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G363-SR0- LAX4
HPC/AI Server - 5th/4th Gen Intel® Xeon® Scalable - 3U DP HGX™ H200 4-GPU DLC
- Liquid-cooled NVIDIA HGX™ H200 4-GPU
- CPU+GPU direct liquid cooling solution
- 4th-generation NVIDIA® NVLink™ 900GB/s
- Dual 5th/4th Gen Intel® Xeon® Scalable Processors
- Dual Intel® Xeon® CPU Max Series
- 8-Channel DDR5 RDIMM, 16 x DIMMs
- Dual ROM Architecture
- 2 x 10Gb/s LAN ports via Broadcom® BCM57416
- 2 x 1Gb/s LAN ports via Intel® I350-AM2
- 8 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays
- 1 x M.2 slot with PCIe Gen4 x4 interface
- 6 x LP PCIe Gen5 x16 slots
- 2+1 3000W 80 PLUS Titanium redundant power supplies
* Les informations ici proposées le sont pour référence uniquement. GIGABYTE se réserve le droit de modifier ce contenu à tout moment et sans préavis.
* Marques et logos appartiennent aux détenteurs respectifs de leurs droits.
* L'architecture de grand nombre de PC affectera directement la capacité mémoire, en effet, une certaine quantité de RAM sera affectée au système, la quantité totale affichée pourra alors varier de celle insérée sur votre carte mère
* Marques et logos appartiennent aux détenteurs respectifs de leurs droits.
* L'architecture de grand nombre de PC affectera directement la capacité mémoire, en effet, une certaine quantité de RAM sera affectée au système, la quantité totale affichée pourra alors varier de celle insérée sur votre carte mère
SPECIFICATIONS
Dimensions (WxHxD, mm)
3U
448 x 130 x 800
448 x 130 x 800
Motherboard
MS63-HD2
CPU
5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor, TDP up to 385W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor, TDP up to 385W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 4677
Socket E
Socket E
Chipset
Intel® C741
Memory
16 x DIMM slots
DDR5 memory supported
8-Channel memory per processor
5th Gen Intel® Xeon®:
RDIMM: Up to 5600 MT/s
4th Gen Intel® Xeon®:
RDIMM: Up to 4800 MT/s
Intel® Xeon® Max Series:
RDIMM: Up to 4800 MT/s
DDR5 memory supported
8-Channel memory per processor
5th Gen Intel® Xeon®:
RDIMM: Up to 5600 MT/s
4th Gen Intel® Xeon®:
RDIMM: Up to 4800 MT/s
Intel® Xeon® Max Series:
RDIMM: Up to 4800 MT/s
LAN
Front (I/O board - CLBH160):
2 x 1Gb/s LAN (1 x Intel® I350-AM2)
- Support NCSI function (by switch setting)
1 x 10/100/1000 Mbps Management LAN
Rear:
2 x 10Gb/s LAN (1 x Broadcom® BCM57416)
- Support NCSI function (by switch setting)
Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN
[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
2 x 1Gb/s LAN (1 x Intel® I350-AM2)
- Support NCSI function (by switch setting)
1 x 10/100/1000 Mbps Management LAN
Rear:
2 x 10Gb/s LAN (1 x Broadcom® BCM57416)
- Support NCSI function (by switch setting)
Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN
[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
Video
Integrated in Aspeed® AST2600
- 1 x Mini-DP
- 1 x Mini-DP
Storage
Front hot-swap:
8 x 2.5" Gen5 NVMe/SATA/SAS-4 [1]
- (NVMe from PEX89144)
Internal M.2 (CMTP192):
1 x M.2 (2280/22110), PCIe Gen4 x4, from CPU_0
[1] SAS card is required to support SAS drives.
8 x 2.5" Gen5 NVMe/SATA/SAS-4 [1]
- (NVMe from PEX89144)
Internal M.2 (CMTP192):
1 x M.2 (2280/22110), PCIe Gen4 x4, from CPU_0
[1] SAS card is required to support SAS drives.
