G4L3-SD1-LAX3

To be released

HPC/AI Server - 5th/4th Gen Intel® Xeon® Scalable - 4U DP HGX™ H200 8-GPU DLC
  • CPU+GPU Direct liquid cooling solution
  • Liquid-cooled NVIDIA HGX™ H200 8-GPU
  • 900GB/s GPU-to-GPU bandwidth with NVLink® and NVSwitch™
  • Dual 5th/4th Gen Intel® Xeon® Scalable Processors
  • Dual Intel® Xeon® CPU Max Series
  • 8-Channel DDR5 RDIMM, 32 x DIMMs
  • Dual ROM Architecture
  • Compatible with NVIDIA BlueField®-3 DPUs and ConnectX®-7 NICs
  • 2 x 10Gb/s LAN ports via Intel® X710-AT2
  • 8 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays
  • 12 x FHHL PCIe Gen5 x16 slots
  • 4+4 3000W 80 PLUS Titanium redundant power supplies
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SPECIFICATIONS

Dimensions (WxHxD, mm)
4U
447 x 175.3 x 900
Motherboard
MSB3-PE0
CPU
5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series

Dual processor, TDP up to 385W

[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 4677
Socket E
Chipset
Intel® C741
Memory
32 x DIMM slots
DDR5 memory supported
8-Channel memory architecture

5th Gen Intel® Xeon®:
RDIMM: Up to 5600 MT/s (1DPC), 4400 MT/s (2DPC) [1]

4th Gen Intel® Xeon®:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)

Intel® Xeon® Max Series:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)

[1] 5600 MT/s support under 2DPC configuration requires verified memory and BIOS setup. Please refer to the QVL for more information.
LAN
Front (I/O board - CFPG540):
2 x 10Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN

[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
Video
Integrated in Aspeed® AST2600
- 1 x VGA port
Storage
Front hot-swap:
8 x 2.5" Gen5 NVMe/SATA/SAS-4 [1]
- (NVMe from PEX89104)

[1] SAS card is required to support SAS drives.
SAS
Require SAS add-in cards
RAID
Intel® SATA RAID 0/1/10/5

Support optional RAID add-in cards
Modular GPU
Liquid-cooled NVIDIA HGX™ H200 with 8 x SXM GPUs
PCIe Expansion Slots
Extension Board CBG76:
- 8 x FHHL x16 (Gen5 x16), from PEX89104

Extension Board CPBG045 x 2:
- 4 x FHHL x16 (Gen5 x16), from PEX89048
Front I/O
I/O board - CFPG540:
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
Backplane Board
MLAN board - CDB66:
1 x MLAN port
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
Power Supply
4+4 3000W 80 PLUS Titanium redundant power supplies [1]

AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 14A

DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A

[1] The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
Motherboard:
2 x 60x60x56mm
2 x 60x60x76mm

PCIe slots:
4 x 80x80x56mm (15,500rpm)

GPU tray:
4 x 60x60x38mm (24,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.
Packaging Content
1 x G4L3-SD1-LAX3
1 x CoolIT CPU cold plate loop
6 x Carriers
1 x L-shape Rail kit
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.

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