA port
Storage
Front hot-swap:
8 x 2.5" Gen5 NVMe
- (NVMe from PEX89104)

Internal M.2:
1 x M.2 (2280/22110), PCIe Gen3 x4, from CPU_1
1 x M.2 (2280/22110), PCIe Gen3 x1, from CPU_0
SAS
N/A
RAID
Require RAID add-in cards
Modular GPU
Liquid-cooled 8 x AMD Instinct™ MI300X OAM GPUs
PCIe Expansion Slots
PCIe Bridge Board - CBG76:
- 8 x FHHL x16 (Gen5 x16), from PEX89104

PCIe Bridge Board - CPBG045 x 2:
- 4 x FHHL x16 (Gen5 x16), from PEX89048
Front I/O
I/O board - CFPG540:
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
Rear I/O
MLAN board - CDB66:
1 x MLAN port
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
Power Supply
4+4 3000W 80 PLUS Titanium redundant power supplies [1]

AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 14A

DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A

[1] The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
Motherboard:
2 x 60x60x56mm
2 x 60x60x76mm

PCIe slots:
4 x 80x80x56mm (15,500rpm)

GPU tray:
4 x 60x60x38mm (24,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.
Packaging Content
1 x G4L3-ZX1-LAX1
1 x CPU cold plate loop
1 x L-shape Rail kit
* Les informations ici proposées le sont pour référence uniquement. GIGABYTE se réserve le droit de modifier ce contenu à tout moment et sans préavis.
*Les performances affichées sont basées sur les informations proposées par les constructeurs de chipsets ou sociétés définissant les caractéristiques des interfaces. Performances pouvant varier selon configuration.
* Marques et logos appartiennent aux détenteurs respectifs de leurs droits.
* L'architecture de grand nombre de PC affectera directement la capacité mémoire, en effet, une certaine quantité de RAM sera affectée au système, la quantité totale affichée pourra alors varier de celle insérée sur votre carte mère

SUPPORT

Warning:
Because BIOS flashing is potentially risky, if you do not encounter problems using the current version of BIOS, it is recommended that you not flash the BIOS. To flash the BIOS, do it with caution. Inadequate BIOS flashing may result in system malfunction.

What is a BETA?
BETA describes a new version that is reliable yet may not include all the features of the final product. During this phase we are previewing new features and gathering customer input to insure our product provides the best experience possible.

Update CPU ID/Micro codes in new BIOS means?
[1] To support new series of CPUs, or [2] To support the same CPU but with new stepping. CPU support of motherboard is consist of BIOS and hardware design, detail CPU support information please see CPU support list.
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