SAS
Require SAS add-in cards
RAID
Intel® SATA RAID 0/1/10/5
Support optional RAID add-in cards
Support optional RAID add-in cards
Modular GPU
Liquid-cooled NVIDIA HGX™ H200 with 4 x SXM GPUs
PCIe Expansion Slots
Front:
Riser Card CRSH01R:
- 1 x LP x16 (Gen5 x16), from CPU_0
PCIe Cable:
- 1 x LP x16 (Gen5 x16), from CPU_1
1 x OCP NIC 3.0, from CPU_0, disabled
Rear:
4 x LP x16 (Gen5 x16), from PEX89144, support RDMA
- (Equipped with full-height brackets)
Riser Card CRSH01R:
- 1 x LP x16 (Gen5 x16), from CPU_0
PCIe Cable:
- 1 x LP x16 (Gen5 x16), from CPU_1
1 x OCP NIC 3.0, from CPU_0, disabled
Rear:
4 x LP x16 (Gen5 x16), from PEX89144, support RDMA
- (Equipped with full-height brackets)
Front I/O
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x Storage activity LED
1 x System status LED
I/O board - CLBH160:
2 x USB 3.2 Gen1 ports (Type-A)
1 x Mini-DP
2 x RJ45 ports (Intel I350)
1 x MLAN port (default)
1 x ID button with LED
1 x Reset button
1 x Storage activity LED
1 x System status LED
I/O board - CLBH160:
2 x USB 3.2 Gen1 ports (Type-A)
1 x Mini-DP
2 x RJ45 ports (Intel I350)
1 x MLAN port (default)
Rear I/O
2 x RJ45 ports (Broadcom BCM57416)
MLAN board - CDB66:
1 x MLAN port
MLAN board - CDB66:
1 x MLAN port
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
- Optional TPM2.0 kit: CTM010
Power Supply
2+1 3000W 80 PLUS Titanium redundant power supplies [1]
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
Additional certifications:
Windows Server 2022
Additional certifications:
Windows Server 2022
System Fans
4 x 80x80x80mm (17,000rpm)
Operating Properties
Operating temperature: 10°C to 40°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.
Packaging Dimensions
1176 x 782 x 295 mm
Packaging Content
1 x G363-SR0-LAX4
1 x Mini-DP to D-Sub cable
6 x Carriers
1 x L-shape Rail kit
1 x Mini-DP to D-Sub cable
6 x Carriers
1 x L-shape Rail kit
Part Numbers
- Barebone w/ NVIDIA module: 6NG363SR0DR000LBX4*
- Motherboard: 9MS63HD2UR-000*
- L-shape Rail kit: 25HB2-A86102-K0R
- CoolIT CPU cold plate loop: 25ST7-100006-C4R
- CoolIT GPU cold plate loop: 25ST7-3000Z5-C4R
- Front panel board - CFP1000: 9CFP1000NR-00*
- Backplane board - CBP2081: 9CBP2081NR-00*
- Fan module: 25ST2-888030-S1R
- Fan module: 25ST2-888031-S1R
- M.2 expansion card - CMTP192: 9CMTP192NR-00*
- Riser card - CRSH01R: 9CRSH01RNR-00*
- OCP card - CNVC171: 9CNVC171NR-00*
- Front I/O board (incl. I350-AM2) - CLBH160: 9CLBH160NR-00*
- PCIe switch board: - CPBG901 9CPBG901NR-00*
- Rear MLAN board - CDB66: 9CDB66NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000A-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- RMA packaging: 6NG363SR0SR-RMA-L100
- Motherboard: 9MS63HD2UR-000*
- L-shape Rail kit: 25HB2-A86102-K0R
- CoolIT CPU cold plate loop: 25ST7-100006-C4R
- CoolIT GPU cold plate loop: 25ST7-3000Z5-C4R
- Front panel board - CFP1000: 9CFP1000NR-00*
- Backplane board - CBP2081: 9CBP2081NR-00*
- Fan module: 25ST2-888030-S1R
- Fan module: 25ST2-888031-S1R
- M.2 expansion card - CMTP192: 9CMTP192NR-00*
- Riser card - CRSH01R: 9CRSH01RNR-00*
- OCP card - CNVC171: 9CNVC171NR-00*
- Front I/O board (incl. I350-AM2) - CLBH160: 9CLBH160NR-00*
- PCIe switch board: - CPBG901 9CPBG901NR-00*
- Rear MLAN board - CDB66: 9CDB66NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000A-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- RMA packaging: 6NG363SR0SR-RMA-L100
* Les informations ici proposées le sont pour référence uniquement. GIGABYTE se réserve le droit de modifier ce contenu à tout moment et sans préavis.
*Les performances affichées sont basées sur les informations proposées par les constructeurs de chipsets ou sociétés définissant les caractéristiques des interfaces. Performances pouvant varier selon configuration.
* Marques et logos appartiennent aux détenteurs respectifs de leurs droits.
* L'architecture de grand nombre de PC affectera directement la capacité mémoire, en effet, une certaine quantité de RAM sera affectée au système, la quantité totale affichée pourra alors varier de celle insérée sur votre carte mère
*Les performances affichées sont basées sur les informations proposées par les constructeurs de chipsets ou sociétés définissant les caractéristiques des interfaces. Performances pouvant varier selon configuration.
* Marques et logos appartiennent aux détenteurs respectifs de leurs droits.
* L'architecture de grand nombre de PC affectera directement la capacité mémoire, en effet, une certaine quantité de RAM sera affectée au système, la quantité totale affichée pourra alors varier de celle insérée sur votre carte mère
SUPPORT
Driver
BIOS
Utilitaire
Firmware
OS
- All
- All
- Windows Server 2022
- Windows Server 2019
- Linux
Chipset
Chipset
Version
Taille
Date
Intel® Chipset Driver
Version : 10.1.19485.8386
3.81 MB
Jan 04, 2024
OS: Windows Server 2019,Windows Server 2022
LAN
RAID
RAID
Version
Taille
Date
Intel® VROC
Intel® SATA RAID and Utility
Intel® SATA RAID and Utility
Version : 8.5.0.1593
99.21 MB
Jan 04, 2024
OS: Windows Server 2019,Windows Server 2022
Utility
BIOS
Description
Version
Taille
Date
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
Because BIOS flashing is potentially risky, if you do not encounter problems using the current version of BIOS, it is recommended that you not flash the BIOS. To flash the BIOS, do it with caution. Inadequate BIOS flashing may result in system malfunction.
What is a BETA?
BETA describes a new version that is reliable yet may not include all the features of the final product. During this phase we are previewing new features and gathering customer input to insure our product provides the best experience possible.
Update CPU ID/Micro codes in new BIOS means?
[1] To support new series of CPUs, or [2] To support the same CPU but with new stepping. CPU support of motherboard is consist of BIOS and hardware design, detail CPU support information please see CPU support list.
Because BIOS flashing is potentially risky, if you do not encounter problems using the current version of BIOS, it is recommended that you not flash the BIOS. To flash the BIOS, do it with caution. Inadequate BIOS flashing may result in system malfunction.
What is a BETA?
BETA describes a new version that is reliable yet may not include all the features of the final product. During this phase we are previewing new features and gathering customer input to insure our product provides the best experience possible.
Update CPU ID/Micro codes in new BIOS means?
[1] To support new series of CPUs, or [2] To support the same CPU but with new stepping. CPU support of motherboard is consist of BIOS and hardware design, detail CPU support information please see CPU support list.
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
Utilitaire
Description
Version
Taille
Date
GSM CLI
Version : 2.1.78
147.79 MB
Dec 12, 2024
OS: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
OS: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
OS: Linux,Windows Server 2016 64bit,Windows Server 2019
Mode d'emploi
Description
Version
Taille
Date
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
11.72 MB
Aug 12, 2024
Anglais
Description
Version
Taille
Date
Liste Compatibilité OS
Version : R12
0.22 MB
Jul 15, 2024
4th Generation Intel® Xeon® Scalable Processors
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
RESOURCES
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